The Iray Light Transport Simulation and Rendering System

While ray tracing has become increasingly common and path tracing is well understood by now, a major challenge lies in crafting an easy-to-use and efficient system implementing these technologies. Following a purely physically-based paradigm while still allowing for artistic workflows, the Iray light transport simulation and rendering system allows for rendering complex scenes by the push of a button and thus makes accurate light transport simulation widely available. In this document we discuss the challenges and implementation choices that follow from our primary design decisions, demonstrating that such a rendering system can be made a practical, scalable, and efficient real-world application that has been adopted by various companies across many fields and is in use by many industry professionals today

Energy Efficient Engine: Control system component performance report

An Energy Efficient Engine (E3) program was established to develop technology for improving the energy efficiency of future commercial transport aircraft engines. As part of this program, General Electric designed and tested a new engine. The design, fabrication, bench and engine testing of the Full Authority Digital Electronic Control (FADEC) system used for controlling the E3 Demonstrator Engine is described. The system design was based on many of the proven concepts and component designs used on the General Electric family of engines. One significant difference is the use of the FADEC in place of hydromechanical computation currently used

Rapid and mask-less laser-processing technique for the fabrication of microstructures in polydimethylsiloxane

We report a rapid laser-based method for structuring polydimethylsiloxane (PDMS) on the micron-scale. This mask-less method uses a digital multi-mirror device as a spatial light modulator to produce a given spatial intensity pattern to create arbitrarily shaped structures via either ablation or multi-photon photo-polymerisation in a master substrate, which is subsequently used to cast the complementary patterns in PDMS. This patterned PDMS mould was then used for micro-contact printing of ink and biological molecules

Forward Global Photometric Calibration of the Dark Energy Survey

Many scientific goals for the Dark Energy Survey (DES) require calibration of optical/NIR broadband $b = grizY$ photometry that is stable in time and uniform over the celestial sky to one percent or better. It is also necessary to limit to similar accuracy systematic uncertainty in the calibrated broadband magnitudes due to uncertainty in the spectrum of the source. Here we present a "Forward Global Calibration Method (FGCM)" for photometric calibration of the DES, and we present results of its application to the first three years of the survey (Y3A1). The FGCM combines data taken with auxiliary instrumentation at the observatory with data from the broad-band survey imaging itself and models of the instrument and atmosphere to estimate the spatial- and time-dependence of the passbands of individual DES survey exposures. "Standard" passbands are chosen that are typical of the passbands encountered during the survey. The passband of any individual observation is combined with an estimate of the source spectral shape to yield a magnitude $m_b^{\mathrm{std}}$ in the standard system. This "chromatic correction" to the standard system is necessary to achieve sub-percent calibrations. The FGCM achieves reproducible and stable photometric calibration of standard magnitudes $m_b^{\mathrm{std}}$ of stellar sources over the multi-year Y3A1 data sample with residual random calibration errors of $\sigma=5-6\,\mathrm{mmag}$ per exposure. The accuracy of the calibration is uniform across the $5000\,\mathrm{deg}^2$ DES footprint to within $\sigma=7\,\mathrm{mmag}$. The systematic uncertainties of magnitudes in the standard system due to the spectra of sources are less than $5\,\mathrm{mmag}$ for main sequence stars with $0.5<g-i<3.0$.Comment: 25 pages, submitted to A

Laser-assisted bumping for flip chip assembly

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