Stochastic Yield Analysis of Rare Failure Events in High-Dimensional Variation Space

As semiconductor industry kept shrinking the feature size to nanometer scale, circuit reliability has become an area of growing concern due to the uncertainty introduced by process variations. For highly-replicated standard cells, the failure event for each individual component must be extremely rare in order to maintain sufficiently high yield rate. Existing yield analysis approaches works fine at low dimension, but less effective either when there are a large amount of circuit parameters, or when the failure samples are distributed in multiple regions. In this thesis, four novel high sigma analysis approaches have been proposed. First, we propose an adaptive importance sampling (AIS) algorithm. AIS has several iterations of sampling region adjustments, while existing methods pre-decide a static sampling distribution. At each iteration, AIS generates samples from current proposed distribution. Next, AIS carefully assigns weight to each sample based on its tilted occurrence probability between failure region and current failure region distribution. Then we design two adaptive frameworks based on Resampling and population Metropolis-Hastings (MH) to iteratively search for failure regions. Second, we develop an Adaptive Clustering and Sampling (ACS) method to estimate the failure rate of high-dimensional and multi-failure-region circuit cases. The basic idea of the algorithm is to cluster failure samples and build global sampling distribution at each iteration. Specifically, in clustering step, we propose a multi-cone clustering method, which partitions the parametric space and clusters failure samples. Then global sampling distribution is constructed from a set of weighted Gaussian distributions. Next, we calculate importance weight for each sample based on the discrepancy between sampling distribution and target distribution. Failure probability is updated at the end of each iteration. This clustering and sampling procedure proceeds iteratively until all the failure regions are covered.Moreover, two meta-model based approaches are proposed for high sigma analysis. The Low-Rank Tensor Approximation (LRTA) formulate the meta-model in tensor space by representing a multi-way tensor into a finite sum of rank-one tensor. The polynomial degree of our LRTA model grows linearly with circuit dimension, which makes it especially promising for high-dimensional circuit problems. Then we solve our LRTA model efficiently with a robust greedy algorithm, and calibrate iteratively with an adaptive sampling method. The meta-model based importance sampling (MIS) method utilizes Gaussian Process meta-model to construct quasi-optimal importance sampling distribution, and performs Markov Chain Monte Carlo (MCMC) simulation to generate new samples from the proposed distribution. By updating our global Importance Sampling estimator in an iterated framework, MIS leads to better efficiency and higher accuracy than traditional importance sampling methods. Experiment results validate that the proposed approaches are 3 orders faster than Monte Carlo, and more accurate than both academia solutions such as importance sampling and classification based methods, and industrial solutions such as mixture IS used by Intel

A Review of Bayesian Methods in Electronic Design Automation

The utilization of Bayesian methods has been widely acknowledged as a viable solution for tackling various challenges in electronic integrated circuit (IC) design under stochastic process variation, including circuit performance modeling, yield/failure rate estimation, and circuit optimization. As the post-Moore era brings about new technologies (such as silicon photonics and quantum circuits), many of the associated issues there are similar to those encountered in electronic IC design and can be addressed using Bayesian methods. Motivated by this observation, we present a comprehensive review of Bayesian methods in electronic design automation (EDA). By doing so, we hope to equip researchers and designers with the ability to apply Bayesian methods in solving stochastic problems in electronic circuits and beyond.Comment: 24 pages, a draft version. We welcome comments and feedback, which can be sent to [email protected]

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Intelligent Computing: The Latest Advances, Challenges and Future

Computing is a critical driving force in the development of human civilization. In recent years, we have witnessed the emergence of intelligent computing, a new computing paradigm that is reshaping traditional computing and promoting digital revolution in the era of big data, artificial intelligence and internet-of-things with new computing theories, architectures, methods, systems, and applications. Intelligent computing has greatly broadened the scope of computing, extending it from traditional computing on data to increasingly diverse computing paradigms such as perceptual intelligence, cognitive intelligence, autonomous intelligence, and human-computer fusion intelligence. Intelligence and computing have undergone paths of different evolution and development for a long time but have become increasingly intertwined in recent years: intelligent computing is not only intelligence-oriented but also intelligence-driven. Such cross-fertilization has prompted the emergence and rapid advancement of intelligent computing. Intelligent computing is still in its infancy and an abundance of innovations in the theories, systems, and applications of intelligent computing are expected to occur soon. We present the first comprehensive survey of literature on intelligent computing, covering its theory fundamentals, the technological fusion of intelligence and computing, important applications, challenges, and future perspectives. We believe that this survey is highly timely and will provide a comprehensive reference and cast valuable insights into intelligent computing for academic and industrial researchers and practitioners

Intrinsic Hardware Evolution on the Transistor Level

This thesis presents a novel approach to the automated synthesis of analog circuits. Evolutionary algorithms are used in conjunction with a fitness evaluation on a dedicated ASIC that serves as the analog substrate for the newly bred candidate solutions. The advantage of evaluating the candidate circuits directly in hardware is twofold. First, it may speed up the evolutionary algorithms, because hardware tests can usually be performed faster than simulations. Second, the evolved circuits are guaranteed to work on a real piece of silicon. The proposed approach is realized as a hardware evolution system consisting of an IBM compatible general purpose computer that hosts the evolutionary algorithm, an FPGA-based mixed signal test board, and the analog substrate. The latter one is designed as a Field Programmable Transistor Array (FPTA) whose programmable transistor cells can be almost freely connected. The transistor cells can be configured to adopt one out of 75 different channel geometries. The chip was produced in a 0.6µm CMOS process and provides ample means for the input and output of analog signals. The configuration is stored in SRAM cells embedded in the programmable transistor cells. The hardware evolution system is used for numerous evolution experiments targeted at a wide variety of different circuit functionalities. These comprise logic gates, Gaussian function circuits, D/A converters, low- and highpass filters, tone discriminators, and comparators. The experimental results are thoroughly analyzed and discussed with respect to related work

Intelligent computing : the latest advances, challenges and future

Computing is a critical driving force in the development of human civilization. In recent years, we have witnessed the emergence of intelligent computing, a new computing paradigm that is reshaping traditional computing and promoting digital revolution in the era of big data, artificial intelligence and internet-of-things with new computing theories, architectures, methods, systems, and applications. Intelligent computing has greatly broadened the scope of computing, extending it from traditional computing on data to increasingly diverse computing paradigms such as perceptual intelligence, cognitive intelligence, autonomous intelligence, and human computer fusion intelligence. Intelligence and computing have undergone paths of different evolution and development for a long time but have become increasingly intertwined in recent years: intelligent computing is not only intelligence-oriented but also intelligence-driven. Such cross-fertilization has prompted the emergence and rapid advancement of intelligent computing

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems