Software-Based Self-Test of Set-Associative Cache Memories

Embedded microprocessor cache memories suffer from limited observability and controllability creating problems during in-system tests. This paper presents a procedure to transform traditional march tests into software-based self-test programs for set-associative cache memories with LRU replacement. Among all the different cache blocks in a microprocessor, testing instruction caches represents a major challenge due to limitations in two areas: 1) test patterns which must be composed of valid instruction opcodes and 2) test result observability: the results can only be observed through the results of executed instructions. For these reasons, the proposed methodology will concentrate on the implementation of test programs for instruction caches. The main contribution of this work lies in the possibility of applying state-of-the-art memory test algorithms to embedded cache memories without introducing any hardware or performance overheads and guaranteeing the detection of typical faults arising in nanometer CMOS technologie

EDACs and test integration strategies for NAND flash memories

Mission-critical applications usually presents several critical issues: the required level of dependability of the whole mission always implies to address different and contrasting dimensions and to evaluate the tradeoffs among them. A mass-memory device is always needed in all mission-critical applications: NAND flash-memories could be used for this goal. Error Detection And Correction (EDAC) techniques are needed to improve dependability of flash-memory devices. However also testing strategies need to be explored in order to provide highly dependable systems. Integrating these two main aspects results in providing a fault-tolerant mass-memory device, but no systematic approach has so far been proposed to consider them as a whole. As a consequence a novel strategy integrating a particular code-based design environment with newly selected testing strategies is presented in this pape

Functional Testing Approaches for "BIFST-able" tlm_fifo

Evolution of Electronic System Level design methodologies, allows a wider use of Transaction-Level Modeling (TLM). TLM is a high-level approach to modeling digital systems that emphasizes on separating communications among modules from the details of functional units. This paper explores different functional testing approaches for the implementation of Built-in Functional Self Test facilities in the TLM primitive channel tlm_fifo. In particular, it focuses on three different test approaches based on a finite state machine model of tlm_fifo, functional fault models, and march tests respectivel

An On-line BIST RAM Architecture with Self Repair Capabilities

The emerging field of self-repair computing is expected to have a major impact on deployable systems for space missions and defense applications, where high reliability, availability, and serviceability are needed. In this context, RAM (random access memories) are among the most critical components. This paper proposes a built-in self-repair (BISR) approach for RAM cores. The proposed design, introducing minimal and technology-dependent overheads, can detect and repair a wide range of memory faults including: stuck-at, coupling, and address faults. The test and repair capabilities are used on-line, and are completely transparent to the external user, who can use the memory without any change in the memory-access protocol. Using a fault-injection environment that can emulate the occurrence of faults inside the module, the effectiveness of the proposed architecture in terms of both fault detection and repairing capability was verified. Memories of various sizes have been considered to evaluate the area-overhead introduced by this proposed architectur

Automating defects simulation and fault modeling for SRAMs

The continues improvement in manufacturing process density for very deep sub micron technologies constantly leads to new classes of defects in memory devices. Exploring the effect of fabrication defects in future technologies, and identifying new classes of realistic functional fault models with their corresponding test sequences, is a time consuming task up to now mainly performed by hand. This paper proposes a new approach to automate this procedure. The proposed method exploits the capabilities of evolutionary algorithms to automatically identify faulty behaviors into defective memories and to define the corresponding fault models and relevant test sequences. Target defects are modeled at the electrical level in order to optimize the results to the specific technology and memory architecture

On the functional test of the BTB logic in pipelined and superscalar processors

Electronic systems are increasingly used for safety-critical applications, where the effects of faults must be taken under control and hopefully avoided. For this purpose, test of manufactured devices is particularly important, both at the end of the production line and during the operational phase. This paper describes a method to test the logic implementing the Branch Prediction Unit in pipelined and superscalar processors when this follows the Branch Target Buffer (BTB) architecture; the proposed approach is functional, i.e., it is based on forcing the processor to execute a suitably devised test program and observing the produced results. Experimental results are provided on the DLX processor, showing that the method can achieve a high value of stuck-at fault coverage while also testing the memory in the BT

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

An effective distributed BIST architecture for RAMs

The present paper proposes a solution to the problem of testing a system containing many distributed memories of different sizes. The proposed solution relies in the development of a BIST architecture characterized by a single BIST processor, implemented as a microprogrammable machine and able to execute different test algorithms, a wrapper for each SRAM including standard memory BIST modules, and an interface block to manage the communications between the SRAM and the BIST processor. Both area overhead and routing costs are minimized, and a scan-based approach allows full diagnostic capabilities of the faults possibly detected in the memories under test