Effectiveness and scaling trends of leakage control techniques for sub-130nm CMOS technologies

This paper compares the effectiveness of different leakage control techniques in deep submicron (DSM) bulk CMOS technologies. Simulations show that the 3-5x increase in IOFF/µm per generation is offsetting the savings in switching energy obtained from technology scaling. We compare both the transistor IOFF reduction and ION degradation due to each technique for the 130nm-70nm technologies. Our results indicate that the effectiveness of leakage control techniques and the associated energy vs. delay tradeoffs depend on the ratio of switching to leakage energies for a given technology. We use our findings to design a 70nm low power word line driver scheme for a 256 entry, 64-bit register file (RF). As a result, the leakage (total) energy of the word line drivers is reduced by 3x(2.5x) and for the RF by up to 35%(25%) respectively

Enhancing Power Efficient Design Techniques in Deep Submicron Era

Excessive power dissipation has been one of the major bottlenecks for design and manufacture in the past couple of decades. Power efficient design has become more and more challenging when technology scales down to the deep submicron era that features the dominance of leakage, the manufacture variation, the on-chip temperature variation and higher reliability requirements, among others. Most of the computer aided design (CAD) tools and algorithms currently used in industry were developed in the pre deep submicron era and did not consider the new features explicitly and adequately. Recent research advances in deep submicron design, such as the mechanisms of leakage, the source and characterization of manufacture variation, the cause and models of on-chip temperature variation, provide us the opportunity to incorporate these important issues in power efficient design. We explore this opportunity in this dissertation by demonstrating that significant power reduction can be achieved with only minor modification to the existing CAD tools and algorithms. First, we consider peak current, which has become critical for circuit's reliability in deep submicron design. Traditional low power design techniques focus on the reduction of average power. We propose to reduce peak current while keeping the overhead on average power as small as possible. Second, dual Vt technique and gate sizing have been used simultaneously for leakage savings. However, this approach becomes less effective in deep submicron design. We propose to use the newly developed process-induced mechanical stress to enhance its performance. Finally, in deep submicron design, the impact of on-chip temperature variation on leakage and performance becomes more and more significant. We propose a temperature-aware dual Vt approach to alleviate hot spots and achieve further leakage reduction. We also consider this leakage-temperature dependency in the dynamic voltage scaling approach and discover that a commonly accepted result is incorrect for the current technology. We conduct extensive experiments with popular design benchmarks, using the latest industry CAD tools and design libraries. The results show that our proposed enhancements are promising in power saving and are practical to solve the low power design challenges in deep submicron era

Case Studies on Variation Tolerant and Low Power Design Using Planar Asymmetric Double Gate Transistor

In nanometer technologies, process variation control and low power have emerged as the first order design goal after high performance. Process variations cause high variability in performance and power consumption of an IC, which affects the overall yield. Short channel effects (SCEs) deteriorate the MOSFET performance and lead to higher leakage power. Double gate devices suppress SCEs and are potential candidates for replacing Bulk technology in nanometer nodes. Threshold voltage control in planar asymmetric double gate transistor (IGFET) using a fourth terminal provides an effective means of combating process variations and low power design. In this thesis, using various case studies, we analyzed the suitability of IGFET for variation control and low power design. We also performed an extensive comparison between IGFET and Bulk for reducing variability, improving yield and leakage power reduction using power gating. We also proposed a new circuit topology for IGFET, which on average shows 33.8 percent lower leakage and 34.9 percent lower area at the cost of 2.8 percent increase in total active mode power, for basic logic gates. Finally, we showed a technique for reducing leakage of minimum sized devices designed using new circuit topology for IGFET

Impact of Technology Scaling on Leakage Reduction Techniques

CMOS technology is scaling down to meet the performance, production cost, and power requirements of the microelectronics industry. The increase in the transistor leakage current is one of the most important negative side effects of technology scaling. Leakage affects not only the standby and active power consumption, but also the circuit reliability, since it is strongly correlated to the process variations. Leakage current influences circuit performance differently depending on: operating conditions (e.g., standby, active, burn in test), circuit family (e.g., logic or memory), and environmental conditions (e.g., temperature, supply voltage). Until the introduction of high-K gate dielectrics in the lower nanometer technology nodes, gate leakage will remain the dominant leakage component after subthreshold leakage. Since the way designers control subthreshold and gate leakage can change from one technology to another, it is crucial for them to be aware of the impact of the total leakage on the operation of circuits and the techniques that mitigate it. Consequently, techniques that reduce total leakage in circuits operating in the active mode at different temperature conditions are examined. Also, the implications of technology scaling on the choice of techniques to mitigate total leakage are investigated. This work resulted in guidelines for the design of low-leakage circuits in nanometer technologies. Logic gates in the 65nm, 45nm, and 32nm nodes are simulated and analyzed. The techniques that are adopted for comparison in this work affect both gate and subthreshold leakage, namely, stack forcing, pin reordering, reverse body biasing, and high threshold voltage transistors. Aside from leakage, our analysis also highlights the impact of these techniques on the circuit's performance and noise margins. The reverse body biasing scheme tends to be less effective as the technology scales since this scheme increases the band to band tunneling current. Employing high threshold voltage transistors seems to be one of the most effective techniques for reducing leakage with minor performance degradation. Pin reordering and natural stacks are techniques that do not affect the performance of the device, yet they reduce leakage. However, it is demonstrated that they are not as effective in all types of logic since the input values might switch only between the highly leaky states. Therefore, depending on the design requirements of the circuit, a combination, or hybrid of techniques which can result in better performance and leakage savings, is chosen. Power sensitive technology mapping tools can use the guidelines found as a result of the research in the low power design flow to meet the required maximum leakage current in a circuit. These guidelines are presented in general terms so that they can be adopted for any application and process technology

Addressing On-Chip Power Conversion and Dissipation Issues in Many-Core System-on-a-Chip based on Conventional Silicon and Emerging Nanotechnologies

