572 research outputs found

    Development and implementation of a deflection amplification mechanism for capacitive accelerometers

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    Micro-Electro-Mechanical-Systems (MEMS) and especially physical sensors are part of a flourishing market ranging from consumer electronics to space applications. They have seen a great evolution throughout the last decades, and there is still considerable research effort for further improving their performance. This is reflected by the plethora of commercial applications using them but also by the demand from industry for better specifications. This demand together with the needs of novel applications fuels the research for better physical sensors.Applications such as inertial, seismic, and precision tilt sensing demand very high sensitivity and low noise. Bulk micromachined capacitive inertial sensors seem to be the most viable solution as they offer a large inertial mass, high sensitivity, good noise performance, they are easy to interface with, and of low cost. The aim of this thesis is to improve the performance of bulk micromachined capacitive sensors by enhancing their sensitivity and noise floor.MEMS physical sensors, most commonly, rely on force coupling and a resulting deflection of a proof mass or membrane to produce an output proportional to a stimulus of the physical quantity to be measured. Therefore, the sensitivity to a physical quantity may be improved by increasing the resulting deflection of a sensor. The work presented in this thesis introduces an approach based on a mechanical motion amplifier with the potential to improve the performance of mechanical MEMS sensors that rely on deflection to produce an output signal.The mechanical amplifier is integrated with the suspension system of a sensor. It comprises a system of micromachined levers (microlevers) to enhance the deflection of a proof mass caused by an inertial force. The mechanism can be used in capacitive accelerometers and gyroscopes to improve their performance by increasing their output signal. As the noise contribution of the electronic read-out circuit of a MEMS sensor is, to first order, independent of the amplitude of its input signal, the overall signal-to-noise ratio (SNR) of the sensor is improved.There is a rather limited number of reports in the literature for mechanical amplification in MEMS devices, especially when applied to amplify the deflection of inertial sensors. In this study, after a literature review, mathematical and computational methods to analyse the behaviour of microlevers were considered. By using these methods the mechanical and geometrical characteristics of microlevers components were evaluated. In order to prove the concept, a system of microlevers was implemented as a mechanical amplifier in capacitive accelerometers.All the mechanical structures were simulated using Finite Element Analysis (FEA) and system level simulations. This led to first order optimised devices that were used to design appropriate masks for fabrication. Two main fabrication processes were used; a Silicon on Insulator (SOI) process and a Silicon on Glass (SoG) process. The SOI process carried out at the University of Southampton evolved from a one mask to a two mask dicing free process with a yield of over 95%, in its third generation. The SoG is a well-established process at the University of Peking that uses three masks.The sensors were evaluated using both optical and electrical means. The results from the first prototype sensor design (1HAN) revealed an amplification factor of 40 and a mechanically amplified sensitivity of 2.39V/g. The measured natural frequency of the first mode of the sensor was at 734Hz and the full-scale measurement range was up to 7g with a maximum nonlinearity of 2%. The measurements for all the prototype sensor designs were very close to the predicted values with the highest discrepancy being 22%. The results of this research show that mechanical amplification is a very promising concept that can offer increased sensitivity in inertial sensors without increasing the noise. Experimental results show that there is plenty of room for improvement and that viable solutions may be produced by using the presented approach. The applications of this scheme are not restricted only to inertial sensors but as the results show it can be used in a broader range of micromachined devices

