573 research outputs found

    Compressed Passive Macromodeling

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    This paper presents an approach for the extraction of passive macromodels of large-scale interconnects from their frequency-domain scattering responses. Here, large scale is intended both in terms of number of electrical ports and required dynamic model order. For such structures, standard approaches based on rational approximation via vector fitting and passivity enforcement via model perturbation may fail because of excessive computational requirements, both in terms of memory size and runtime. Our approach addresses this complexity by first reducing the redundancy in the raw scattering responses through a projection and approximation process based on a truncated singular value decomposition. Then we formulate a compressed rational fitting and passivity enforcement framework which is able to obtain speedup factors up to 2 and 3 orders of magnitude with respect to standard approaches, with full control over the approximation errors. Numerical results on a large set of benchmark cases demonstrate the effectiveness of the proposed techniqu

    High-Performance Computing for the Electromagnetic Modeling and Simulation of Interconnects

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    The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In recent years, packaging has become a critical area in the design of high-speed communication systems and fast computers, and the importance of the software support for their development has increased accordingly. Throughout this project, our efforts have focused on the development of modeling and simulation techniques and algorithms that permit the fast computation of the electrical parameters of interconnects and the efficient simulation of their electrical performance

    Delay Extraction based Macromodeling with Parallel Processing for Efficient Simulation of High Speed Distributed Networks

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    This thesis attempts to address the computational demands of accurate modeling of high speed distributed networks such as interconnect networks and power distribution networks. In order to do so, two different approaches towards modeling of high speed distributed networks are considered. One approach deals with cases where the physical characteristics of the network are not known and the network is characterized by its frequency domain tabulated data. Such examples include long interconnect networks described by their Y parameter data. For this class of problems, a novel delay extraction based IFFT algorithm has been developed for accurate transient response simulation. The other modeling approach is based on a detailed knowledge of the physical and electrical characteristics of the network and assuming a quasi transverse mode of propagation of the electromagnetic wave through the network. Such problems may include two dimensional (2D) and three dimensional (3D) power distribution networks with known geometry and materials. For this class of problem, a delay extraction based macromodeling approaches is proposed which has been found to be able to capture the distributed effects of the network resulting in more compact and accurate simulation compared to the state-of-the-art quasi-static lumped models. Furthermore, waveform relaxation based algorithms for parallel simulations of large interconnect networks and 2D power distribution networks is also presented. A key contribution of this body of work is the identification of naturally parallelizable and convergent iterative techniques that can divide the computational costs of solving such large macromodels over a multi-core hardware

    Transient simulation of complex electronic circuits and systems operating at ultra high frequencies

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    The electronics industry worldwide faces increasingly difficult challenges in a bid to produce ultra-fast, reliable and inexpensive electronic devices. Electronic manufacturers rely on the Electronic Design Automation (EDA) industry to produce consistent Computer A id e d Design (CAD) simulation tools that w ill enable the design of new high-performance integrated circuits (IC), the key component of a modem electronic device. However, the continuing trend towards increasing operational frequencies and shrinking device sizes raises the question of the capability of existing circuit simulators to accurately and efficiently estimate circuit behaviour. The principle objective of this thesis is to advance the state-of-art in the transient simulation of complex electronic circuits and systems operating at ultra high frequencies. Given a set of excitations and initial conditions, the research problem involves the determination of the transient response o f a high-frequency complex electronic system consisting of linear (interconnects) and non-linear (discrete elements) parts with greatly improved efficien cy compared to existing methods and with the potential for very high accuracy in a way that permits an effective trade-off between accuracy and computational complexity. High-frequency interconnect effects are a major cause of the signal degradation encountered b y a signal propagating through linear interconnect networks in the modem IC. Therefore, the development of an interconnect model that can accurately and efficiently take into account frequency-dependent parameters of modem non-uniform interconnect is of paramount importance for state-of-art circuit simulators. Analytical models and models based on a set of tabulated data are investigated in this thesis. Two novel, h igh ly accurate and efficient interconnect simulation techniques are developed. These techniques combine model order reduction methods with either an analytical resonant model or an interconnect model generated from frequency-dependent sparameters derived from measurements or rigorous full-wave simulation. The latter part o f the thesis is concerned with envelope simulation. The complex mixture of profoundly different analog/digital parts in a modern IC gives rise to multitime signals, where a fast changing signal arising from the digital section is modulated by a slower-changing envelope signal related to the analog part. A transient analysis of such a circuit is in general very time-consuming. Therefore, specialised methods that take into account the multi-time nature o f the signal are required. To address this issue, a novel envelope simulation technique is developed. This technique combines a wavelet-based collocation method with a multi-time approach to result in a novel simulation technique that enables the desired trade-off between the required accuracy and computational efficiency in a simple and intuitive way. Furthermore, this new technique has the potential to greatly reduce the overall design cycle

    ELECTROMAGNETIC MODELING WITH A NEW 3D ALTERNATING-DIRECTION-IMPLICIT (ADI) MAXWELL EQUATION SOLVER

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    We introduce a time-domain method to simulate the digital signal propagation along on-chip interconnects, aperture radiation, and indoor-communication by solving the Maxwell equation with the Alternating-Direction-Implicit (ADI) method. With this method, we are able to resolve the large scale (i.e. electromagnetic wave propagation) and fine scale (i.e. metal skin depth, substrate current, coating material) structure in the same simulation, and the simulation time step is not limited by the Courant condition. The simulations allow us to calculate in detail parasitic current flow inside the substrate; propagation losses, skin-depth and dispersion of digital signals on non-ideal interconnects; detailed surface current and standing wave pattern in aperture radiation problem; signal power map and propagation delay in complicated in-door communication scenario

    Design and Implementation of High Speed Bi-directional Transceiver for Low Power Applications

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    In this paper, a new bi-directional transceiver has been proposed for high speed signaling. The new proposed transceiver architecture has two modes of operation namely, the transmitter and the receiver. Transceiver on either side supports two way communications via same link. Since high transimpedance gain over a large bandwidth in the receiving mode, the signaling current can be reduced to a very low value. The proposed circuit is designed in 90nm technology with the supply voltage of 1.8V
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