Cross-Layer Approaches for an Aging-Aware Design of Nanoscale Microprocessors

Thanks to aggressive scaling of transistor dimensions, computers have revolutionized our life. However, the increasing unreliability of devices fabricated in nanoscale technologies emerged as a major threat for the future success of computers. In particular, accelerated transistor aging is of great importance, as it reduces the lifetime of digital systems. This thesis addresses this challenge by proposing new methods to model, analyze and mitigate aging at microarchitecture-level and above

A Cross-level Verification Methodology for Digital IPs Augmented with Embedded Timing Monitors

Smart systems are characterized by the integration in a single device of multi-domain subsystems of different technological domains, namely, analog, digital, discrete and power devices, MEMS, and power sources. Such challenges, emerging from the heterogeneous nature of the whole system, combined with the traditional challenges of digital design, directly impact on performance and on propagation delay of digital components. This article proposes a design approach to enhance the RTL model of a given digital component for the integration in smart systems with the automatic insertion of delay sensors, which can detect and correct timing failures. The article then proposes a methodology to verify such added features at system level. The augmented model is abstracted to SystemC TLM, which is automatically injected with mutants (i.e., code mutations) to emulate delays and timing failures. The resulting TLM model is finally simulated to identify timing failures and to verify the correctness of the inserted delay monitors. Experimental results demonstrate the applicability of the proposed design and verification methodology, thanks to an efficient sensor-aware abstraction methodology, by applying the flow to three complex case studies

Understanding multidimensional verification: Where functional meets non-functional

Abstract Advancements in electronic systems' design have a notable impact on design verification technologies. The recent paradigms of Internet-of-Things (IoT) and Cyber-Physical Systems (CPS) assume devices immersed in physical environments, significantly constrained in resources and expected to provide levels of security, privacy, reliability, performance and low-power features. In recent years, numerous extra-functional aspects of electronic systems were brought to the front and imply verification of hardware design models in multidimensional space along with the functional concerns of the target system. However, different from the software domain such a holistic approach remains underdeveloped. The contributions of this paper are a taxonomy for multidimensional hardware verification aspects, a state-of-the-art survey of related research works and trends enabling the multidimensional verification concept. Further, an initial approach to perform multidimensional verification based on machine learning techniques is evaluated. The importance and challenge of performing multidimensional verification is illustrated by an example case study

Energy and Reliability in Future NOC Interconnected CMPS

In this dissertation, I explore energy and reliability in future NoC (Network-on-Chip) interconnected CMPs (chip multiprocessors) as they have become a first-order constraint in future CMP design. In the first part, we target the root cause of network energy consumption through techniques that reduce link and router-level switching activity. We specifically focus on memory subsystem traffic, as it comprises the bulk of NoC load in a CMP. By transmitting only the flits that contain words that we predicted would be useful using a novel spatial locality predictor, our scheme seeks to reduce network activity. We aim to further lower NoC energy consumption through microarchitectural mechanisms that inhibit datapath switching activity caused by unused words in individual flits. Using simulation-based performance studies and detailed energy models based on synthesized router designs and different link wire types, we show that (a) the pre- diction mechanism achieves very high accuracy, with an average rate of false-unused prediction of just 2.5%; (b) the combined NoC energy savings enabled by the predictor and microarchitectural support are 36% on average and up to 57% in the best case; and (c) there is no system performance penalty as a result of this technique. In the second part, we present a method for dynamic voltage/frequency scaling of networks-on-chip and last level caches in CMP designs, where the shared resources form a single voltage/frequency domain. We develop a new technique for monitoring and control and validate it by running PARSEC benchmarks through full system simulations. These techniques reduce energy-delay product by 46% compared to a state-of-the-art prior work. In the third part, we develop critical path models for HCI- and NBTI-induced wear assuming stress caused under realistic workload conditions, and apply them onto the interconnect microarchitecture. A key finding from this modeling is that, counter to prevailing wisdom, wearout in the CMP on-chip interconnect is correlated with a lack of load observed in the NoC routers, rather than high load. We then develop a novel wearout-decelerating scheme in which routers under low load have their wearout-sensitive components exercised without significantly impacting the router’s cycle time, pipeline depth, and area or power consumption. We subsequently show that the proposed design yields a 13.8∼65× increase in CMP lifetime

Degradation in FPGAs: Monitoring, Modeling and Mitigation

This dissertation targets the transistor aging degradation as well as the associated thermal challenges in FPGAs (since there is an exponential relation between aging and chip temperature). The main objectives are to perform experimentation, analysis and device-level model abstraction for modeling the degradation in FPGAs, then to monitor the FPGA to keep track of aging rates and ultimately to propose an aging-aware FPGA design flow to mitigate the aging

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work