Highly Reliable Quadruple-Node Upset-Tolerant D-Latch

This work was supported in part by the Spanish MCIN/AEI /10.13039/501100011033/ FEDER under Grant PID2020-117344RB-I00, and in part by the Regional Government under Grant P20_00265 and Grant P20_00633.As CMOS technology scaling pushes towards the reduction of the length of transistors, electronic circuits face numerous reliability issues, and in particular nodes of D-latches at nano-scale confront multiple-node upset errors due to their operation in harsh radiative environments. In this manuscript, a new high reliable D-latch which can tolerate quadruple-node upsets is presented. The design is based on a low-cost single event double-upset tolerant (LSEDUT) cell and a clock-gating triple-level soft-error interceptive module (CG-SIM). Due to its LSEDUT base, it can tolerate two upsets, but the combination of two LSEDUTs and the triple-level CG-SIM provides the proposed D-latch with remarkable quadruple-node upsets (QNU) tolerance. Applying LSEDUTs for designing a QNU-tolerant D-latch improves considerably its features; in particular, this approach enhances its reliability against process variations, such as threshold voltage and (W/L) transistor variability, compared to previous QNU-tolerant D-latches and double-node-upset tolerant latches. Furthermore, the proposed D-latch not only tolerates QNUs, but it also features a clear advantage in comparison with the previous clock gating-based quadruple-node-upset-tolerant (QNUTL-CG) D-latch: it can mask single event transients. Speci c gures of merit endorse the gains introduced by the new design: compared with the QNUTL-CG D-latch, the improvements of the maximum standard deviations of the gate delay, induced by threshold voltage and (W/L) transistors variability of the proposed D-latch, are 13.8% and 5.7%, respectively. Also, the proposed D-latch has 23% lesser maximum standard deviation in power consumption, resulting from threshold voltage variability, when compared to the QNUTL-CG D-latch.Spanish MCIN/AEI /10.13039/501100011033/ FEDER under Grant PID2020-117344RB-I00Regional Government under Grant P20_00265 and Grant P20_0063

A low power and soft error resilience guard-gated Quartro-based flip-flop in 45 nm CMOS technology

Abstract Conventional flip‐flops are more vulnerable to particle strikes in a radiation environment. To overcome this disadvantage, in the literature, many radiation‐hardened flip‐flops (FFs) based on techniques like triple modular redundancy, dual interlocked cell, Quatro and guard‐gated Quatro cell, and so on, are discussed. The flip‐flop realized using radiation hardened by design Quatro cell is named as the improved version of Quatro flip‐flop (IVQFF). Single event upset (SEU) at inverter stages of master/slave and at output are the two drawbacks of IVQFF. This study proposes a guard‐gated Quatro FF (GQFF) using guard‐gated Quatro cell and Muller C‐element. To overcome the SEU at inverter stages of IVQFF, in GQFF, the inverter stages are realized in a parallel fashion. A dual‐input Muller C‐element is connected to the GQFF output stage to mask the SEU and thus maintain the correct output. The proposed GQFF tolerates both single node upset (SNU) and double node upset (DNU). It also achieves low power. To prove the efficacy, GQFF and the existing FFs are implemented in 45 nm Complementary Metal Oxide Semiconductor (CMOS) technology. From the simulation results, it may be noted that the GQFF is 100% immune to SNUs and 50% immune to DNUs

Low-Cost Soft Error Robust Hardened D-Latch for CMOS Technology Circuit

In this paper, a Soft Error Hardened D-latch with improved performance is proposed, also featuring Single Event Upset (SEU) and Single Event Transient (SET) immunity. This novel D-latch can tolerate particles as charge injection in different internal nodes, as well as the input and output nodes. The performance of the new circuit has been assessed through different key parameters, such as power consumption, delay, Power-Delay Product (PDP) at various frequencies, voltage, temperature, and process variations. A set of simulations has been set up to benchmark the new proposed D-latch in comparison to previous D-latches, such as the Static D-latch, TPDICE-based D-latch, LSEH-1 and DICE D-latches. A comparison between these simulations proves that the proposed D-latch not only has a better immunity, but also features lower power consumption, delay, PDP, and area footprint. Moreover, the impact of temperature and process variations, such as aspect ratio (W/L) and threshold voltage transistor variability, on the proposed D-latch with regard to previous D-latches is investigated. Specifically, the delay and PDP of the proposed D-latch improves by 60.3% and 3.67%, respectively, when compared to the reference Static D-latch. Furthermore, the standard deviation of the threshold voltage transistor variability impact on the delay improved by 3.2%, while its impact on the power consumption improves by 9.1%. Finally, it is shown that the standard deviation of the (W/L) transistor variability on the power consumption is improved by 56.2%

Rule-Based Design for Low-Cost Double-Node Upset Tolerant Self-Recoverable D-Latch

