10,164 research outputs found
Automating defects simulation and fault modeling for SRAMs
The continues improvement in manufacturing process density for very deep sub micron technologies constantly leads to new classes of defects in memory devices. Exploring the effect of fabrication defects in future technologies, and identifying new classes of realistic functional fault models with their corresponding test sequences, is a time consuming task up to now mainly performed by hand. This paper proposes a new approach to automate this procedure. The proposed method exploits the capabilities of evolutionary algorithms to automatically identify faulty behaviors into defective memories and to define the corresponding fault models and relevant test sequences. Target defects are modeled at the electrical level in order to optimize the results to the specific technology and memory architecture
Transition Faults and Transition Path Delay Faults: Test Generation, Path Selection, and Built-In Generation of Functional Broadside Tests
As the clock frequency and complexity of digital integrated circuits increase rapidly, delay testing is indispensable to guarantee the correct timing behavior of the circuits. In this dissertation, we describe methods developed for three aspects of delay testing in scan-based circuits: test generation, path selection and built-in test generation.
We first describe a deterministic broadside test generation procedure for a path delay fault model named the transition path delay fault model, which captures both large and small delay defects. Under this fault model, a path delay fault is detected only if all the individual transition faults along the path are detected by the same test. To reduce the complexity of test generation, sub-procedures with low complexity are applied before a complete branch-and-bound procedure. Next, we describe a method based on static timing analysis to select critical paths for test generation. Logic conditions that are necessary for detecting a path delay fault are considered to refine the accuracy of static timing analysis, using input necessary assignments. Input necessary assignments are input values that must be assigned to detect a fault. The method calculates more accurate path delays, selects paths that are critical during test application, and identifies undetectable path delay faults. These two methods are applicable to off-line test generation. For large circuits with high complexity and frequency, built-in test generation is a cost-effective method for delay testing. For a circuit that is embedded in a larger design, we developed a method for built-in generation of functional broadside tests to avoid excessive power dissipation during test application and the overtesting of delay faults, taking the functional constraints on the primary input sequences of the circuit into consideration. Functional broadside tests are scan-based two-pattern tests for delay faults that create functional operation conditions during test application. To avoid the potential fault coverage loss due to the exclusive use of functional broadside tests, we also developed an optional DFT method based on state holding to improve fault coverage. High delay fault coverage can be achieved by the developed method for benchmark circuits using simple hardware
Design-for-delay-testability techniques for high-speed digital circuits
The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud
getting more and more important
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Improving timing verification and delay testing methodologies for IC designs
textThe task of ensuring the correct temporal behavior of IC designs,
both before and after fabrication, is extremely important. It is becoming
even more imperative as the demand for performance increases and process
technology advances into the deep sub-micron region.
This dissertation tackles the key issues in the timing verification
and delay testing methodologies. An efficient methodology is presented to
identify false timing paths in the timing verification methodology which utilizes
ATPG technique and timing information from an ordered list of timing
paths according to the delay information. This dissertation also presents a
speed binning methodology which utilizes structural delay tests successfully
instead of functional tests. In addition, it establishes a methodology which
quantifies the correlation between the timing verification prediction and
actual silicon measurement of timing paths. This quantification methodology
lays the foundation for further research to study the impact of deep
submicron effects on design performanceElectrical and Computer Engineerin
Acceleration of Seed Ordering and Selection For High Quality VLSI Delay Test
Seed ordering and selection is a key technique to provide high-test quality with limited resources in Built-In Self Test (BIST) environment. We present a hard-to-detect delay fault selection method to optimize the computation time in seed ordering and selection processes. This selection method can be used to select faults for test generation when it is impractical to target all delay faults resulting large test pattern count and long Computation time. Three types of selection categories are considered, ranged in the number of seeds it produced, which is useful when we consider computing resources, such as memory and storage. We also evaluate the impact of the selection method in mixed-mode BIST when seed are expanded to more patterns, and evaluate the statistical delay quality level (SDQL) with the original work. Experimental results show that our proposed method can significantly reduce computation time while slightly sacrificing test quality
Innovative Techniques for Testing and Diagnosing SoCs
We rely upon the continued functioning of many electronic devices for our everyday welfare,
usually embedding integrated circuits that are becoming even cheaper and smaller
with improved features. Nowadays, microelectronics can integrate a working computer
with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC).
