Power-amplifier modules covering 70-113 GHz using MMICs

A set of W-band power amplifier (PA) modules using monolithic microwave integrated circuits (MMICs) have been developed for the local oscillators of the far-infrared and sub-millimeter telescope (FIRST). The MMIC PA chips include three driver and three PAs, designed using microstrip lines, and another two smaller driver amplifiers using coplanar waveguides, covering the entire W-band. The highest frequency PA, which covers 100-113 GHz, has a peak power of greater than 250 mW (25 dBm) at 105 GHz, which is the best output power performance for a monolithic amplifier above 100 GHz to date. These monolithic PA chips are fabricated using 0.1-µm AlGaAs/InGaAs/GaAs pseudomorphic T-gate power high electron-mobility transistors on a 2-mil GaAs substrate. The module assembly and testing, together with the system applications, is also addressed in this paper

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

A comprehensive survey on antennas on-chip based on metamaterial, metasurface, and substrate integrated waveguide principles for millimeter-waves and terahertz integrated circuits and systems

Antennas on-chip are a particular type of radiating elements valued for their small footprint. They are most commonly integrated in circuit boards to electromagnetically interface free space, which is necessary for wireless communications. Antennas on-chip radiate and receive electromagnetic (EM) energy as any conventional antennas, but what distinguishes them is their miniaturized size. This means they can be integrated inside electronic devices. Although on-chip antennas have a limited range, they are suitable for cell phones, tablet computers, headsets, global positioning system (GPS) devices, and WiFi and WLAN routers. Typically, on-chip antennas are handicapped by narrow bandwidth (less than 10%) and low radiation efficiency. This survey provides an overview of recent techniques and technologies investigated in the literature, to implement high performance on-chip antennas for millimeter-waves (mmWave) and terahertz (THz) integrated-circuit (IC) applications. The technologies discussed here include metamaterial (MTM), metasurface (MTS), and substrate integrated waveguides (SIW). The antenna designs described here are implemented on various substrate layers such as Silicon, Graphene, Polyimide, and GaAs to facilitate integration on ICs. Some of the antennas described here employ innovative excitation mechanisms, for example comprising open-circuited microstrip-line that is electromagnetically coupled to radiating elements through narrow dielectric slots. This excitation mechanism is shown to suppress surface wave propagation and reduce substrate loss. Other techniques described like SIW are shown to significantly attenuate surface waves and minimise loss. Radiation elements based on the MTM and MTS inspired technologies are shown to extend the effective aperture of the antenna without compromising the antenna’s form factor. Moreover, the on-chip antennas designed using the above technologies exhibit significantly improved impedance match, bandwidth, gain and radiation efficiency compared to previously used technologies. These features make such antennas a prime candidate for mmWave and THz on-chip integration. This review provides a thorough reference source for specialist antenna designers.This work was supported in part by the Universidad Carlos III de Madrid and the European Union's Horizon 2020 Research and Innovation Programme under the Marie Sklodowska-Curie Grant 801538, in part by the Icelandic Centre for Research (RANNIS) under Grant 206606, and in part by the National Science Centre of Poland under Grant 2018/31/B/ST7/02369

Convergence of millimeter-wave and photonic interconnect systems for very-high-throughput digital communication applications

In the past, radio-frequency signals were commonly used for low-speed wireless electronic systems, and optical signals were used for multi-gigabit wired communication systems. However, as the emergence of new millimeter-wave technology introduces multi-gigabit transmission over a wireless radio-frequency channel, the borderline between radio-frequency and optical systems becomes blurred. As a result, there come ample opportunities to design and develop next-generation broadband systems to combine the advantages of these two technologies to overcome inherent limitations of various broadband end-to-end interconnect systems in signal generation, recovery, synchronization, and so on. For the transmission distances of a few centimeters to thousands of kilometers, the convergence of radio-frequency electronics and optics to build radio-over-fiber systems ushers in a new era of research for the upcoming very-high-throughput broadband services. Radio-over-fiber systems are believed to be the most promising solution to the backhaul transmission of the millimeter-wave wireless access networks, especially for the license-free, very-high-throughput 60-GHz band. Adopting radio-over-fiber systems in access or in-building networks can greatly extend the 60-GHz signal reach by using ultra-low loss optical fibers. However, such high frequency is difficult to generate in a straightforward way. In this dissertation, the novel techniques of homodyne and heterodyne optical-carrier suppressions for radio-over-fiber systems are investigated and various system architectures are designed to overcome these limitations of 60-GHz wireless access networks, bringing the popularization of multi-gigabit wireless networks to become closer to the reality. In addition to the advantages for the access networks, extremely high spectral efficiency, which is the most important parameter for long-haul networks, can be achieved by radio-over-fiber signal generation. As a result, the transmission performance of spectrally efficient radio-over-fiber signaling, including orthogonal frequency division multiplexing and orthogonal wavelength division multiplexing, is broadly and deeply investigated. On the other hand, radio-over-fiber is also used for the frequency synchronization that can resolve the performance limitation of wireless interconnect systems. A novel wireless interconnects assisted by radio-over-fiber subsystems is proposed in this dissertation. In conclusion, multiple advantageous facets of radio-over-fiber systems can be found in various levels of end-to-end interconnect systems. The rapid development of radio-over-fiber systems will quickly change the conventional appearance of modern communications.PhDCommittee Chair: Gee-Kung Chang; Committee Member: Bernard Kippelen; Committee Member: Shyh-Chiang Shen; Committee Member: Thomas K. Gaylord; Committee Member: Umakishore Ramachandra

