Statistical library characterization using belief propagation across multiple technology nodes

In this paper, we propose a novel flow to enable computationally efficient statistical characterization of delay and slew in standard cell libraries. The distinguishing feature of the proposed method is the usage of a limited combination of output capacitance, input slew rate and supply voltage for the extraction of statistical timing metrics of an individual logic gate. The efficiency of the proposed flow stems from the introduction of a novel, ultra-compact, nonlinear, analytical timing model, having only four universal regression parameters. This novel model facilitates the use of maximum-a-posteriori belief propagation to learn the prior parameter distribution for the parameters of the target technology from past characterizations of library cells belonging to various other technologies, including older ones. The framework then utilises Bayesian inference to extract the new timing model parameters using an ultra-small set of additional timing measurements from the target technology. The proposed method is validated and benchmarked on several production-level cell libraries including a state-of-the-art 14-nm technology node and a variation-aware, compact transistor model. For the same accuracy as the conventional lookup-table approach, this new method achieves at least 15x reduction in simulation runs.Masdar Institute of Science and Technology (Massachusetts Institute of Technology Cooperative Agreement

A Review of Bayesian Methods in Electronic Design Automation

The utilization of Bayesian methods has been widely acknowledged as a viable solution for tackling various challenges in electronic integrated circuit (IC) design under stochastic process variation, including circuit performance modeling, yield/failure rate estimation, and circuit optimization. As the post-Moore era brings about new technologies (such as silicon photonics and quantum circuits), many of the associated issues there are similar to those encountered in electronic IC design and can be addressed using Bayesian methods. Motivated by this observation, we present a comprehensive review of Bayesian methods in electronic design automation (EDA). By doing so, we hope to equip researchers and designers with the ability to apply Bayesian methods in solving stochastic problems in electronic circuits and beyond.Comment: 24 pages, a draft version. We welcome comments and feedback, which can be sent to [email protected]

Calculation of Generalized Polynomial-Chaos Basis Functions and Gauss Quadrature Rules in Hierarchical Uncertainty Quantification

Stochastic spectral methods are efficient techniques for uncertainty quantification. Recently they have shown excellent performance in the statistical analysis of integrated circuits. In stochastic spectral methods, one needs to determine a set of orthonormal polynomials and a proper numerical quadrature rule. The former are used as the basis functions in a generalized polynomial chaos expansion. The latter is used to compute the integrals involved in stochastic spectral methods. Obtaining such information requires knowing the density function of the random input {\it a-priori}. However, individual system components are often described by surrogate models rather than density functions. In order to apply stochastic spectral methods in hierarchical uncertainty quantification, we first propose to construct physically consistent closed-form density functions by two monotone interpolation schemes. Then, by exploiting the special forms of the obtained density functions, we determine the generalized polynomial-chaos basis functions and the Gauss quadrature rules that are required by a stochastic spectral simulator. The effectiveness of our proposed algorithm is verified by both synthetic and practical circuit examples.Comment: Published by IEEE Trans CAD in May 201

Tensor Computation: A New Framework for High-Dimensional Problems in EDA

Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Unsupervised Terminological Ontology Learning based on Hierarchical Topic Modeling

In this paper, we present hierarchical relationbased latent Dirichlet allocation (hrLDA), a data-driven hierarchical topic model for extracting terminological ontologies from a large number of heterogeneous documents. In contrast to traditional topic models, hrLDA relies on noun phrases instead of unigrams, considers syntax and document structures, and enriches topic hierarchies with topic relations. Through a series of experiments, we demonstrate the superiority of hrLDA over existing topic models, especially for building hierarchies. Furthermore, we illustrate the robustness of hrLDA in the settings of noisy data sets, which are likely to occur in many practical scenarios. Our ontology evaluation results show that ontologies extracted from hrLDA are very competitive with the ontologies created by domain experts