SoCs are also employed on automotive safety-critical applications, but need to be tested
thoroughly to comply with reliability standards, in particular the ISO26262 functional
safety for road vehicles.
The goal of this PhD. thesis is to improve SoC reliability by proposing innovative
techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals,
and GPUs. The proposed approaches in the sequence appearing in this thesis are described
as follows:
1. Embedded Memory Diagnosis: Memories are dense and complex circuits which
are susceptible to design and manufacturing errors. Hence, it is important to understand
the fault occurrence in the memory array. In practice, the logical and physical
array representation differs due to an optimized design which adds enhancements to
the device, namely scrambling. This part proposes an accurate memory diagnosis
by showing the efforts of a software tool able to analyze test results, unscramble
the memory array, map failing syndromes to cell locations, elaborate cumulative
analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing
syndromes were analyzed as case studies gathered on an industrial automotive
32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually,
and results were confirmed by real photos taken from a microscope.
2. Functional Test Pattern Generation: The key for a successful test is the pattern applied
to the device. They can be structural or functional; the former usually benefits
from embedded test modules targeting manufacturing errors and is only effective
before shipping the component to the client. The latter, on the other hand, can be
applied during mission minimally impacting on performance but is penalized due
to high generation time. However, functional test patterns may benefit for having
different goals in functional mission mode. Part III of this PhD thesis proposes
three different functional test pattern generation methods for CPU cores embedded
in SoCs, targeting different test purposes, described as follows:
a. Functional Stress Patterns: Are suitable for optimizing functional stress during
I
Operational-life Tests and Burn-in Screening for an optimal device reliability
characterization
b. Functional Power Hungry Patterns: Are suitable for determining functional
peak power for strictly limiting the power of structural patterns during manufacturing
tests, thus reducing premature device over-kill while delivering high test
coverage
c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns
with functional ones, allowing its execution periodically during mission.
In addition, an external hardware communicating with a devised SBST was proposed.
It helps increasing in 3% the fault coverage by testing critical Hardly
Functionally Testable Faults not covered by conventional SBST patterns.
An automatic functional test pattern generation exploiting an evolutionary algorithm
maximizing metrics related to stress, power, and fault coverage was employed
in the above-mentioned approaches to quickly generate the desired patterns. The
approaches were evaluated on two industrial cases developed by STMicroelectronics;
8051-based and a 32-bit Power Architecture SoCs. Results show that generation
time was reduced upto 75% in comparison to older methodologies while
increasing significantly the desired metrics.
3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices
are suitable for generating structural patterns, testing and activating mitigation techniques,
and validating robust hardware and software applications. GPGPUs are
known for fast parallel computation used in high performance computing and advanced
driver assistance where reliability is the key point. Moreover, GPGPU manufacturers
do not provide design description code due to content secrecy. Therefore,
commercial fault injectors using the GPGPU model is unfeasible, making radiation
tests the only resource available, but are costly. In the last part of this thesis, we
propose a software implemented fault injector able to inject bit-flip in memory elements
of a real GPGPU. It exploits a software debugger tool and combines the
C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in
program variables. The goal is to validate robust parallel algorithms by studying
fault propagation or activating redundancy mechanisms they possibly embed. The
effectiveness of the tool was evaluated on two robust applications: redundant parallel
matrix multiplication and floating point Fast Fourier Transform
Algorithms for Power Aware Testing of Nanometer Digital ICs
At-speed testing of deep-submicron digital very large scale integrated (VLSI) circuits
has become mandatory to catch small delay defects. Now, due to continuous shrinking
of complementary metal oxide semiconductor (CMOS) transistor feature size, power
density grows geometrically with technology scaling. Additionally, power dissipation
inside a digital circuit during the testing phase (for test vectors under all fault models
(Potluri, 2015)) is several times higher than its power dissipation during the normal
functional phase of operation. Due to this, the currents that flow in the power grid during
the testing phase, are much higher than what the power grid is designed for (the
functional phase of operation). As a result, during at-speed testing, the supply grid
experiences unacceptable supply IR-drop, ultimately leading to delay failures during
at-speed testing. Since these failures are specific to testing and do not occur during
functional phase of operation of the chip, these failures are usually referred to false
failures, and they reduce the yield of the chip, which is undesirable.