Title from PDF of title page viewed August 27, 2018Dissertation advisor: Masud H ChowdhuryVitaIncludes bibliographical references (pages 158-163)Thesis (Ph.D.)--School of Computing and Engineering and Department of Physics and Astronomy. University of Missouri--Kansas City, 2017Integrated circuits (ICs) are moving towards system-on-a-chip (SOC) designs. SOC allows various small and large electronic systems to be implemented in a single chip. This approach enables the miniaturization of design blocks that leads to high density transistor integration, faster response time, and lower fabrication costs. To reap the benefits of SOC and uphold the miniaturization of transistors, innovative power delivery and power dissipation management schemes are paramount. This dissertation focuses on on-chip integration of power delivery systems and managing power dissipation to increase the lifetime of energy storage elements. We explore this problem from two different angels: On-chip voltage regulators and power gating techniques. On-chip voltage regulators reduce parasitic effects, and allow faster and efficient power delivery for microprocessors. Power gating techniques, on the other hand, reduce the power loss incurred by circuit blocks during standby mode. Power dissipation (Ptotal = Pstatic and Pdynamic) in a complementary metal-oxide semiconductor (CMOS) circuit comes from two sources: static and dynamic. A quadratic dependency on the dynamic switching power and a more than linear dependency on static power as a form of gate leakage (subthreshold current) exist. To reduce dynamic power loss, the supply power should be reduced. A significant reduction in power dissipation occurs when portions of a microprocessor operate at a lower voltage level. This reduction in supply voltage is achieved via voltage regulators or converters. Voltage regulators are used to provide a stable power supply to the microprocessor. The conventional off-chip switching voltage regulator contains a passive floating inductor, which is difficult to be implemented inside the chip due to excessive power dissipation and parasitic effects. Additionally, the inductor takes a very large chip area while hampering the scaling process. These limitations make passive inductor based on-chip regulator design very unattractive for SOC integration and multi-/many-core environments. To circumvent the challenges, three alternative techniques based on active circuit elements to replace the passive LC filter of the buck convertor are developed. The first inductorless on-chip switching voltage regulator architecture is based on a cascaded 2nd order multiple feedback (MFB) low-pass filter (LPF). This design has the ability to modulate to multiple voltage settings via pulse with modulation (PWM). The second approach is a supplementary design utilizing a hybrid low drop-out scheme to lower the output ripple of the switching regulator over a wider frequency range. The third design approach allows the integration of an entire power management system within a single chipset by combining a highly efficient switching regulator with an intermittently efficient linear regulator (area efficient), for robust and highly efficient on-chip regulation. The static power (Pstatic) or subthreshold leakage power (Pleak) increases with technology scaling. To mitigate static power dissipation, power gating techniques are implemented. Power gating is one of the popular methods to manage leakage power during standby periods in low-power high-speed IC design. It works by using transistor based switches to shut down part of the circuit block and put them in the idle mode. The efficiency of a power gating scheme involves minimum Ioff and high Ion for the sleep transistor. A conventional sleep transistor circuit design requires an additional header, footer, or both switches to turn off the logic block. This additional transistor causes signal delay and increases the chip area. We propose two innovative designs for next generation sleep transistor designs. For an above threshold operation, we present a sleep transistor design based on fully depleted silicon-on-insulator (FDSOI) device. For a subthreshold circuit operation, we implement a sleep transistor utilizing the newly developed silicon-on ferroelectric-insulator field effect transistor (SOFFET). In both of the designs, the ability to control the threshold voltage via bias voltage at the back gate makes both devices more flexible for sleep transistors design than a bulk MOSFET. The proposed approaches simplify the design complexity, reduce the chip area, eliminate the voltage drop by sleep transistor, and improve power dissipation. In addition, the design provides a dynamically controlled Vt for times when the circuit needs to be in a sleep or switching mode.Introduction -- Background and literature review -- Fully integrated on-chip switching voltage regulator -- Hybrid LDO voltage regulator based on cascaded second order multiple feedback loop -- Single and dual output two-stage on-chip power management system -- Sleep transistor design using double-gate FDSOI -- Subthreshold region sleep transistor design -- Conclusio

Methodology for Standby Leakage Power Reduction in Nanometer-Scale CMOS Circuits

In nanometer-scale CMOS technology, leakage power has become a major component of the total power dissipation due to the downscaling of threshold voltage and gate oxide thickness. The leakage power consumption has received even more attention by increasing demand for mobile devices. Since mobile devices spend a majority of their time in a standby mode, the leakage power savings in standby state is critical to extend battery lifetime. For this reason, low power has become a major factor in designing CMOS circuits. In this dissertation, we propose a novel transistor reordering methodology for leakage reduction. Unlike previous technique, the proposed method provides exact reordering rules for minimum leakage formation by considering all leakage components. Thus, this method formulates an optimized structure for leakage reduction even in complex CMOS logic gate, and can be used in combination with other leakage reduction techniques to achieve further improvement. We also propose a new standby leakage reduction methodology, leakage-aware body biasing, to overcome the shortcomings of a conventional Reverse Body Biasing (RBB) technique. The RBB technique has been used to reduce subthreshold leakage current. Therefore, this technique works well under subthreshold dominant region even though it has intrinsic structural drawbacks. However, such drawbacks cannot be overlooked anymore since gate leakage has become comparable to subthreshold leakage in nanometer-scale region. In addition, BTBT leakage also increases with technology scaling due to the higher doping concentration applied in each process technology. In these circumstances, the objective of leakage minimization is not a single leakage source but the overall leakage sources. The proposed leakage-aware body biasing technique, unlike conventional RBB technique, considers all major leakage sources to minimize the negative effects of existing body biasing approach. This can be achieved by intelligently applying body bias to appropriate CMOS network based on its status (on-/off-state) with the aid of a pin/transistor reordering technique

Miniaturized Transistors, Volume II

In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before