Flex Cracking and Temperature-Humidity-Bias Effects on Reliability of Multilayer Ceramic Capacitors

Multilayer ceramic capacitors (MLCCs) are known to be susceptible to cracking when subjected to excessive printed circuit board (PCB) flexure, which is called "flex cracking". The bending of the printed circuit board causes stresses to be transmitted through the solder fillets to the surface mount capacitors. These stresses are the highest at the bottom of the capacitor, where the termination bands end. In order to reduce the amount of stress that is transmitted to the brittle ceramic body of MLCCs through end terminations, a flexible termination system which incorporates a silver-loaded epoxy in end-terminations was developed by some MLCC manufacturers. With the transition to lead-free materials in the electronics industry there is a concern that MLCCs assembled on PCBs with lead-free solder have different susceptibility to flex cracking than those assembled with eutectic tin-lead solder. In this study, the flex cracking of MLCCs assembled with lead-free solder (Sn3.0Ag0.5Cu) was compared with those assembled with eutectic tin-lead (Sn37Pb) solder and differences in the results were explained in terms of solder mechanical properties and solder solidification temperature. Tin-silver-copper lead-free solders and eutectic tin-lead solder have different mechanical properties, which affect the stresses that are transmitted to the ceramic body of the capacitor through the solder fillet. The higher solidification temperature for lead-free solder leads to increased residual compressive stresses after the reflow cool-down process for MLCCs assembled with lead-free solder compared with those assembled with tin-lead solder. In this work, the effects of dielectric material, capacitor size, solder assembly process, solder material, and end-termination type on flex cracking of MLCCs were determined for MLCCs from different manufacturers. Since some flexible- and standard-termination MLCCs are made with precious metal electrodes (silver-palladium), there is a possibility of electrochemical silver migration under bias and humidity. In this study, the effects of temperature-humidity-bias on electrical parameters of flexible-termination MLCCs were characterized and compared with standard-termination MLCCs. In addition, the effect of temperature-humidity-bias on electrical parameters of MLCCs with base metal electrodes was compared to that for precious metal electrode capacitors

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions

Correlative Framework of Techniques for the Inspection, Evaluation, and Design of Micro-electronic Devices

Trillions of micro- and nano-electronic devices are manufactured every year. They service countless electronic systems across a diverse range of applications ranging from civilian, military, and medical sectors. Examples of these devices include: packaged and board-mounted semiconductor devices such as ceramic capacitors, CPUs, GPUs, DSPs, etc., biomedical implantable electrochemical devices such as pacemakers, defibrillators, and neural stimulators, electromechanical sensors such as MEMS/NEMS accelerometers and positioning systems and many others. Though a diverse collection of devices, they are unified by their length scale. Particularly, with respect to the ever-present objectives of device miniaturization and performance improvement. Pressures to meet these objectives have left significant room for the development of widely applicable inspection and evaluation techniques to accurately and reliably probe new and failed devices on an ever-shrinking length scale. Presented in this study is a framework of correlative, cross-modality microscopy workflows coupled with novel in-situ experimentation and testing, and computational reverse engineering and modeling methods, aimed at addressing the current and future challenges of evaluating micro- and nano-electronic devices. The current challenges are presented through a unique series of micro- and nano-electronic devices from a wide range of applications with ties to industrial relevance. Solutions were reached for the challenges and through the development of these workflows, they were successfully expanded to areas outside the immediate area of the original project. Limitations on techniques and capabilities were noted to contextualize the applicability of these workflows to other current and future challenges

Characterising, understanding and predicting the performance of structural power composites

