Impact of parameter variations on circuits and microarchitecture

Parameter variations, which are increasing along with advances in process technologies, affect both timing and power. Variability must be considered at both the circuit and microarchitectural design levels to keep pace with performance scaling and to keep power consumption within reasonable limits. This article presents an overview of the main sources of variability and surveys variation-tolerant circuit and microarchitectural approaches.Peer ReviewedPostprint (published version

Energy Aware Design and Analysis for Synchronous and Asynchronous Circuits

Power dissipation has become a major concern for IC designers. Various low power design techniques have been developed for synchronous circuits. Asynchronous circuits, however. have gained more interests recently due to their benefits in lower noise, easy timing control, etc. But few publications on energy reduction techniques for asynchronous logic are available. Power awareness indicates the ability of the system power to scale with changing conditions and quality requirements. Scalability is an important figure-of-merit since it allows the end user to implement operational policy. just like the user of mobile multimedia equipment needs to select between better quality and longer battery operation time. This dissertation discusses power/energy optimization and performs analysis on both synchronous and asynchronous logic. The major contributions of this dissertation include: 1 ) A 2-Dimensional Pipeline Gating technique for synchronous pipelined circuits to improve their power awareness has been proposed. This technique gates the corresponding clock lines connected to registers in both vertical direction (the data flow direction) and horizontal direction (registers within each pipeline stage) based on current input precision. 2) Two energy reduction techniques, Signal Bypassing & Insertion and Zero Insertion. have been developed for NCL circuits. Both techniques use Nulls to replace redundant Data 0\u27s based on current input precision in order to reduce the switching activity while Signal Bypassing & Insertion is for non-pipelined NCI, circuits and Zero Insertion is for pipelined counterparts. A dynamic active-bit detection scheme is also developed as an expansion. 3) Two energy estimation techniques, Equivalent Inverter Modeling based on Input Mapping in transistor-level and Switching Activity Modeling in gate-level, have been proposed. The former one is for CMOS gates with feedbacks and the latter one is for NCL circuits

A Reconfigurable Digital Multiplier and 4:2 Compressor Cells Design

With the continually growing use of portable computing devices and increasingly complex software applications, there is a constant push for low power high speed circuitry to support this technology. Because of the high usage and large complex circuitry required to carry out arithmetic operations used in applications such as digital signal processing, there has been a great focus on increasing the efficiency of computer arithmetic circuitry. A key player in the realm of computer arithmetic is the digital multiplier and because of its size and power consumption, it has moved to the forefront of today\u27s research. A digital reconfigurable multiplier architecture will be introduced. Regulated by a 2-bit control signal, the multiplier is capable of double and single precision multiplication, as well as fault tolerant and dual throughput single precision execution. The architecture proposed in this thesis is centered on a recursive multiplication algorithm, where a large multiplication is carried out using recursions of simpler submultiplier modules. Within each sub-multiplier module, instead of carry save adder arrays, 4:2 compressor rows are utilized for partial product reduction, which present greater efficiency, thus result in lower delay and power consumption of the whole multiplier. In addition, a study of various digital logic circuit styles are initially presented, and then three different designs of 4:2 compressor in Domino Logic are presented and simulation results confirm the property of proposed design in terms of delay, power consumption and operation frequenc

16-bit Digital Adder Design in 250nm and 64-bit Digital Comparator Design in 90nm CMOS Technologies

High speed, low power, and area efficient adders and comparators continue to play a key role in hardware implementation of digital signal processing applications. Adders based on Complimentary Pass Transistor Logic (CPL) are power and area efficient, but are slower compared to Square Root Carry Select (SQRT-CS) based adders. This thesis demonstrates a unique custom designed 16-bit adder in 250-nm CMOS technology to obtain fast and power/area efficient features by combining CPL and CS logic. Comparing the results obtained for proposed 16-bit Linear CPL/CS adder with the BEC (Binary Excess-1 Code) based low power SQRT-CS adder, the delay is reduced by approximately one thirds, power is reduced by 19.2%, and the number of transistors is reduced by 23.4%. Also, new tree-based 64-bit static and dynamic digital comparators are presented in this thesis to perform high speed and low power operations. This tree-based architecture combines a new approach of designing dynamic comparator using a low duty cycle clock to reduce the short circuit power consumption in pre-charge (or pre-discharge) mode. This work also introduces a new sizing strategy and load balancing techniques to improve self-pipelining tendency of a tree based design. A resource sharing technique is also integrated in both static and dynamic comparator designs. At 1.2V power supply in CMOS 90nm technology, worst path delay and worst power are 374ps and 822µW, respectively for low cost static design with 1244 (768+476) transistors in total. 768 transistors are used for resource sharing. The proposed full and partially dynamic designs show superior power efficiency compared to recent state of art designs. The worst power consumptions at 5GHz and 25% (50ps) duty cycle clock for the 64-bit full and partially dynamic comparator designs are 5.00mW and 2.78mW, respectively. 769 (320+449) transistors includes 320 transistors for resource sharing, and 1217 (768+449) includes 768 transistors for resource sharing for full and partial dynamic comparators, respectively