This paper presents a low-cost, self-recoverable, double-node upset tolerant latch aiming at nourishing the lack of these devices in the state of the art, especially featuring self-recoverability while maintaining a low-cost pro le. Thus, this D-latch may be useful for high reliability and high-performance safety-critical applications as it can detect and recover faults happening during holding time in harsh radiation environments. The proposed D-latch design is based on a low-cost single event double-node upset tolerant latch and a rule-based double-node upset (DNU) tolerant latch which provides it with the self-recoverability against DNU, but paired with a low transistor count and high performance. Simulation waveforms support the achievements and demonstrate that this new D-latch is fully self-recoverable against double-node upset. In addition, the minimum improvement of the delay-power-area product of the proposed rule-based design for the low-cost DNU tolerant self-recoverable latch (RB-LDNUR) is 59%, compared with the latest DNU self-recoverable latch on the literature.Spanish Government MCIN/AEI/10.13039/501100011033/FEDER PID2020-117344RB-I00Regional Government P20_00265 P20_00633 B-RNM-680-UGR2

STUDY OF SINGLE-EVENT EFFECTS ON DIGITAL SYSTEMS

Microelectronic devices and systems have been extensively utilized in a variety of radiation environments, ranging from the low-earth orbit to the ground level. A high-energy particle from such an environment may cause voltage/current transients, thereby inducing Single Event Effect (SEE) errors in an Integrated Circuit (IC). Ever since the first SEE error was reported in 1975, this community has made tremendous progress in investigating the mechanisms of SEE and exploring radiation tolerant techniques. However, as the IC technology advances, the existing hardening techniques have been rendered less effective because of the reduced spacing and charge sharing between devices. The Semiconductor Industry Association (SIA) roadmap has identified radiation-induced soft errors as the major threat to the reliable operation of electronic systems in the future. In digital systems, hardening techniques of their core components, such as latches, logic, and clock network, need to be addressed. Two single event tolerant latch designs taking advantage of feedback transistors are presented and evaluated in both single event resilience and overhead. These feedback transistors are turned OFF in the hold mode, thereby yielding a very large resistance. This, in turn, results in a larger feedback delay and higher single event tolerance. On the other hand, these extra transistors are turned ON when the cell is in the write mode. As a result, no significant write delay is introduced. Both designs demonstrate higher upset threshold and lower cross-section when compared to the reference cells. Dynamic logic circuits have intrinsic single event issues in each stage of the operations. The worst case occurs when the output is evaluated logic high, where the pull-up networks are turned OFF. In this case, the circuit fails to recover the output by pulling the output up to the supply rail. A capacitor added to the feedback path increases the node capacitance of the output and the feedback delay, thereby increasing the single event critical charge. Another differential structure that has two differential inputs and outputs eliminates single event upset issues at the expense of an increased number of transistors. Clock networks in advanced technology nodes may cause significant errors in an IC as the devices are more sensitive to single event strikes. Clock mesh is a widely used clocking scheme in a digital system. It was fabricated in a 28nm technology and evaluated through the use of heavy ions and laser irradiation experiments. Superior resistance to radiation strikes was demonstrated during these tests. In addition to mitigating single event issues by using hardened designs, built-in current sensors can be used to detect single event induced currents in the n-well and, if implemented, subsequently execute fault correction actions. These sensors were simulated and fabricated in a 28nm CMOS process. Simulation, as well as, experimental results, substantiates the validity of this sensor design. This manifests itself as an alternative to existing hardening techniques. In conclusion, this work investigates single event effects in digital systems, especially those in deep-submicron or advanced technology nodes. New hardened latch, dynamic logic, clock, and current sensor designs have been presented and evaluated. Through the use of these designs, the single event tolerance of a digital system can be achieved at the expense of varying overhead in terms of area, power, and delay

INVESTIGATING THE EFFECTS OF SINGLE-EVENT UPSETS IN STATIC AND DYNAMIC REGISTERS

Radiation-induced single-event upsets (SEUs) pose a serious threat to the reliability of registers. The existing SEU analyses for static CMOS registers focus on the circuit-level impact and may underestimate the pertinent SEU information provided through node analysis. This thesis proposes SEU node analysis to evaluate the sensitivity of static registers and apply the obtained node information to improve the robustness of the register through selective node hardening (SNH) technique. Unlike previous hardening techniques such as the Triple Modular Redundancy (TMR) and the Dual Interlocked Cell (DICE) latch, the SNH method does not introduce larger area overhead. Moreover, this thesis also explores the impact of SEUs in dynamic flip-flops, which are appealing for the design of high-performance microprocessors. Previous work either uses the approaches for static flip-flops to evaluate SEU effects in dynamic flip-flops or overlook the SEU injected during the precharge phase. In this thesis, possible SEU sensitive nodes in dynamic flip-flops are re-examined and their window of vulnerability (WOV) is extended. Simulation results for SEU analysis in non-hardened dynamic flip-flops reveal that the last 55.3 % of the precharge time and a 100% evaluation time are affected by SEUs

Radiation Hardened by Design Methodologies for Soft-Error Mitigated Digital Architectures

abstract: Digital architectures for data encryption, processing, clock synthesis, data transfer, etc. are susceptible to radiation induced soft errors due to charge collection in complementary metal oxide semiconductor (CMOS) integrated circuits (ICs). Radiation hardening by design (RHBD) techniques such as double modular redundancy (DMR) and triple modular redundancy (TMR) are used for error detection and correction respectively in such architectures. Multiple node charge collection (MNCC) causes domain crossing errors (DCE) which can render the redundancy ineffectual. This dissertation describes techniques to ensure DCE mitigation with statistical confidence for various designs. Both sequential and combinatorial logic are separated using these custom and computer aided design (CAD) methodologies. Radiation vulnerability and design overhead are studied on VLSI sub-systems including an advanced encryption standard (AES) which is DCE mitigated using module level coarse separation on a 90-nm process with 99.999% DCE mitigation. A radiation hardened microprocessor (HERMES2) is implemented in both 90-nm and 55-nm technologies with an interleaved separation methodology with 99.99% DCE mitigation while achieving 4.9% increased cell density, 28.5 % reduced routing and 5.6% reduced power dissipation over the module fences implementation. A DMR register-file (RF) is implemented in 55 nm process and used in the HERMES2 microprocessor. The RF array custom design and the decoders APR designed are explored with a focus on design cycle time. Quality of results (QOR) is studied from power, performance, area and reliability (PPAR) perspective to ascertain the improvement over other design techniques. A radiation hardened all-digital multiplying pulsed digital delay line (DDL) is designed for double data rate (DDR2/3) applications for data eye centering during high speed off-chip data transfer. The effect of noise, radiation particle strikes and statistical variation on the designed DDL are studied in detail. The design achieves the best in class 22.4 ps peak-to-peak jitter, 100-850 MHz range at 14 pJ/cycle energy consumption. Vulnerability of the non-hardened design is characterized and portions of the redundant DDL are separated in custom and auto-place and route (APR). Thus, a range of designs for mission critical applications are implemented using methodologies proposed in this work and their potential PPAR benefits explored in detail.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

Circuit designs for low-power and SEU-hardened systems

The desire to have smaller and faster portable devices is one of the primary motivations for technology scaling. Though advancements in device physics are moving at a very good pace, they might not be aggressive enough for now-a-day technology scaling trends. As a result, the MOS devices used for present day integrated circuits are pushed to the limit in terms of performance, power consumption and robustness, which are the most critical criteria for almost all applications. Secondly, technology advancements have led to design of complex chips with increasing chip densities and higher operating speeds. The design of such high performance complex chips (microprocessors, digital signal processors, etc) has massively increased the power dissipation and, as a result, the operating temperatures of these integrated circuits. In addition, due to the aggressive technology scaling the heat withstanding capabilities of the circuits is reducing, thereby increasing the cost of packaging and heat sink units. This led to the increase in prominence for smarter and more robust low-power circuit and system designs. Apart from power consumption, another criterion affected by technology scaling is robustness of the design, particularly for critical applications (security, medical, finance, etc). Thus, the need for error free or error immune designs. Until recently, radiation effects were a major concern in space applications only. With technology scaling reaching nanometer level, terrestrial radiation has become a growing concern. As a result Single Event Upsets (SEUs) have become a major challenge to robust designs. Single event upset is a temporary change in the state of a device due to a particle strike (usually from the radiation belts or from cosmic rays) which may manifest as an error at the output. This thesis proposes a novel method for adaptive digital designs to efficiently work with the lowest possible power consumption. This new technique improves options in performance, robustness and power. The thesis also proposes a new dual data rate flipflop, which reduces the necessary clock speed by half, drastically reducing the power consumption. This new dual data rate flip-flop design culminates in a proposed unique radiation hardened dual data rate flip-flop, Firebird\u27. Firebird offers a valuable addition to the future circuit designs, especially with the increasing importance of the Single Event Upsets (SEUs) and power dissipation with technology scaling.\u2

STAHL: A Novel Scan-Test-Aware Hardened Latch Design

As modern technology nodes become more susceptible to soft errors, many radiation hardened latch designs have been proposed. However, redundant circuitry used to tolerate soft errors in such hardened latches also reduces the test coverage of cell-internal manufacturing defects. To avoid potential test escapes that lead to soft error vulnerability and reliability issues, this paper proposes a novel Scan-Test-Aware Hardened Latch (STAHL). Simulation results show that STAHL has superior defect coverage compared to previous hardened latches while maintaining full radiation hardening in function mode.24th IEEE European Test Symposium (ETS\u2719), May 27-31, 2019, Baden-Baden, German