Dynamics for Systems of Screw Dislocations

The goal of this paper is the analytical validation of a model of Cermelli and Gurtin for an evolution law for systems of screw dislocations under the assumption of antiplane shear. The motion of the dislocations is restricted to a discrete set of glide directions, which are properties of the material. The evolution law is given by a "maximal dissipation criterion", leading to a system of differential inclusions. Short time existence, uniqueness, cross-slip, and fine cross-slip of solutions are proved.Comment: 35 pages, 5 figure

Impact of Screw and Edge Dislocation on the Thermal Conductivity of Nanowires and Bulk GaN

We report on thermal transport properties of wurtzite GaN in the presence of dislocations, by using molecular dynamics simulations. A variety of isolated dislocations in a nanowire configuration were analyzed and found to reduce considerably the thermal conductivity while impacting its temperature dependence in a different manner. We demonstrate that isolated screw dislocations reduce the thermal conductivity by a factor of two, while the influence of edge dislocations is less pronounced. The relative reduction of thermal conductivity is correlated with the strain energy of each of the five studied types of dislocations and the nature of the bonds around the dislocation core. The temperature dependence of the thermal conductivity follows a physical law described by a T$^{-1}$ variation in combination with an exponent factor which depends on the material's nature, the type and the structural characteristics of the dislocation's core. Furthermore, the impact of the dislocations density on the thermal conductivity of bulk GaN is examined. The variation and even the absolute values of the total thermal conductivity as a function of the dislocation density is similar for both types of dislocations. The thermal conductivity tensors along the parallel and perpendicular directions to the dislocation lines are analyzed. The discrepancy of the anisotropy of the thermal conductivity grows in increasing the density of dislocations and it is more pronounced for the systems with edge dislocations

Dynamics of screw dislocations: a generalised minimising-movements scheme approach

The gradient flow structure of the model introduced in [CG99] for the dynamics of screw dislocations is investigated by means of a generalised minimising-movements scheme approach. The assumption of a finite number of available glide directions, together with the "maximal dissipation criterion" that governs the equations of motion, results into solving a differential inclusion rather than an ODE. This paper addresses how the model in [CG99] is connected to a time-discrete evolution scheme which explicitly confines dislocations to move each time step along a single glide direction. It is proved that the time-continuous model in [CG99] is the limit of these time-discrete minimising-movement schemes when the time step converges to 0. The study presented here is a first step towards a generalisation of the setting in [AGS08, Chap. 2 and 3] that allows for dissipations which cannot be described by a metric.Comment: 17 pages, 2 figures http://cvgmt.sns.it/paper/2781

A Multiscale Approach for Modeling Crystalline Solids

In this paper we present a modeling approach to bridge the atomistic with macroscopic scales in crystalline materials. The methodology combines identification and modeling of the controlling unit processes at microscopic level with the direct atomistic determination of fundamental material properties. These properties are computed using a many body Force Field derived from ab initio quantum-mechanical calculations. This approach is exercised to describe the mechanical response of high-purity Tantalum single crystals, including the effect of temperature and strain-rate on the hardening rate. The resulting atomistically informed model is found to capture salient features of the behavior of these crystals such as: the dependence of the initial yield point on temperature and strain rate; the presence of a marked stage I of easy glide, specially at low temperatures and high strain rates; the sharp onset of stage II hardening and its tendency to shift towards lower strains, and eventually disappear, as the temperature increases or the strain rate decreases; the parabolic stage II hardening at low strain rates or high temperatures; the stage II softening at high strain rates or low temperatures; the trend towards saturation at high strains; the temperature and strain-rate dependence of the saturation stress; and the orientation dependence of the hardening rate.Comment: 25 pages, 15 figures, LaTe

Void-induced cross slip of screw dislocations in fcc copper

Pinning interaction between a screw dislocation and a void in fcc copper is investigated by means of molecular dynamics simulation. A screw dislocation bows out to undergo depinning on the original glide plane at low temperatures, where the behavior of the depinning stress is consistent with that obtained by a continuum model. If the temperature is higher than 300 K, the motion of a screw dislocation is no longer restricted to a single glide plane due to cross slip on the void surface. Several depinning mechanisms that involve multiple glide planes are found. In particular, a depinning mechanism that produces an intrinsic prismatic loop is found. We show that these complex depinning mechanisms significantly increase the depinning stress