    High-accuracy Motion Estimation for MEMS Devices with Capacitive Sensors

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    With the development of micro-electro-mechanical system (MEMS) technologies, emerging MEMS applications such as in-situ MEMS IMU calibration, medical imaging via endomicroscopy, and feedback control for nano-positioning and laser scanning impose needs for especially accurate measurements of motion using on-chip sensors. Due to their advantages of simple fabrication and integration within system level architectures, capacitive sensors are a primary choice for motion tracking in those applications. However, challenges arise as often the capacitive sensing scheme in those applications is unconventional due to the nature of the application and/or the design and fabrication restrictions imposed, and MEMS sensors are traditionally susceptible to accuracy errors, as from nonlinear sensor behavior, gain and bias drift, feedthrough disturbances, etc. Those challenges prevent traditional sensing and estimation techniques from fulfilling the accuracy requirements of the candidate applications. The goal of this dissertation is to provide a framework for such MEMS devices to achieve high-accuracy motion estimation, and specifically to focus on innovative sensing and estimation techniques that leverage unconventional capacitive sensing schemes to improve estimation accuracy. Several research studies with this specific aim have been conducted, and the methodologies, results and findings are presented in the context of three applications. The general procedure of the study includes proposing and devising the capacitive sensing scheme, deriving a sensor model based on first principles of capacitor configuration and sensing circuit, analyzing the sensor’s characteristics in simulation with tuning of key parameters, conducting experimental investigations by constructing testbeds and identifying actuation and sensing models, formulating estimation schemes is to include identified actuation dynamics and sensor models, and validating the estimation schemes and evaluating their performance against ground truth measurements. The studies show that the proposed techniques are valid and effective, as the estimation schemes adopted either fulfill the requirements imposed or improve the overall estimation performance. Highlighted results presented in this dissertation include a scale factor calibration accuracy of 286 ppm for a MEMS gyroscope (Chapter 3), an improvement of 15.1% of angular displacement estimation accuracy by adopting a threshold sensing technique for a scanning micro-mirror (Chapter 4), and a phase shift prediction error of 0.39 degree for a electrostatic micro-scanner using shared electrodes for actuation and sensing (Chapter 5).PHDMechanical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147568/1/davidsky_1.pd

    Advanced sensors technology survey

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    This project assesses the state-of-the-art in advanced or 'smart' sensors technology for NASA Life Sciences research applications with an emphasis on those sensors with potential applications on the space station freedom (SSF). The objectives are: (1) to conduct literature reviews on relevant advanced sensor technology; (2) to interview various scientists and engineers in industry, academia, and government who are knowledgeable on this topic; (3) to provide viewpoints and opinions regarding the potential applications of this technology on the SSF; and (4) to provide summary charts of relevant technologies and centers where these technologies are being developed

    MEMS Accelerometers

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    Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

    Degree-per-hour mode-matched micromachined silicon vibratory gyroscopes

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    The objective of this research dissertation is to design and implement two novel micromachined silicon vibratory gyroscopes, which attempt to incorporate all the necessary attributes of sub-deg/hr noise performance requirements in a single framework: large resonant mass, high drive-mode oscillation amplitudes, large device capacitance (coupled with optimized electronics), and high-Q resonant mode-matched operation. Mode-matching leverages the high-Q (mechanical gain) of the operating modes of the gyroscope and offers significant improvements in mechanical and electronic noise floor, sensitivity, and bias stability. The first micromachined silicon vibratory gyroscope presented in this work is the resonating star gyroscope (RSG): a novel Class-II shell-type structure which utilizes degenerate flexural modes. After an iterative cycle of design optimization, an RSG prototype was implemented using a multiple-shell approach on (111) SOI substrate. Experimental data indicates sub-5 deg/hr Allan deviation bias instability operating under a mode-matched operating Q of 30,000 at 23ºC (in vacuum). The second micromachined silicon vibratory gyroscope presented in this work is the mode-matched tuning fork gyroscope (M2-TFG): a novel Class-I tuning fork structure which utilizes in-plane non-degenerate resonant flexural modes. Operated under vacuum, the M2-TFG represents the first reported high-Q perfectly mode-matched operation in Class-I vibratory microgyroscope. Experimental results of device implemented on (100) SOI substrate demonstrates sub-deg/hr Allan deviation bias instability operating under a mode-matched operating Q of 50,000 at 23ºC. In an effort to increase capacitive aspect ratio, a new fabrication technology was developed that involved the selective deposition of doped-polysilicon inside the capacitive sensing gaps (SPD Process). By preserving the structural composition integrity of the flexural springs, it is possible to accurately predict the operating-mode frequencies while maintaining high-Q operation. Preliminary characterization of vacuum-packaged prototypes was performed. Initial results demonstrated high-Q mode-matched operation, excellent thermal stability, and sub-deg/hr Allan variance bias instability.Ph.D.Committee Chair: Dr. Farrokh Ayazi; Committee Member: Dr. Mark G. Allen; Committee Member: Dr. Oliver Brand; Committee Member: Dr. Paul A. Kohl; Committee Member: Dr. Thomas E. Michael

    UV-LIGA micro-fabrication of inertia type electrostatic transducers and their application

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    This dissertation discusses the design, working principles, static & dynamic analysis and simulation, mechanics of material, applied MEMS technology, micro-fabrication, and experimental testing of two types of micro-transducers: micro-power relay and micro-accelerometer. Several possible design concepts were proposed, and the advantages and disadvantages of electrostatic working principles were also discussed. Transducers presented in this research used electrostatic force as a driving force in the micro-relay and capacitance as a sensing parameter in the micro-accelerometer. There was an analogy between the micro-relay and the micro-accelerometer in their theoretical approach and fabrication processes. The proposed micro-transducers (micro-relay and micro-accelerometer) were fabricated using UV lithograph of SU-8 & SPR and UV-LIGA process. The advantages and disadvantages of these processes were discussed. The micro-relays fabricated by UV-LIGA technology had the following advantages compared with other reported relays: fast switching speed, high power capacity, high off-resistance, lower on-resistance, low power consumption, and low heat generation. The polymer-based micro-accelerometers were designed and fabricated. Instead of applying SU-8 only as a photo resist, cured SU-8 was used as the primary structural material in fabricating the micro-accelerometers. The great flexibility in size and aspect ratio of cured SU-8 made it feasible to produce highly sensitive accelerometers. The prototype micro-relays and micro-accelerometers were tested for the dynamic characteristics and power capacity. The experimental results in micro-relays had confirmed that reasonably large current capacity and fast response speed was able to be achieved using electromagnetic actuation and the multilayer UV-LIGA fabrication process

    High-frequency tri-axial resonant gyroscopes

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    This dissertation reports on the design and implementation of a high-frequency, tri-axial capacitive resonant gyroscopes integrated on a single chip. The components that construct tri-axial rotation sensing consist of a yaw, a pitch and a roll device. The yaw-rate gyroscope has a wide bandwidth and a large full-scale range, and operates at a mode-matched condition with DC polarization voltage of 10V without frequency tuning requirement. The large bandwidth of 3kHz and expected full-scale range over 30,000˚/sec make the device exhibit fast rate response for rapid motion sensing application. For the pitch-and-roll rate sensing, an in-plane drive-mode and two orthogonal out-of-plane sense-modes are employed. The rotation-rate sensing from lateral axes is performed by mode-matching the in-plane drive-mode with out-of-plane sense-modes to detect Coriolis-force induced deflection of the resonant mass. To compensate process variations and thickness deviations in the employed silicon-on-insulator (SOI) substrates, large electrostatic frequency tunings of both the drive and sense modes are realized. A revised high aspect ratio combined polysilicon and silicon (HARPSS) process is developed to resolve the Coriolis response that exists toward out-of-plane direction while drive-mode exists on in-plane, and tune individual frequencies with minimal interference to unintended modes. To conclude and overcome the performance limitation, design optimization of high-frequency tri-axial gyroscopes is suggested. Q-factor enhancement through reduction of thermoelastic damping (TED) and optimizations of physical dimensions are suggested for the yaw disk gyroscope. For the pitch-and-roll gyroscope, scaling property of physical dimension and its subsequent performance enhancement are analyzed.Ph.D

    Micro-g MEMS accelerometer based on time measurement

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    Programa Doutoral em Engenharia Electrónica e de ComputadoresThe MEMS sensor market has experienced an amazing growth on the last decades, with accelerometers being one of the pioneers pushing the technology into widespread use with its applications on automotive industry. Since then, accelerometers have been gradually replacing conventional sensors due mainly to its lower cost. As the performance of MEMS accelerometers improves, the applications range where they replace conventional accelerometers increases. Nowadays, there is still a large range of applications for which suitable MEMS accelerometers are yet to be developed. This work focuses on the development of a high performance accelerometer taking advantage of the high sensitivity of a non-linear phenomenon that occurs in electrostatically actuated movable capacitive microdevices: electrostatic pull-in. Although the pull-in effect has been known for more than 40 years, it is usually avoided when dealing with movable microstructures as it leads to a region of instability, where the position of movable parts cannot be fully controlled. In the last decade, the pull-in displacement profile of 1-DOF parallel-plates devices has been the subject of research that revealed the presence of a so-called meta-stability. This meta-stability occurs in specific damping and voltage actuation conditions and translates as a non-linear displacement profile, rather than simple time-of-flight. This feature makes the pull-in time duration significantly longer, and it happens to be extremely sensitive to intervenient forces, such as external acceleration. Basically, measuring the pull-in time of specifically designed microstructures (while maintaining the other parameters constant) allows the measurement of the external acceleration that acts on the system. Using a pull-in time measurement rather than direct capacitance/displacement/acceleration transduction presents several advantages. The most important is the fact that time can be measured very accurately with technology readily available. For instance, if one uses a 100MHz clock on the time counting mechanism, which corresponds to a time measurement resolution of 100 ns, given the 0.26 μs/μg sensitivity of the accelerometer developed in this work, an acceleration resolution of 0.38 μg could be achieved. One of the main challenges of the time based accelerometer development is the damper design, as damping is of outmost importance in defining the accelerometer performance parameters, namely sensitivity and noise. A new squeeze-film damper geometry design has been presented and studied. It consists of flow channels implemented on the parallel-plates that relieve the squeeze-film damping pressures generated when the device is moving. This geometry has proved to be very effective in increasing the capacitance/damping ratio in parallel-plates, which was up to now a great challenge of in-plane parallel-plates design. This work reports the development of an open-loop accelerometer with 0.26 μs/μg sensitivity and 2.7 μg /√Hz noise performance. The MEMS structures used for its experimental implementation were fabricated using a commercially available SOI micromachining process. The main drawbacks of this accelerometer were the low system bandwidth and non-linearity. Closed-loop approaches using electrostatic feedback were explored in this work in order to overcome these limitations, and the dynamic range was successfully extended to 109 dB along with improvements on the linearity. From the thorough damping study performed in this work, a new application for the pullin time using the same microstructures was developed. It consists of a gas viscosity sensing application. At the low frequencies operated, damping is directly proportional to the viscosity of the gas medium. The experimental results obtained with gases with viscosities ranging from 8 μP to 18 μP have shown a sensitivity of 2 ms/μP, making the pull-in time viscosity sensor a very promising approach.Nas últimas décadas assistiu-se a um imenso crescimento no mercado de sensors MEMS, tendo os acelerómetros sido uma das maiores forças impulsionadoras desse crescimento devido às suas aplicações na indústria automóvel. Desde então, a gama de aplicações destes sensores expandiu-se multidirecionalmente, novas aplicações emergiram e acelerómetros convencionais em aplicações já existentes foram substituídos por acelerómetros MEMS. Isto deve-se essencialmente ao seu baixo custo e pequenas dimensões. Há no entanto, aplicações para as quais o desempenho dos acelerómetros MEMS ainda não é suficiente. O objectivo deste trabalho é desenvolver um acelerómetro de elevado desempenho tirando partido da elevada sensibilidade do efeito de pull-in a forças externas tais como a aceleração. O efeito de pull-in, descrito pela primeira vez há mais de 40 anos, ocorre em dispositivos capacitivos com partes móveis. Este é um efeito não-linear geralmente evitado/indesejado, uma vez que se traduz numa instabilidade que dificulta o controlo da posição das partes móveis. Na última década foi dedicada alguma investigaçao científica a este fenómeno, tendo sido descoberta a existência de um perfil de deslocamento particular, denominado meta-estabilidade, em determinadas condições de amortecimento e de actuação electrostática. Esta característica do pull-in torna a sua duração extremamente sensível a variações nas forças intervenientes, incluindo aceleração externa. Assim sendo, a medição do tempo de pull-in de micro-estruturas especificamente concebidas para o efeito pode ser utilizada para medir aceleração. Esta abordagem apresenta vantagens significativas em comparação com a transdução direta de capacidade para aceleração (caso da generalidade dos acelerómetros capacitivos). Nomeadamente, a variável tempo pode ser medida com elevada precisão com relativa facilidade e sem necessidade de desenvolvimentos tecnológicos (o que não é o caso da medição de capacidade). Por exemplo, o uso de uma frequência de relógio de 100 MHz no mecanismo de contagem de tempo permite uma resolução de 100 ns na medição de tempo, o que corresponde, considerando a sensibilidade de 0.26 μs/μg do acelerómetro desenvolvido neste trabalho, a uma resolução na medição de acceleração de 0.38μg. Um dos maiores desafios do desenvolvimento de um acelerómetro baseado no tempo de pull-in é o desenho do amortecedor, pois a sensibilidade e o ruído/resolução do sensor final dependem do nível de amortecimento. Uma nova geometria para o amortecedor (estabelecido por um mecanismo de squeeze-film) é apresentada e estudada neste trabalho. Esta consiste em abrir canais nas placas paralelas facilitando assim o fluxo de ar quando as placas se movem. Ficou provado que esta geometria é eficaz na redução da razão capacidade/amortecimento, o que constituía um problema recorrente no desenho de dispositivos de placas paralelas in-plane. Neste trabalho é descrito o desenvolvimento de um acelerómetro em malha aberta com uma sensibilidade de 0.26 μs/μg e 2.7 μg /√Hz de ruído. As estruturas MEMS utilizadas na sua implementação foram fabricadas num processo de microfabrico SOI comercial. As principais desvantagens desta abordagem são pequena gama dinâmica devido à não-linearidade da resposta. Neste trabalho foram exploradas abordagens em malha fechada, usando feedback electrostático, de modo a ultrapassar estas limitações, tendo sido alcançado um aumento da gama dinâmica para 109 dB, com grandes melhoria na linearidade. Uma nova aplicação para o tempo de pull-in foi também desenvolvida: medição de viscosidade de gases. Uma vez que as microstruturas utilizadas são operadas a baixas frequências, o amortecimento é proporcional à viscosidade. O estudo efectuado mostra que o tempo de pull-in é muito sensível ao amortecimento e portanto a variações de viscosidade. Os resultados experimentais obtidos com gases e misturas de gases com viscosidades entre 8 μP e 18 μP mostraram uma sensibilidade de 2 ms/μP, confirmando o potencial da utilização de tempo de pull-in na medição de viscosidade.The author, Rosana Maria Alves Dias, was supported by Portuguese Foundation for Science and Technology (SFRH/BD/46030/2008)