Dramatic improvements in power generation, energy storage, system integration and light-weighting are needed to meet increasingly stringent carbon emissions targets for future aircraft and road vehicles. The electrification of transport could significantly reduce direct CO2 emissions; however, battery energy and power density limitations pose a major technological barrier. The introduction of multifunctional structural power composites (SPCs), which simultaneously provide mechanical load-bearing and electrochemical energy storage, offers new possibilities. By replacing conventional materials with SPCs, electrical performance requirements could be relaxed, and vehicle mass could be reduced; however, for SPCs to outperform monofunctional systems, significant performance and reliability improvements are still required. The use of computational models to support experimental efforts has so far been overlooked, despite wide recognition of the benefits of such a combined approach. The aim of this work was to develop predictive finite element models for structural supercapacitor composites (SSCs), and use them to investigate their mechanical, electrical, and electrochemical behaviour. A unit cell modelling technique was used to generate realistic mesoscale models of the complex microstructure of SSCs. The effects of composite manufacturing processes on the final performance of SSCs were investigated through characterisation and modelling of compaction and manufacturing defects. Numerical predictions of the elastic properties of SSCs were evaluated against data from the literature; and the presence of defects was shown to significantly degrade performance. Motivated by the large series resistance of SSCs, direct conduction models were developed to better understand electrical charge transport. Based on investigations of various current collector geometries, design strategies for the mitigation of resistive losses were proposed. To enable analysis of the combined mechanical-electrochemical behaviour of SSCs, an ion transport user element subroutine was developed but could not be validated. Overall, this work demonstrates that substantial improvements in the mechanical and electrical properties of SSCs are possible through control of the composite microstructure. The models developed in this work provide guidance for the optimisation of manufacturing processes and the design of new SSC architectures, and underpin the future certification and deployment of these emerging materials.Open Acces

Femtosecond laser generation of bimetallic oxide nanoparticles with potential X-ray absorbing and magnetic functionalities for medical imaging applications

Bimetallic nanoparticles have gained vivid attention due to their unique and synergistic properties. They can be used in fields such as solar cells, optics, sensing, as well as medicine. The generation of bimetallic nanoparticles, containing oxide phases of both magnetic and X-ray attenuating metals for bioimaging applications has been challenging with traditional chemical synthesis methods. An alternative is the generation of nanoparticles from binary oxide ceramics by laser ablation in liquid. However, the applicability of this technique for production of hybrid nanoparticles consisting of magnetic and X-ray absorbing elements has not been demonstrated yet. In this work, novel ceramics composed of bimetallic oxide phases of iron-tantalum, iron-tungsten, and ironbismuth were produced by a reaction-sintering method. The bulk samples were characterized with scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffractometry. Nanoparticles were produced in aqueous and ethanol solutions by employing a femtosecond laser and characterized with transmission electron microscopy, selected area electron diffraction, and energy dispersive X-ray spectroscopy. The results demonstrated that the production of binary oxide bulk ceramics and their subsequent laser ablation in liquids leads to the successful generation of bimetallic oxide nanoparticles, without a core-shell morphology. In addition, it was found that the ablation threshold fluence of bulk samples as well as the crystallinity of the synthesized nanoparticles is governed by both the nature of the metallic oxide ceramics and the employed liquid. The results pave the way for a single step generation of well-defined bimetallic nanoparticles by laser ablation that could potentially exhibit X-ray and magnetic absorption properties suitable for multimodal imaging applications.This research has been partially funded by the Spanish Ministerio de Ciencia e Innovacion through the research project MAT2015-67354R (MINECO-FEDER). Funding through a Marie Sklodowska-Curie Individual Fellowships (MSCA-IF 2014, 656908-NIMBLIS-ESR) of the Horizon 2020 program, and the Project PI-0030-2017 of the Junta de Andalucia in the framework of the integrated territorial initiative 20142020 for research and innovation in biomedicine and health sciences in the province of Cadiz is also greatly appreciated. The authors acknowledge support for scanning electron microscopy by Dr. Stephan Puchegger and the faculty center for nanostructure research at the University of Vienna

Pyroelectric Materials for Uncooled Infrared Detectors: Processing, Properties, and Applications

Uncooled pyroelectric detectors find applications in diverse and wide areas such as industrial production; automotive; aerospace applications for satellite-borne ozone sensors assembled with an infrared spectrometer; health care; space exploration; imaging systems for ships, cars, and aircraft; and military and security surveillance systems. These detectors are the prime candidates for NASA s thermal infrared detector requirements. In this Technical Memorandum, the physical phenomena underlying the operation and advantages of pyroelectric infrared detectors is introduced. A list and applications of important ferroelectrics is given, which is a subclass of pyroelectrics. The basic concepts of processing of important pyroelectrics in various forms are described: single crystal growth, ceramic processing, polymer-composites preparation, and thin- and thick-film fabrications. The present status of materials and their characteristics and detectors figures-of-merit are presented in detail. In the end, the unique techniques demonstrated for improving/enhancing the performance of pyroelectric detectors are illustrated. Emphasis is placed on recent advances and emerging technologies such as thin-film array devices and novel single crystal sensors