450 research outputs found

    A method for characterization of single-event latchup technologies as a function of geometric variation

    Get PDF
    Complementary metal-oxide-semiconductor (CMOS) technology is the dominant integrated circuit (IC) technology in modern electronics systems. As CMOS comprises of p-channel and n-channel transistors, there are parasitic PNPN paths that act as cross-coupled bipolar transistors capable of creating low-impedance paths between the power supply rails known as the “latchup” state. Latchup is destructive and requires a power cycle to restore operation. Latchup can be stimulated by ionizing radiation such as a high-energy proton or heavy-ions from deep space, resulting in a significant vulnerability in CMOS space systems. The sensitivity of an IC to single-event latchup (SEL) depends on various process parameters as well as design geometry. This work presents a method for the characterization of the geometric effects of CMOS layout on SEL. The dominant geometric contributors to the overall SEL sensitivity include: (1) substrate contact-to-source spacing (PWNS), (2) well contact-to-source spacing (NWPS), and (3) source-to-source spacing (SS)

    Working group written presentation: Trapped radiation effects

    Get PDF
    The results of the Trapped Radiation Effects Panel for the Space Environmental Effects on Materials Workshop are presented. The needs of the space community for new data regarding effects of the space environment on materials, including electronics are listed. A series of questions asked of each of the panels at the workshop are addressed. Areas of research which should be pursued to satisfy the requirements for better knowledge of the environment and better understanding of the effects of the energetic charged particle environment on new materials and advanced electronics technology are suggested

    Shortcomings in ground testing, environment simulations, and performance predictions for space applications

    Get PDF
    This paper addresses the issues involved in radiation testing of devices and subsystems to obtain the data that are required to predict the performance and survivability of satellite systems for extended missions in space. The problems associated with space environmental simulations, or the lack thereof, in experiments intended to produce information to describe the degradation and behavior of parts and systems are discussed. Several types of radiation effects in semiconductor components are presented, as for example: ionization dose effects, heavy ion and proton induced Single Event Upsets (SEUs), and Single Event Transient Upsets (SETUs). Examples and illustrations of data relating to these ground testing issues are provided. The primary objective of this presentation is to alert the reader to the shortcomings, pitfalls, variabilities, and uncertainties in acquiring information to logically design electronic subsystems for use in satellites or space stations with long mission lifetimes, and to point out the weaknesses and deficiencies in the methods and procedures by which that information is obtained

    Radiation Characteristics of a 0.11 Micrometer Modified Commercial CMOS Process

    Get PDF
    We present radiation data, Total Ionizing Dose and Single Event Effects, on the LSI Logic 0.11 micron commercial process and two modified versions of this process. Modified versions include a buried layer to guarantee Single Event Latchup immunity

    An Improved SEL Test of the ADV212 Video Codec

    Get PDF
    Single-event effect (SEE) test data is presented on the Analog Devices ADV212. Focus is given to the test setup used to improve data quality and validate single-event latchup (SEL) protection circuitry

    Single event effects in 0.18 μm CMOS image sensors

    Get PDF
    CMOS image sensors are widely used on Earth and are becoming increasingly favourable for use in space. Advantages, such as low power consumption, and ever-improving imaging peformance make CMOS an attractive option. The ability to integrate camera functions on-chip, such as biasing and sequencing, simplifies designing with CMOS sensors and can improve system reliablity. One potential disadvantage to the use of CMOS is the possibility of single event effects, such as single event latchup (SEL), which can cause malfunctions or even permanent destruction of the sensor. These single event effects occur in the space environment due to the high levels of radiation incident on the sensor. This work investigates the ocurrence of SEL in CMOS image sensors subjected to heavy-ion irradiation. Three devices are investigated, two of which have triple-well doping implants. The resulting latchup cross-sections are presented. It is shown that using a deep p well on 18 μm epitaxial silicon increases the radiation hardness of the sensor against latchup. The linear energy transfer (LET) threshold for latchup is increased when using this configuration. Our findings suggest deep p wells can be used to increase the radiation tollerance of CMOS image sensors for use in future space missions

    Single Event Effects in 4T Pinned Photodiode Image Sensors

    Get PDF
    This paper describes how Single Event Effects (SEEs) produced by heavy ions disturb the operation of Pinned Photodiode (PPD) CMOS Image Sensors (CISs) in the frame of space and nuclear applications. Several CISs with 4T and 5T pinned photodiode pixels were exposed to ions with a broad Linear Energy Transfer range (3.3 to 67.7 MeV.cm²/mg). One sensor exhibited Single Event Latchups (SELs). Physical failure mechanism and latchup properties were investigated. SELs are caused by the level shifters of the addressing circuits, which create frame perturbations - following which, in some cases, parts of the addressing circuits need to be hardened. In the second part of the paper, the effects of anti-blooming capabilities on the Single Event Transient effects (SETs) are analyzed. SETs in pixels can be partially mitigated by anti-blooming through the transfer gate and/or a dedicated transistor. This work also shows that the number of pixels disturbed by SETs can be reduced by using appropriate anti-blooming techniques
    corecore