In nanometer regime, process parameter variations has become a major problem.
Due to the variation in signalling delays caused by these variations, it is important to
perform at-speed testing even for stuck faults, to reduce the test escapes (McCluskey
and Tseng, 2000; Vorisek et al., 2004). In this context, the problem of excessive peak
power dissipation causing false failures, that was addressed previously in the context of
at-speed transition fault testing (Saxena et al., 2003; Devanathan et al., 2007a,b,c), also
becomes prominent in the context of at-speed testing of stuck faults (Maxwell et al.,
1996; McCluskey and Tseng, 2000; Vorisek et al., 2004; Prabhu and Abraham, 2012;
Potluri, 2015; Potluri et al., 2015). It is well known that excessive supply IR-drop during
at-speed testing can be kept under control by minimizing switching activity during
testing (Saxena et al., 2003). There is a rich collection of techniques proposed in the past
for reduction of peak switching activity during at-speed testing of transition/delay faults
ii
in both combinational and sequential circuits. As far as at-speed testing of stuck faults
are concerned, while there were some techniques proposed in the past for combinational
circuits (Girard et al., 1998; Dabholkar et al., 1998), there are no techniques concerning
the same for sequential circuits. This thesis addresses this open problem. We
propose algorithms for minimization of peak switching activity during at-speed testing
of stuck faults in sequential digital circuits under the combinational state preservation
scan (CSP-scan) architecture (Potluri, 2015; Potluri et al., 2015). First, we show that,
under this CSP-scan architecture, when the test set is completely specified, the peak
switching activity during testing can be minimized by solving the Bottleneck Traveling
Salesman Problem (BTSP). This mapping of peak test switching activity minimization
problem to BTSP is novel, and proposed for the first time in the literature.
Usually, as circuit size increases, the percentage of don’t cares in the test set increases.
As a result, test vector ordering for any arbitrary filling of don’t care bits
is insufficient for producing effective reduction in switching activity during testing of
large circuits. Since don’t cares dominate the test sets for larger circuits, don’t care
filling plays a crucial role in reducing switching activity during testing. Taking this
into consideration, we propose an algorithm, XStat, which is capable of performing test
vector ordering while preserving don’t care bits in the test vectors, following which, the
don’t cares are filled in an intelligent fashion for minimizing input switching activity,
which effectively minimizes switching activity inside the circuit (Girard et al., 1998).
Through empirical validation on benchmark circuits, we show that XStat minimizes
peak switching activity significantly, during testing.
Although XStat is a very powerful heuristic for minimizing peak input-switchingactivity,
it will not guarantee optimality. To address this issue, we propose an algorithm
that uses Dynamic Programming to calculate the lower bound for a given sequence
of test vectors, and subsequently uses a greedy strategy for filling don’t cares in this
sequence to achieve this lower bound, thereby guaranteeing optimality. This algorithm,
which we refer to as DP-fill in this thesis, provides the globally optimal solution for
minimizing peak input-switching-activity and also is the best known in the literature
for minimizing peak input-switching-activity during testing. The proof of optimality of
DP-fill in minimizing peak input-switching-activity is also provided in this thesis
Optimizing Test Pattern Generation Using Top-Off ATPG Methodology for Stuck–AT, Transition and Small Delay Defect Faults
The ever increasing complexity and size of digital circuits complemented by Deep Sub Micron (DSM) technology trends today pose challenges to the efficient Design For Test (DFT) methodologies. Innovation is required not only in designing the digital circuits, but also in automatic test pattern generation (ATPG) to ensure that the pattern set screens all the targeted faults while still complying with the Automatic Test Equipment (ATE) memory constraints.
DSM technology trends push the requirements of ATPG to not only include the conventional static defects but also to include test patterns for dynamic defects. The current industry practices consider test pattern generation for transition faults to screen dynamic defects. It has been observed that just screening for transition faults alone is not sufficient in light of the continuing DSM technology trends. Shrinking technology nodes have pushed DFT engineers to include Small Delay Defect (SDD) test patterns in the production flow. The current industry standard ATPG tools are evolving and SDD ATPG is not the most economical option in terms of both test generation CPU time and pattern volume. New techniques must be explored in order to ensure that a quality test pattern set can be generated which includes patterns for stuck-at, transition and SDD faults, all the while ensuring that the pattern volume remains economical.