    DESIGN AND MICROFABRICATION OF A CMOS-MEMS PIEZORESISTIVE ACCELEROMETER AND A NANO-NEWTON FORCE SENSOR

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    DESIGN AND MICROFABRICATION OF A CMOS-MEMS PIEZORESISTIVE ACCELEROMETER AND A NANO-NEWTON FORCE SENSOR by Mohd Haris Md Khir Adviser: Hongwei Qu, Ph.D. This thesis work consists of three aspects of research efforts: I. Design, fabrication, and characterization of a CMOS-MEMS piezoresistive accelerometer 2. Design, fabrication, and characterization of a CMOS-MEMS nano-Newton force sensor 3. Observer-based controller design of a nano-Newton force sensor actuator system A low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass has been fabricated. Inherent CMOS polysilicon thin film was utilized as piezoresistive material and full Wheatstone bridge was constructed through easy wiring allowed by three metal layers in CMOS thin films. The device fabrication process consists of a standard CMOS process for sensor configuration and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. Bulk single-crystal silicon (SCS) substrate was included in the proof mass to increase sensor sensitivity. Using a low operating power of 1.67 m W, the sensitivity was measured as 30.7 mV/g after amplification and 0.077 mV/g prior to amplification. With a total noise floor of 1.03 mg!-!Hz, the minimum detectable acceleration is found to be 32.0 mg for a bandwidth of I kHz which is sufficient for many applications. The second device investigated in this thesis work is a CMOS-MEMS capacitive force sensor capable ofnano-Newton out-of-plane force measurement. Sidewall and fringe capacitance formed by the multiple CMOS metal layers were utilized and fully differential sensing was enabled by common-centroid wiring of the sensing capacitors. Single-crystal silicon (SCS) is incorporated in the entire sensing element for robust structures and reliable sensor deployment in force measurement. A sensitivity of 8 m V /g prior to amplification was observed. With a total noise floor of 0.63 mg!-IHz, the minimum detection acceleration is found to be 19.8 mg, which is equivalent to a sensing force of 449 nN. This work also addresses the design and simulation of an observer-based nonlinear controller employed in a CMOS-MEMS nano-Newton force sensor actuator system. Measurement errors occur when there are in-plane movements of the probe tip; these errors can be controlled by the actuators incorporated within the sensor. Observerbased controller is necessitated in real-world control applications where not all the state variables are accessible for on-line measurements. V
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