SMARAD - Centre of Excellence in Smart Radios and Wireless Research - Activity Report 2008 - 2010

Centre of Excellence in Smart Radios and Wireless Research (SMARAD), originally established with the name Smart and Novel Radios Research Unit, is aiming at world-class research and education in Future radio and antenna systems, Cognitive radio, Millimetre wave and THz techniques, Sensors, and Materials and energy, using its expertise in RF, microwave and millimetre wave engineering, in integrated circuit design for multi-standard radios as well as in wireless communications. SMARAD has the Centre of Excellence in Research status from the Academy of Finland since 2002 (2002-2007 and 2008-2013). Currently SMARAD consists of five research groups from three departments, namely the Department of Radio Science and Engineering, Department of Micro and Nanosciences, and Department of Signal Processing and Acoustics, all within the Aalto University School of Electrical Engineering. The total number of employees within the research unit is about 100 including 8 professors, about 30 senior scientists and about 40 graduate students and several undergraduate students working on their Master thesis. The relevance of SMARAD to the Finnish society is very high considering the high national income from exports of telecommunications and electronics products. The unit conducts basic research but at the same time maintains close co-operation with industry. Novel ideas are applied in design of new communication circuits and platforms, transmission techniques and antenna structures. SMARAD has a well-established network of co-operating partners in industry, research institutes and academia worldwide. It coordinates a few EU projects. The funding sources of SMARAD are diverse including the Academy of Finland, EU, ESA, Tekes, and Finnish and foreign telecommunications and semiconductor industry. As a byproduct of this research SMARAD provides highest-level education and supervision to graduate students in the areas of radio engineering, circuit design and communications through Aalto University and Finnish graduate schools such as Graduate School in Electronics, Telecommunications and Automation (GETA). During years 2008 – 2010, 21 doctor degrees were awarded to the students of SMARAD. In the same period, the SMARAD researchers published 141 refereed journal articles and 333 conference papers

Millimeter-Wave Active Array Antennas Integrating Power Amplifier MMICs through Contactless Interconnects

Next-generation mobile wireless technologies demand higher data capacity than the modern sub-6 GHz technologies can provide. With abundantly available bandwidth, millimeter waves (e.g., Ka/K bands) can offer data rates of around 10 Gbit/s; however, this shift to higher frequency bands also leads to at least 20 dB more free-space path loss. Active integrated antennas have drawn much attention to compensate for this increased power loss with high-power, energy- efficient, highly integrated array transmitters. Traditionally, amplifiers and antennas are designed separately and interconnected with 50 Ohm intermediate impedance matching networks. The design process typically de-emphasizes the correlation between antenna mutual coupling effects and amplifier nonlinearity, rendering high power consumption and poor linearity. This research aims to overcome the technical challenges of millimeter-wave active integrated array antennas on delivering high power (15–25 dBm) and high energy efficiency (≥25%) with above 10% bandwidth. A co-design methodology was proposed to maximize the output power, power efficiency, bandwidth, and linearity with defined optimal interface impedances. Contrary to conventional approaches, this methodology accounts for the correlation between mutual coupling effects and nonlinearity. A metallic cavity-backed bowtie slot antenna, with sufficient degrees of freedom in synthesizing a non 50 Ohm complex-valued optimal impedance, was adopted for high radiation efficiency and enhanced bandwidth. To overcome interconnection’s bandwidth and power loss limitations, an on-chip E-plane probe contactless transition be- tween the antenna and amplifier was proposed. An array of such antennas be- comes connected bowtie slots, allowing for wideband and wide-scan array performance. An infinite array active integrated unit cell approach was introduced for large-scale (aperture area ≈100 λ2) active array designs. The proposed co-design flow is applied in designing a Ka-band wideband, wide scan angle (\ub155\ub0/\ub140\ub0) active array antenna, consisting of the connected bowtie slot radiator fed through the on-chip probe integrated onto the output of a class AB GaAs pHEMT MMIC PA. The infinite array performance of such elements is experimentally verified, presenting a 11.3% bandwidth with a peak 40% power efficiency, 28 dBm EIRP, and 22 dBm saturated power

Circuit paradigm in the 21

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