Digital Resource Commons: A Case Study in Collaborative Repository Development

Presented at the Cooperative Curation Symposium and Workshop, Wednesday, August 8, 2012 in the Clough Commons Auditorium, Georgia Tech Library.Cooperative Curation Symposium: Inter-institutional Approaches to Supporting Scholarly Communication - Case study 2: OhioLINKJohn Davison is the Assistant Director of Library Systems, Digital Resource Development at OhioLINK.The Ohio Library and Information Network is an organization of 90 Ohio college and university libraries working together to provide the 600,000 students, faculty and staff of Ohio's higher education community with access to research information and resources. OhioLINK and its member libraries provide access to more than 50 million books, electronic journals, audio, video and image materials. By sharing the experiences of the Digital Resource Commons, Davison will assist with determining the issues you need to consider when embarking on a project to host an Institutional Repository. Davison has been the Assistant Director of Library Systems, Digital Resource Development at OhioLINK for the last five years and during that time, they have taken a moribund project and turned it into a nationally recognized, award-winning repository

Void Formation Study of Flip Chip in Package Using No-Flow Underfill

©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.DOI: 10.1109/TEPM.2008.2002951The advanced flip chip in package (FCIP) process using no-flow underfill material for high I/O density and fine-pitch interconnect applications presents challenges for an assembly process that must achieve high electrical interconnect yield and high reliability performance. With respect to high reliability, the voids formed in the underfill between solder bumps or inside the solder bumps during the no-flow underfill assembly process of FCIP devices have been typically considered one of the critical concerns affecting assembly yield and reliability performance. In this paper, the plausible causes of underfill void formation in FCIP using no-flow underfill were investigated through systematic experimentation with different types of test vehicles. For instance, the effects of process conditions, material properties, and chemical reaction between the solder bumps and no-flow underfill materials on the void formation behaviors were investigated in advanced FCIP assemblies. In this investigation, the chemical reaction between solder and underfill during the solder wetting and underfill cure process has been found to be one of the most significant factors for void formation in high I/O and fine-pitch FCIP assembly using no-flow underfill materials

Focal Spot, Fall/Winter 1999

https://digitalcommons.wustl.edu/focal_spot_archives/1083/thumbnail.jp

Remote sensing training for Corps of Engineering personnel: The university training module concept

A concept to permit Corps of Engineers personnel to obtain and maintain an appropriate level of individual proficiency in the application of remote sensing to water resource management is described. Recommendations are made for specific training courses and include structure and staffing requirements, syllabi and methods of operation, supporting materials, and procedures for integrating information systems management into the University Training Modules

Focal Spot, Spring/Summer 1984

https://digitalcommons.wustl.edu/focal_spot_archives/1037/thumbnail.jp

New Hampshire University Research and Industry Plan: A Roadmap for Collaboration and Innovation

This University Research and Industry plan for New Hampshire is focused on accelerating innovation-led development in the state by partnering academia’s strengths with the state’s substantial base of existing and emerging advanced industries. These advanced industries are defined by their deep investment and connections to research and development and the high-quality jobs they generate across production, new product development and administrative positions involving skills in science, technology, engineering and math (STEM)

The arrival of MOOCs: Massive Open Online Courses

Summary: Internationally, a number of emerging technologies and associated developments are becoming available that could have far‐reaching effects on the delivery of tertiary education. One of these developments is Massive Open Online Courses (MOOCs). The opportunities MOOCs present include the ability for institutions to extend their brand and reach to large international audiences, experiment with innovative pedagogical approaches, an ability to offer niche provision at scale, and a potential reduction of costs. Its challenges and risks include that they are not widely recognised as formal qualifications, the absence of an established business model, and their pedagogical approaches. We have developed this paper as the start of a conversation between and among government agencies, institutions, employers and learners on the appropriate policy settings and ways to support the introduction of these emerging technologies in the delivery of tertiary education. This paper also supports the 2014 Innovations in Tertiary Education Delivery Summit, being held in Auckland on 5 and 6 June 2014, which looks at the future of tertiary education and the role of technology in it

Electronic Information in School Libraries

Microcomputers have progressed from toys to tools in managing school libraries. Equipment inventory, circulation, online catalogs, acquisitions, and serials management/check-in have all been affected. In addition, high technology has presented new possibilities for educating young people, and school librarians are faced with a role change as they rise to meet this challenge.published or submitted for publicatio