Ferroelectricity and Large Piezoelectric Response of AlN/ScN Superlattice

Based on density functional theory, we investigate the ferroelectric and piezoelectric properties of the AlN/ScN superlattice, consisting of ScN and AlN buckled monolayers alternating along the crystallographic <i>c</i>-direction. We find that the polar wurtzite (w-ScAlN) structure is mechanically and dynamically stable and is more stable than the nonpolar hexagonal flat configuration. We show that ferroelectric polarization switching can be possible for an epitaxially tensile-strained superlattice. Because of the elastic constant <i>C</i>₃₃ softening, together with an increase in <i>e</i>₃₃, the piezoelectric coefficient <i>d</i>₃₃ of the superlattice is doubled compared to that of pure w-AlN. The combined enhancement of Born effective charges (<i>Z</i>₃₃) and sensitivity of the atomic coordinates to the external strain (∂u3∂η3) is the origin of the large piezoelectric constant <i>e</i>₃₃. Moreover, we show that the epitaxial biaxial tensile strain significantly enhances the piezo-response, so that <i>d</i>₃₃ becomes 7 times larger than that of w-AlN at 4% strain. The tensile strain results in a huge enhancement in <i>e</i>₃₃ by increasing <i>Z</i>₃₃ and ∂u3∂η3, which boost the piezoelectric

Enhanced piezoelectricity and electromechanical efficiency in semiconducting GaN due to nanoscale porosity

Electrical polarization phenomena in GaN are important as they have significant impact on the operation of modern day energy efficient lighting and are fundamental to many GaN-based high power and high frequency electronics. Controlling polarization is beneficial for the optimization of these applications. GaN is also piezoelectric, and therefore mechanical stress and strain are possible handles to control its polarization. Nonetheless, polar semiconductors in general, and GaN in particular, are weak piezoelectric materials when compared to ceramics, and are therefore not considered for characteristic electromechanical applications such as sensing, actuation and mechanical energy harvesting. Here, we examine the effect of nanoscale porosity on the piezoelectricity of initially conductive GaN. We find that for 40% porosity, the previously conductive GaN layer becomes depleted, and exhibits enhanced piezoelectricity as measured using piezoresponse force microscopy, as well as by using a mechanical energy harvesting setup. The effective piezoelectric charge coefficient of the porous GaN, d33,eff, is found to be about 8 pm/V which is 2 3 times larger than bulk GaN. A macroscale device comprising a porous GaN layer delivered 100 nW/cm2 across a resistive load under a 150 kPa mechanical excitation. We performed finite element simulations to analyze the evolution of the piezoelectric properties with porosity. The simulations suggest that increased mechanical compliance due to porosity gives rise to the observed enhanced piezoelectricity in GaN. Furthermore, the simulations show that for stress-based excitations, the porous GaN electromechanical figure of merit is increased by an order of magnitude and becomes comparable to that of barium titanate piezoceramics. In addition, considering the central role played by GaN in modern electronics and optoelectronics, our study validates a very promising research direction when considering stress-based electromechanical applications which combine GaN’s semiconducting and piezoelectric properties

Fabrication of Al:HfO2 Gate Dielectric MOSFETs

Replacing the traditional SiO2 gate oxide in a MOSFET with ferroelectric HfO2 creates a 1T memory device referred to as a FeFET. The bi-stable polarization states cause a retained threshold voltage shift known as the memory window. Ferroelectric HfO2 offers a number of material and electrical advantages over perovskite based ferroelectrics such as PZT or SBT. Due to its use as a high-k dielectric, the ALD capability and etch characteristics of hafnium oxide are well documented. Ferroelectric HfO2 has been shown to be thermally stable up to 1000 C, making gate first FeFET processes feasible. Electrically, HfO2 is capable of achieving much larger memory windows due to a high coercive field, on the order of 1-2 MV/cm. This property also allows for much thinner films (\u3c30 \u3enm) without degradation of the memory window, and the potential for finFET applications. This work focuses on the integration of aluminum doped HfO2 into a standard RIT FET process. Previous work at RIT has led to the development of an ALD recipe and subsequent anneal to induce the ferroelectric crystal phase in Al:HfO2. In this work, n-channel MOSFETs with aluminum gate/20nm Al:HfO2/p-Si have been de- signed and fabricated. Etching of Al:HfO2 has been investigated using chlorine based plasma etching. The devices show a subthreshold slope of 75 mV/dec. Pulse testing reveals significant threshold voltage shift due to electron charge trapping commonly observed in Hf based dielectrics. I-V characteristics show mobility degradation, which is caused by Coulomb scattering as a result of trapped charges. For the devices to exhibit ferroelectric behavior with high on-state current, measurement and mitigation of charge trapping need to be further investigated

Design and Implementation of Silicon-Based MEMS Resonators for Application in Ultra Stable High Frequency Oscillators

The focus of this work is to design and implement resonators for ultra-stable high-frequency ( \u3e 100MHz) silicon-based MEMS oscillators. Specifically, two novel types of resonators are introduced that push the performance of silicon-based MEMS resonators to new limits. Thin film Piezoelectric-on-Silicon (TPoS) resonators have been shown to be suitable for oscillator applications due to their combined high quality factor, coupling efficiency, power handling and doping-dependent temperature-frequency behavior. This thesis is an attempt to utilize the TPoS platform and optimize it for extremely stable high-frequency oscillator applications. To achieve the said objective, two main research venues are explored. Firstly, quality factor is systematically studied and anisotropy of single crystalline silicon (SCS) is exploited to enable high-quality factor side-supported radial-mode (aka breathing mode) TPoS disc resonators through minimization of anchor-loss. It is then experimentally demonstrated that in TPoS disc resonators with tethers aligned to [100], unloaded quality factor improves from ~450 for the second harmonic mode at 43 MHz to ~11,500 for the eighth harmonic mode at 196 MHz. Secondly, thickness quasi-Lamé modes are studied and demonstrated in TPoS resonators for the first time. It is shown that thickness quasi-Lamé modes (TQLM) could be efficiently excited in silicon with very high quality factor (Q). A quality factor of 23.2 k is measured in vacuum at 185 MHz for a fundamental TQLM-TPoS resonators designed within a circular acoustic isolation frame. Quality factor of 12.6 k and 6 k are also measured for the second- and third- harmonic TQLM TPoS resonators at 366 MHz and 555 MHz respectively. Turn-over temperatures between 40 °C to 125 °C are also designed and measured for TQLM TPoS resonators fabricated on degenerately N-doped silicon substrates. The reported extremely high quality factor, very low motional resistance, and tunable turn-over temperatures \u3e 80 °C make these resonators a great candidate for ultra-stable oven-controlled high-frequency MEMS oscillators

Ferroelectric HfO2 for Emerging Ferroelectric Semiconductor Devices

The spontaneous polarization in ferroelectrics (FE) makes them particularly attractive for non-volatile memory and logic applications. Non-volatile FRAM memories using perovskite structure materials, such as Lead Zirconate Titanate (PZT) and Strontium Bismuth Tantalate (SBT) have been studied for many years. However, because of their scaling limit and incompatibility with CMOS beyond 130 nm node, floating gate Flash memory technology has been preferred for manufacturing. The recent discovery of ferroelectricity in doped HfO2 in 2011 has opened the door for new ferroelectric based devices compatible with CMOS technology, such as Ferroelectric Field Effect Transistor (FeFET) and Ferroelectric Tunnel Junctions (FTJ). This work began with developing ferroelectric hysteresis characterization capabilities at RIT. Initially reactively sputtered aluminum doped HfO2 films were investigated. It was observed that the composition control using co-sputtering was not achievable within the existing capabilities. During the course of this study, collaboration was established with the NaMLab group in Germany to investigate Si doped HfO2 deposited by Atomic Layer Deposition (ALD). Metal Ferroelectric Metal (MFM) devices were fabricated using TiN as the top and bottom electrode with Si:HfO2 thickness ranging from 6.4 nm to 22.9 nm. The devices were electrically tested for P-E, C-V and I-V characteristics. Structural characterizations included TEM, EELS, XRR, XRD and XPS/Auger spectroscopy. Higher remanant polarization (Pr) was observed for films of 9.3 nm and 13.1 nm thickness. Thicker film (22.9 nm) showed smaller Pr. Devices with 6.4 nm thick films exhibit tunneling behavior showing a memristor like I-V characteristics. The tunnel current and ferroelectricity showed decrease with cycling indicating a possible change in either the structure or the domain configurations. Theoretical simulations using the improved FE model were carried out to model the ferroelectric behavior of different stacks of films