The Iray Light Transport Simulation and Rendering System

While ray tracing has become increasingly common and path tracing is well understood by now, a major challenge lies in crafting an easy-to-use and efficient system implementing these technologies. Following a purely physically-based paradigm while still allowing for artistic workflows, the Iray light transport simulation and rendering system allows for rendering complex scenes by the push of a button and thus makes accurate light transport simulation widely available. In this document we discuss the challenges and implementation choices that follow from our primary design decisions, demonstrating that such a rendering system can be made a practical, scalable, and efficient real-world application that has been adopted by various companies across many fields and is in use by many industry professionals today

A review of snapshot multidimensional optical imaging: Measuring photon tags in parallel

Multidimensional optical imaging has seen remarkable growth in the past decade. Rather than measuring only the two-dimensional spatial distribution of light, as in conventional photography, multidimensional optical imaging captures light in up to nine dimensions, providing unprecedented information about incident photons’ spatial coordinates, emittance angles, wavelength, time, and polarization. Multidimensional optical imaging can be accomplished either by scanning or parallel acquisition. Compared with scanning-based imagers, parallel acquisition–also dubbed snapshot imaging–has a prominent advantage in maximizing optical throughput, particularly when measuring a datacube of high dimensions. Here, we first categorize snapshot multidimensional imagers based on their acquisition and image reconstruction strategies, then highlight the snapshot advantage in the context of optical throughput, and finally we discuss their state-of-the-art implementations and applications

A Compact, High Resolution Hyperspectral Imager for Remote Sensing of Soil Moisture

Measurement of soil moisture content is a key challenge across a variety of fields, ranging from civil engineering through to defence and agriculture. While dedicated satellite platforms like SMAP and SMOS provide high spatial coverage, their low spatial resolution limits their application to larger regional studies. The advent of compact, high lift capacity UAVs has enabled small scale surveys of specific farmland cites. This thesis presents work on the development of a compact, high spatial and spectral resolution hyperspectral imager, designed for remote measurement of soil moisture content. The optical design of the system incorporates a bespoke freeform blazed diffraction grating, providing higher optical performance at a similar aperture to conventional Offner-Chrisp designs. The key challenges of UAV-borne hyperspectral imaging relate to using only solar illumination, with both intermittent cloud cover and atmospheric water absorption creating challenges in obtaining accurate reflectance measurements. A hardware based calibration channel for mitigating cloud cover effects is introduced, along with a comparison of methods for recovering soil moisture content from reflectance data under varying illumination conditions. The data processing pipeline required to process the raw pushbroom data into georectified images is also discussed. Finally, preliminary work on applying soil moisture techniques to leaf imaging are presented

A review of snapshot multidimensional optical imaging: Measuring photon tags in parallel

Multidimensional optical imaging has seen remarkable growth in the past decade. Rather than measuring only the two-dimensional spatial distribution of light, as in conventional photography, multidimensional optical imaging captures light in up to nine dimensions, providing unprecedented information about incident photons’ spatial coordinates, emittance angles, wavelength, time, and polarization. Multidimensional optical imaging can be accomplished either by scanning or parallel acquisition. Compared with scanning-based imagers, parallel acquisition–also dubbed snapshot imaging–has a prominent advantage in maximizing optical throughput, particularly when measuring a datacube of high dimensions. Here, we first categorize snapshot multidimensional imagers based on their acquisition and image reconstruction strategies, then highlight the snapshot advantage in the context of optical throughput, and finally we discuss their state-of-the-art implementations and applications

NASA SBIR abstracts of 1991 phase 1 projects

The objectives of 301 projects placed under contract by the Small Business Innovation Research (SBIR) program of the National Aeronautics and Space Administration (NASA) are described. These projects were selected competitively from among proposals submitted to NASA in response to the 1991 SBIR Program Solicitation. The basic document consists of edited, non-proprietary abstracts of the winning proposals submitted by small businesses. The abstracts are presented under the 15 technical topics within which Phase 1 proposals were solicited. Each project was assigned a sequential identifying number from 001 to 301, in order of its appearance in the body of the report. Appendixes to provide additional information about the SBIR program and permit cross-reference of the 1991 Phase 1 projects by company name, location by state, principal investigator, NASA Field Center responsible for management of each project, and NASA contract number are included

NASA patent abstracts bibliography: A continuing bibliography. Section 1: Abstracts (supplement 29)

Abstracts are provided for 115 patents and patent applications entered into the NASA scientific and technical information system during the period January 1986 through June 1986. Each entry consists of a citation, an abstract, and in most cases, a key illustration selected from the patent application

LASER Tech Briefs, Fall 1994

Topics in this issue of LASER Tech briefs include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Fabrication Technology, Mathematics and Information Sciences, and Life Science

Holography

Holography - Basic Principles and Contemporary Applications is a collection of fifteen chapters, describing the basic principles of holography and some recent innovative developments in the field. The book is divided into three sections. The first, Understanding Holography, presents the principles of hologram recording illustrated with practical examples. A comprehensive review of diffraction in volume gratings and holograms is also presented. The second section, Contemporary Holographic Applications, is concerned with advanced applications of holography including sensors, holographic gratings, white-light viewable holographic stereograms. The third section of the book Digital Holography is devoted to digital hologram coding and digital holographic microscopy

Materials and processes for advanced lithography applications

textStep and Flash Imprint Lithography (S-FIL) is a high resolution, next-generation lithography technique that uses an ambient temperature and low pressure process to replicate high resolution images in a UV-curable liquid material. Application of the S-FIL process in conjunction with multi-level imprint templates and new imprint materials enables one S-FIL step to reproduce the same structures that require two photolithography steps, thereby greatly reducing the number of patterning steps required for the copper, dual damascene process used to fabricate interconnect wirings in modern integrated circuits. Two approaches were explored for the implementation of S-FIL in the dual damascene process: sacrificial imprint materials and imprintable dielectric materials. Sacrificial imprint materials function as a pattern recording medium during S-FIL and a three-dimensional etch mask during the dielectric substrate etch, enabling the simultaneous patterning of both the via and metal structures in the dielectric substrate. Development of sacrificial imprint materials and the associated imprint and etch processes are described. Application of S-FIL and the sacrificial imprint material in a commercial copper dual damascene process successfully produced functional copper interconnect structures, demonstrating the feasibility of integrating multi-level S-FIL in the copper dual damascene process. Imprintable dielectric materials are designed to combine the multi-level patterning capability of S-FIL with novel dielectric precursor materials, enabling the simultaneous deposition and patterning of the interlayer dielectric material. Several candidate imprintable dielectric materials were evaluated: sol-gel, polyhedral oligomeric silsesquioxane (POSS) epoxide, POSS acrylate, POSS azide, and POSS thiol. POSS thiol shows the most promise as functional imprintable dielectric material, although additional work in the POSS thiol formulation and viscous dispense process are needed to produce functional interconnect structures. Integration of S-FIL with imprintable dielectric materials would enable further streamlining of the dual damascene fabrication process. The fabrication of electronic devices on flexible substrates represents an opportunity for the development of macroelectronics such as flexible displays and large area devices. Traditional optical lithography encounters alignment and overlay limitations when applied on flexible substrates. A thermally activated, dual-tone photoresist system and its associated etch process were developed to enable the simultaneous patterning of two device layers on a flexible substrate.Chemical Engineerin