8,464 research outputs found
An AER handshake-less modular infrastructure PCB with x8 2.5Gbps LVDS serial links
Nowadays spike-based brain processing emulation is
taking off. Several EU and others worldwide projects are
demonstrating this, like SpiNNaker, BrainScaleS, FACETS, or
NeuroGrid. The larger the brain process emulation on silicon is,
the higher the communication performance of the hosting
platforms has to be. Many times the bottleneck of these system
implementations is not on the performance inside a chip or a
board, but in the communication between boards. This paper
describes a novel modular Address-Event-Representation (AER)
FPGA-based (Spartan6) infrastructure PCB (the AER-Node
board) with 2.5Gbps LVDS high speed serial links over SATA
cables that offers a peak performance of 32-bit 62.5Meps (Mega
events per second) on board-to-board communications. The
board allows back compatibility with parallel AER devices
supporting up to x2 28-bit parallel data with asynchronous
handshake. These boards also allow modular expansion
functionality through several daughter boards. The paper is
focused on describing in detail the LVDS serial interface and
presenting its performance.Ministerio de Ciencia e Innovación TEC2009-10639-C04-02/01Ministerio de Economía y Competitividad TEC2012-37868-C04-02/01Junta de Andalucía TIC-6091Ministerio de Economía y Competitividad PRI-PIMCHI-2011-076
Fiber Optic Tactical Local Network (FOTLAN)
A 100 Mbit/s FDDI (fiber distributed data interface) network interface unit is described that supports real-time data, voice and video. Its high-speed interrupt-driven hardware architecture efficiently manages stream and packet data transfer to the FDDI network. Other enhancements include modular single-mode laser-diode fiber optic links to maximize node spacing, optic bypass switches for increased fault tolerance, and a hardware performance monitor to gather real-time network diagnostics
Extensional viscosity of copper nanowire suspensions in an aqueous polymer solution
Suspensions of copper nanowires are emerging as new electronic inks for
next-generation flexible electronics. Using a novel surface acoustic wave
driven extensional flow technique we are able to perform currently lacking
analysis of these suspensions and their complex buffer. We observe extensional
viscosities from 3 mPas (1 mPas shear viscosity) to 37.2
Pas via changes in the suspension concentration, thus capturing low
viscosities that have been historically very challenging to measure. These
changes equate to an increase in the relative extensional viscosity of nearly
12,200 times at a volume fraction of just 0.027. We also find that interactions
between the wires and the necessary polymer additive affect the rheology
strongly. Polymer-induced elasticity shows a reduction as the buffer relaxation
time falls from 819 to 59 s above a critical particle concentration. The
results and technique presented here should aid in the future formulation of
these promising nanowire suspensions and their efficient application as inks
and coatings.Comment: 7 pages, 5 figures, under review for Soft Matter RS
Floorplan-Aware High Performance NoC Design
Las actuales arquitecturas de m�ltiples n�cleos como los chip multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) han adoptado a las redes dentro del chip (NoC) como elemento -ptimo para la inter-conexi-n de los diversos elementos de dichos sistemas. En este sentido, fabricantes de CMPs y MPSoCs han adoptado NoCs sencillas, generalmente con una topolog'a en malla o anillo, ya que son suficientes para satisfacer las necesidades de los sistemas actuales. Sin embargo a medida que los requerimientos del sistema -- baja latencia y alto rendimiento -- se hacen m�s exigentes, estas redes tan simples dejan de ser una soluci-n real. As', la comunidad investigadora ha propuesto y analizado NoCs m�s complejas. No obstante, estas soluciones son m�s dif'ciles de implementar -- especialmente los enlaces largos -- haciendo que este tipo de topolog'as complejas sean demasiado costosas o incluso inviables.
En esta tesis, presentamos una metodolog'a de dise-o que minimiza la p�rdida de prestaciones de la red debido a su implementaci-n real. Los principales problemas que se encuentran al implementar una NoC son los conmutadores y los enlaces largos. En esta tesis, el conmutador se ha hecho modular, es decir, formado como uni-n de m-dulos m�s peque-os. En nuestro caso, los m-dulos son id�nticos, donde cada m-dulo es capaz de arbitrar, conmutar, y almacenar los mensajes que le llegan. Posteriormente, flexibilizamos la colocaci-n de estos m-dulos en el chip, permitiendo que m-dulos de un mismo conmutador est�n distribuidos por el chip.
Esta metodolog'a de dise-o la hemos aplicado a diferentes escenarios. Primeramente, hemos introducido nuestro conmutador modular en NoCs con topolog'as conocidas como la malla 2D. Los resultados muestran como la modularidad y la distribuci-n del conmutador reducen la latencia y el consumo de potencia de la red.
En segundo lugar, hemos utilizado nuestra metodolog'a de dise-o para implementar un crossbar distribuidRoca Pérez, A. (2012). Floorplan-Aware High Performance NoC Design [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/17844Palanci
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