Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature Review

Since the last century, the exponential growth of the semiconductor industry has led to the creation of tiny and complex integrated circuits, e.g., sensors, actuators, and smart power. Innovative techniques are needed to ensure the correct functionality of analog devices that are ubiquitous in every smart system. The ISO 26262 standard for functional safety in the automotive context specifies that fault injection is necessary to validate all electronic devices. For decades, standardization of defect modeling and injection mainly focused on digital circuits and, in a minor part, on analog ones. An initial attempt is being made with the IEEE P2427 draft standard that started to give a structured and formal organization to the analog testing field. Various methods have been proposed in the literature to speed up the fault simulation of the defect universe for an analog circuit. A more limited number of papers seek to reduce the overall simulation time by reducing the number of defects to be simulated. This literature survey describes the state-of-the-art of analog defect injection and fault simulation methods. The survey is based on the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodological flow, allowing for a systematic and complete literature survey. Each selected paper has been categorized and presented to provide an overview of all the available approaches. In addition, the limitations of the various approaches are discussed by showing possible future directions

Custom Integrated Circuits

Contains reports on nine research projects.Analog Devices, Inc.International Business Machines CorporationJoint Services Electronics Program Contract DAAL03-89-C-0001U.S. Air Force - Office of Scientific Research Contract AFOSR 86-0164BDuPont CorporationNational Science Foundation Grant MIP 88-14612U.S. Navy - Office of Naval Research Contract N00014-87-K-0825American Telephone and TelegraphDigital Equipment CorporationNational Science Foundation Grant MIP 88-5876

Custom Integrated Circuits

Contains reports on ten research projects.Analog Devices, Inc.IBM CorporationNational Science Foundation/Defense Advanced Research Projects Agency Grant MIP 88-14612Analog Devices Career Development Assistant ProfessorshipU.S. Navy - Office of Naval Research Contract N0014-87-K-0825AT&TDigital Equipment CorporationNational Science Foundation Grant MIP 88-5876

Tensor Computation: A New Framework for High-Dimensional Problems in EDA

Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System

Custom Integrated Circuits

Contains reports on twelve research projects.Analog Devices, Inc.International Business Machines, Inc.Joint Services Electronics Program (Contract DAAL03-86-K-0002)Joint Services Electronics Program (Contract DAAL03-89-C-0001)U.S. Air Force - Office of Scientific Research (Grant AFOSR 86-0164)Rockwell International CorporationOKI Semiconductor, Inc.U.S. Navy - Office of Naval Research (Contract N00014-81-K-0742)Charles Stark Draper LaboratoryNational Science Foundation (Grant MIP 84-07285)National Science Foundation (Grant MIP 87-14969)Battelle LaboratoriesNational Science Foundation (Grant MIP 88-14612)DuPont CorporationDefense Advanced Research Projects Agency/U.S. Navy - Office of Naval Research (Contract N00014-87-K-0825)American Telephone and TelegraphDigital Equipment CorporationNational Science Foundation (Grant MIP-88-58764

Analog and Mixed Signal Verification using Satisfiability Solver on Discretized Models

With increasing demand of performance constraints and the ever reducing size of the IC chips, analog and mixed-signal designs have become indispensable and increasingly complex in modern CMOS technologies. This has resulted in the rise of stochastic behavior in circuits, making it important to detect all the corner cases and verify the correct functionality of the design under all circumstances during the earlier stages of the design process. It can be achieved by functional or formal verification methods, which are still widely unexplored for Analog and Mixed-Signal (AMS) designs. Design Verification is a process to validate the performance of the system in accordance with desired specifications. Functional verification relies on simulating different combinations of inputs for maximum state space coverage. With the exponential increase in the complexity of circuits, traditional functional verification techniques are getting more and more inadequate in terms of exhaustiveness of the solution. Formal verification attempts to provide a mathematical proof for the correctness of the design regardless of the circumstances. Thus, it is possible to get 100% coverage using formal verification. However, it requires advanced mathematics knowledge and thus is not feasible for all applications. In this thesis, we present a technique for analog and mixed-signal verification targeting DC verification using Berkeley Short-channel Igfet Models (BSIM) for approximation. The verification problem is first defined using the state space equations for the given circuit and applying Satisfiability Modulo Theories (SMT) solver to determine a region that encloses complete DC equilibrium of the circuit. The technique is applied to an example circuit and the results are analyzed in turns of runtime effectiveness

Guaranteed passive parameterized model order reduction of the partial element equivalent circuit (PEEC) method

The decrease of IC feature size and the increase of operating frequencies require 3-D electromagnetic methods, such as the partial element equivalent circuit (PEEC) method, for the analysis and design of high-speed circuits. Very large systems of equations are often produced by 3-D electromagnetic methods. During the circuit synthesis of large-scale digital or analog applications, it is important to predict the response of the system under study as a function of design parameters, such as geometrical and substrate features, in addition to frequency (or time). Parameterized model order reduction (PMOR) methods become necessary to reduce large systems of equations with respect to frequency and other design parameters. We propose an innovative PMOR technique applicable to PEEC analysis, which combines traditional passivity-preserving model order reduction methods and positive interpolation schemes. It is able to provide parametric reduced-order models, stable, and passive by construction over a user-defined range of design parameter values. Numerical examples validate the proposed approach

Qucs modelling and simulation of analog/RF devices and circuits (Chapter 6)

Trends in compact device modeling and analog circuit simulation point towards a growing interest among the modeling community in the standardization of Verilog-A as an equation based modeling language for compact semiconductor device model and circuit macromodel development. . This chapter introduces the principles of compact device modeling with equation-defined devices and VerilogA models. For completeness circuit macromodel principles and construction are also included. It also describes the use of the different types of equation based models in analog and RF circuit simulation. Throughout the text the properties of a range of analog and RF circuits with different levels of complexity are introduced and their performance investigated with the “Quite universal circuit simulator” (Qucs) and its related software package QucsStudio. All the device and circuit modeling techniques introduced in this chapter form part of the standard features implemented in Qucs and QucsStudio

34th Midwest Symposium on Circuits and Systems-Final Program

Organized by the Naval Postgraduate School Monterey California. Cosponsored by the IEEE Circuits and Systems Society. Symposium Organizing Committee: General Chairman-Sherif Michael, Technical Program-Roberto Cristi, Publications-Michael Soderstrand, Special Sessions- Charles W. Therrien, Publicity: Jeffrey Burl, Finance: Ralph Hippenstiel, and Local Arrangements: Barbara Cristi

Quiescent current testing of CMOS data converters

Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed