Low-Power, High-Speed Transceivers for Network-on-Chip Communication

Networks on chips (NoCs) are becoming popular as they provide a solution for the interconnection problems on large integrated circuits (ICs). But even in a NoC, link-power can become unacceptably high and data rates are limited when conventional data transceivers are used. In this paper, we present a low-power, high-speed source-synchronous link transceiver which enables a factor 3.3 reduction in link power together with an 80% increase in data-rate. A low-swing capacitive pre-emphasis transmitter in combination with a double-tail sense-amplifier enable speeds in excess of 9 Gb/s over a 2 mm twisted differential interconnect, while consuming only 130 fJ/transition without the need for an additional supply. Multiple transceivers can be connected back-to-back to create a source-synchronous transceiver-chain with a wave-pipelined clock, operating with 6sigma offset reliability at 5 Gb/s

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Ultra-Low-Power Superconductor Logic

We have developed a new superconducting digital technology, Reciprocal Quantum Logic, that uses AC power carried on a transmission line, which also serves as a clock. Using simple experiments we have demonstrated zero static power dissipation, thermally limited dynamic power dissipation, high clock stability, high operating margins and low BER. These features indicate that the technology is scalable to far more complex circuits at a significant level of integration. On the system level, Reciprocal Quantum Logic combines the high speed and low-power signal levels of Single-Flux- Quantum signals with the design methodology of CMOS, including low static power dissipation, low latency combinational logic, and efficient device count.Comment: 7 pages, 5 figure

Modeling of Thermally Aware Carbon Nanotube and Graphene Based Post CMOS VLSI Interconnect

This work studies various emerging reduced dimensional materials for very large-scale integration (VLSI) interconnects. The prime motivation of this work is to find an alternative to the existing Cu-based interconnect for post-CMOS technology nodes with an emphasis on thermal stability. Starting from the material modeling, this work includes material characterization, exploration of electronic properties, vibrational properties and to analyze performance as a VLSI interconnect. Using state of the art density functional theories (DFT) one-dimensional and two-dimensional materials were designed for exploring their electronic structures, transport properties and their circuit behaviors. Primarily carbon nanotube (CNT), graphene and graphene/copper based interconnects were studied in this work. Being reduced dimensional materials the charge carriers in CNT(1-D) and in graphene (2-D) are quantum mechanically confined as a result of this free electron approximation fails to explain their electronic properties. For same reason Drude theory of metals fails to explain electronic transport phenomena. In this work Landauer transport theories using non-equilibrium Green function (NEGF) formalism was used for carrier transport calculation. For phonon transport studies, phenomenological Fourier’s heat diffusion equation was used for longer interconnects. Semi-classical BTE and Landauer transport for phonons were used in cases of ballistic phonon transport regime. After obtaining self-consistent electronic and thermal transport coefficients, an equivalent circuit model is proposed to analyze interconnects’ electrical performances. For material studies, CNTs of different variants were analyzed and compared with existing copper based interconnects and were found to be auspicious contenders with integrational challenges. Although, Cu based interconnect is still outperforming other emerging materials in terms of the energy-delay product (1.72 fJ-ps), considering the electromigration resistance graphene Cu hybrid interconnect proposed in this dissertation performs better. Ten times more electromigration resistance is achievable with the cost of only 30% increase in energy-delay product. This unique property of this proposed interconnect also outperforms other studied alternative materials such as multiwalled CNT, single walled CNT and their bundles

What constitutes a nanoswitch? A Perspective

Progress in the last two decades has effectively integrated spintronics and nanomagnetics into a single field, creating a new class of spin-based devices that are now being used both to Read (R) information from magnets and to Write (W) information onto magnets. Many other new phenomena are being investigated for nano-electronic memory as described in Part II of this book. It seems natural to ask whether these advances in memory devices could also translate into a new class of logic devices. What makes logic devices different from memory is the need for one device to drive another and this calls for gain, directionality and input-output isolation as exemplified by the transistor. With this in mind we will try to present our perspective on how W and R devices in general, spintronic or otherwise, could be integrated into transistor-like switches that can be interconnected to build complex circuits without external amplifiers or clocks. We will argue that the most common switch used to implement digital logic based on complementary metal oxide semiconductor (CMOS) transistors can be viewed as an integrated W-R unit having an input-output asymmetry that give it gain and directionality. Such a viewpoint is not intended to provide any insight into the operation of CMOS switches, but rather as an aid to understanding how W and R units based on spins and magnets can be combined to build transistor-like switches. Next we will discuss the standard W and R units used for magnetic memory devices and present one way to integrate them into a single unit with the input electrically isolated from the output. But we argue that this integrated W-R unit would not provide the key property of gain. We will then show that the recently discovered giant spin Hall effect could be used to construct a W-R unit with gain and suggest other possibilities for spin switches with gain.Comment: 27 pages. To appear in Emerging Nanoelectronic Devices, Editors: An Chen, James Hutchby, Victor Zhirnov and George Bourianoff, John Wiley & Sons (to be published