This thesis explores the use of a “Top-Off” ATPG methodology to generate an optimal test pattern set which can effectively screen the required fault models while containing the pattern volume within a reasonable limit
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Testing for delay defects utilizing test data compression techniques
textAs technology shrinks new types of defects are being discovered and new fault models are being created for those defects. Transition delay and path delay fault models are two such models that have been created, but they still fall short in that they are unable to obtain a high test coverage of smaller delay defects; these defects can cause functional behavior to fail and also indicate potential reliability issues. The first part of this dissertation addresses these problems by presenting an enhanced timing-based delay fault testing technique that incorporates the use of standard delay ATPG, along with timing information gathered from standard static timing analysis. Utilizing delay fault patterns typically increases the test data volume by 3-5X when compared to stuck-at patterns. Combined with the increase in test data volume associated with the increase in gate count that typically accompanies the miniaturization of technology, this adds up to a very large increase in test data volume that directly affect test time and thus the manufacturing cost. The second part of this dissertation presents a technique for improving test compression and reducing test data volume by using multiple expansion ratios while determining the configuration of the scan chains for each of the expansion ratios using a dependency analysis procedure that accounts for structural dependencies as well as free variable dependencies to improve the probability of detecting faults. Finally, this dissertation addresses the problem of unknown values (X’s) in the output response data corrupting the data and degrading the performance of the output response compactor and thus the overall amount of test compression. Four techniques are presented that focus on handling response data with large percentages of X’s. The first uses X-canceling MISR architecture that is based on deterministically observing scan cells, and the second is a hybrid approach that combines a simple X-masking scheme with the X-canceling MISR for further gains in test compression. The third and fourth techniques revolve around reiterative LFSR X-masking, which take advantage of LFSR-encoded masks that can be reused for multiple scan slices in novel ways.Electrical and Computer Engineerin
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Testability considerations for implementing an embedded memory subsystem
textThere are a number of testability considerations for VLSI design,
but test coverage, test time, accuracy of test patterns and
correctness of design information for DFD (Design for debug) are
the most important ones in design with embedded memories. The goal
of DFT (Design-for-Test) is to achieve zero defects. When it comes
to the memory subsystem in SOCs (system on chips), many flavors of
memory BIST (built-in self test) are able to get high test
coverage in a memory, but often, no proper attention is given to
the memory interface logic (shadow logic). Functional testing and
BIST are the most prevalent tests for this logic, but functional
testing is impractical for complicated SOC designs. As a result,
industry has widely used at-speed scan testing to detect delay
induced defects. Compared with functional testing, scan-based
testing for delay faults reduces overall pattern generation
complexity and cost by enhancing both controllability and
observability of flip-flops. However, without proper modeling of
memory, Xs are generated from memories. Also, when the design has
chip compression logic, the number of ATPG patterns is increased
significantly due to Xs from memories. In this dissertation, a
register based testing method and X prevention logic are presented
to tackle these problems.
An important design stage for scan based testing with memory
subsystems is the step to create a gate level model and verify
with this model. The flow needs to provide a robust ATPG netlist
model. Most industry standard CAD tools used to analyze fault
coverage and generate test vectors require gate level models.
However, custom embedded memories are typically designed using a
transistor-level flow, there is a need for an abstraction step to
generate the gate models, which must be equivalent to the actual
design (transistor level). The contribution of the research is a
framework to verify that the gate level representation of custom
designs is equivalent to the transistor-level design.
Compared to basic stuck-at fault testing, the number of patterns
for at-speed testing is much larger than for basic stuck-at fault
testing. So reducing test and data volume are important. In this
desertion, a new scan reordering method is introduced to reduce
test data with an optimal routing solution. With in depth
understanding of embedded memories and flows developed during the
study of custom memory DFT, a custom embedded memory Bit Mapping
method using a symbolic simulator is presented in the last chapter
to achieve high yield for memories.Electrical and Computer Engineerin
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