The Iterative Development of the Humanoid Robot Kaspar: An Assistive Robot for Children with Autism

This paper gives an overview of the design and development of the humanoid robot Kaspar. Since the first Kaspar robot was developed in 2005, the robotic platform has undergone continuous development driven by the needs of users and technological advancements enabling the integration of new features. We discuss in detail the iterative development of Kaspar’s design and clearly explain the rational of each development, which has been based on the user requirements as well as our years of experience in robot assisted therapy for children with autism, particularly focusing on how the developments benefit the children we work with. Further to this, we discuss the role and benefits of robotic autonomy on both children and therapist along with the progress that we have made on the Kaspar robot’s autonomy towards achieving a semi-autonomous child-robot interaction in a real world setting.Peer reviewe

Development of an intelligent object for grasp and manipulation research

Kõiva R, Haschke R, Ritter H. Development of an intelligent object for grasp and manipulation research. Presented at the ICAR 2011, Tallinn, Estonia.In this paper we introduce a novel device, called iObject, which is equipped with tactile and motion tracking sensors that allow for the evaluation of human and robot grasping and manipulation actions. Contact location and contact force, object acceleration in space (6D) and orientation relative to the earth (3D magnetometer) are measured and transmitted wirelessly over a Bluetooth connection. By allowing human-human, human-robot and robot-robot comparisons to be made, iObject is a versatile tool for studying manual interaction. To demonstrate the efficiency and flexibility of iObject for the study of bimanual interactions, we report on a physiological experiment and evaluate the main parameters of the considered dual-handed manipulation task

Tactile sensing chips with POSFET array and integrated interface electronics

This work presents the advanced version of novel POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices based tactile sensing chip. The new version of the tactile sensing chip presented here comprises of a 4 x 4 array of POSFET touch sensing devices and integrated interface electronics (i.e. multiplexers, high compliance current sinks and voltage output buffers). The chip also includes four temperature diodes for the measurement of contact temperature. Various components on the chip have been characterized systematically and the overall operation of the tactile sensing system has been evaluated. With new design the POSFET devices have improved performance (i.e. linear response in the dynamic contact forces range of 0.01–3N and sensitivity (without amplification) of 102.4 mV/N), which is more than twice the performance of their previous implementations. The integrated interface electronics result in reduced interconnections which otherwise would be needed to connect the POSFET array with off-chip interface electronic circuitry. This research paves the way for CMOS (Complementary Metal Oxide Semiconductor) implementation of full on-chip tactile sensing systems based on POSFETs

Large Area Electronic Skin

Technological advances have enabled various approaches for developing artificial organs such as bionic eyes, artificial ears, and lungs etc. Recently electronics (e-skin) or tactile skin has attracted increasing attention for its potential to detect subtle pressure changes, which may open up applications including real-time health monitoring, minimally invasive surgery, and prosthetics. The development of e-skin is challenging as, unlike other artificial organs, tactile skin has large number of different types of sensors, which are distributed over large areas and generate large amount of data. On top of this, the attributes such as softness, stretchability, and bendability etc., are difficult to be achieved as today's electronics technology is meant for electronics on planar and stiff substrates such as silicon wafers. This said, many advances, pursued through “More than Moore” technology, have recently raised hope as some of these relate to flexible electronics and have been targeted towards developing e-skin. Depending on the technology and application, the scale of e-skin could vary from small patch (e.g. for health monitoring) to large area skin (e.g. for robotics). This invited paper presents some of the advances in large area e-skin and flexible electronics, particularly related to robotics

Sensors for Robotic Hands: A Survey of State of the Art

Recent decades have seen significant progress in the field of artificial hands. Most of the surveys, which try to capture the latest developments in this field, focused on actuation and control systems of these devices. In this paper, our goal is to provide a comprehensive survey of the sensors for artificial hands. In order to present the evolution of the field, we cover five year periods starting at the turn of the millennium. At each period, we present the robot hands with a focus on their sensor systems dividing them into categories, such as prosthetics, research devices, and industrial end-effectors.We also cover the sensors developed for robot hand usage in each era. Finally, the period between 2010 and 2015 introduces the reader to the state of the art and also hints to the future directions in the sensor development for artificial hands

A Flexible and Robust Large Scale Capacitive Tactile System for Robots

IEEE Sensor Journal, Vol. 13, Issue 10, 2013Capacitive technology allows building sensors that are small, compact and have high sensitivity. For this reason it has been widely adopted in robotics. In a previous work we presented a compliant skin system based on capacitive technology consisting of triangular modules interconnected to form a system of sensors that can be deployed on non-flat surfaces. This solution has been successfully adopted to cover various humanoid robots. The main limitation of this and all the approaches based on capacitive technology is that they require to embed a deformable dielectric layer (usually made using an elastomer) covered by a conductive layer. This complicates the production process considerably, introduces hysteresis and limits the durability of the sensors due to ageing and mechanical stress. In this paper we describe a novel solution in which the dielectric is made using a thin layer of 3D fabric which is glued to conductive and protective layers using techniques adopted in the clothing industry. As such, the sensor is easier to produce and has better mechanical properties. Furthermore, the sensor proposed in this paper embeds transducers for thermal compensation of the pressure measurements. We report experimental analysis that demonstrates that the sensor has good properties in terms of sensitivity and resolution. Remarkably we show that the sensor has very low hysteresis and effectively allows compensating drifts due to temperature variations

Chapter Large Scale Capacitive Skin for Robots

Communications engineering / telecommunication