Implementation of arithmetic primitives using truly deep submicron technology (TDST)

The invention of the transistor in 1947 at Bell Laboratories revolutionised the electronics industry and created a powerful platform for emergence of new industries. The quest to increase the number of devices per chip over the last four decades has resulted in rapid transition from Small-Scale-Integration (SSI) and Large-Scale-lntegration (LSI), through to the Very-Large-Scale-Integration (VLSI) technologies, incorporating approximately 10 to 100 million devices per chip. The next phase in this evolution is the Ultra-Large-Scale-Integration (ULSI) aiming to realise new application domains currently not accessible to CMOS technology. Although technology is continuously evolving to produce smaller systems with minimised power dissipation, the IC industry is facing major challenges due to constraints on power density (W/cm2) and high dynamic (operating) and static (standby) power dissipation. Mobile multimedia communication and optical based technologies have rapidly become a significant area of research and development challenging a variety of technological fronts. The future emergence or 4G (4th Generation) wireless communications networks is further driving this development, requiring increasing levels of media rich content. The processing requirements for capture, conversion, compression, decompression, enhancement and display of higher quality multimedia, place heavy demands on current ULSI systems. This is also apparent for mobile applications and intelligent optical networks where silicon chip area and power dissipation become primary considerations. In addition to the requirements for very low power, compact size and real-time processing, the rapidly evolving nature of telecommunication networks means that flexible soft programmable systems capable of adaptation to support a number of different standards and/or roles become highly desirable. In order to fully realise the capabilities promised by the 4G and supporting intelligent networks, new enabling technologies arc needed to facilitate the next generation of personal communications devices. Most of the current solutions to meet these challenges are based on various implementations of conventional architectures. For decades, silicon has been the main platform of computing, however it is slow, bulky, runs too hot, and is too expensive. Thus, new approaches to architectures, driving multimedia and future telecommunications systems, are needed in order to extend the life cycle of silicon technology. The emergence of Truly Deep Submicron Technology (TDST) and related 3-D interconnection technologies have provided potential alternatives from conventional architectures to 3-D system solutions, through integration of IDST, Vertical Software Mapping and Intelligent Interconnect Technology (IIT). The concept of Soft-Chip Technology (SCT) entails integration of Soft• Processing Circuits with Soft-Configurable Circuits . This concept can effectively manipulate hardware primitives through vertical integration of control and data. Thus the notion of 3-D Soft-Chip emerges as a new design algorithm for content-rich multimedia, telecommunication and intelligent networking system applications. 3•D architectures (design algorithms used suitable for 3-D soft-chip technology), are driven by three factors. The first is development of new device technology (TDST) that can support new architectures with complexities of 100M to 1000M devices. The second is development of advanced wafer bonding techniques such as Indium bump and the more futuristic optical interconnects for 3-D soft-chip mapping. The third is related to improving the performance of silicon CMOS systems as devices continue to scale down in dimensions. One of the fundamental building blocks of any computer system is the arithmetic component. Optimum performance of the system is determined by the efficiency of each individual component, as well as the network as a whole entity. Development of configurable arithmetic primitives is the fundamental focus in 3-D architecture design where functionality can be implemented through soft configurable hardware elements. Therefore the ability to improve the performance capability of a system is of crucial importance for a successful design. Important factors that predict the efficiency of such arithmetic components are: • The propagation delay of the circuit, caused by the gate, diffusion and wire capacitances within !he circuit, minimised through transistor sizing. and • Power dissipation, which is generally based on node transition activity. [2] Although optimum performance of 3-D soft-chip systems is primarily established by the choice of basic primitives such as adders and multipliers, the interconnecting network also has significant degree of influence on !he efficiency of the system. 3-D superposition of devices can decrease interconnect delays by up to 60% compared to a similar planar architecture. This research is based on development and implementation of configurable arithmetic primitives, suitable to the 3-D architecture, and has these foci: • To develop a variety of arithmetic components such as adders and multipliers with particular emphasis on minimum area and compatible with 3-D soft-chip design paradigm. • To explore implementation of configurable distributed primitives for arithmetic processing. This entails optimisation of basic primitives, and using them as part of array processing. In this research the detailed designs of configurable arithmetic primitives are implemented using TDST O.l3µm (130nm) technology, utilising CAD software such as Mentor Graphics and Cadence in Custom design mode, carrying through design, simulation and verification steps