Intelligent systems in manufacturing: current developments and future prospects

Global competition and rapidly changing customer requirements are demanding increasing changes in manufacturing environments. Enterprises are required to constantly redesign their products and continuously reconfigure their manufacturing systems. Traditional approaches to manufacturing systems do not fully satisfy this new situation. Many authors have proposed that artificial intelligence will bring the flexibility and efficiency needed by manufacturing systems. This paper is a review of artificial intelligence techniques used in manufacturing systems. The paper first defines the components of a simplified intelligent manufacturing systems (IMS), the different Artificial Intelligence (AI) techniques to be considered and then shows how these AI techniques are used for the components of IMS

Optimal scope of supply chain network & operations design

The increasingly complex supply chain networks and operations call for the development of decision support systems and optimization techniques that take a holistic view of supply chain issues and provide support for integrated decision-making. The economic impacts of optimized supply chain are significant and that has attracted considerable research attention since the late 1990s. This doctoral thesis focuses on developing manageable and realistic optimization models for solving four contemporary and interrelated supply chain network and operations design problems. Each requires an integrated decision-making approach for advancing supply chain effectiveness and efficiency. The first model formulates the strategic robust downsizing of a global supply chain network, which requires an integrated decision-making on resource allocation and network reconfiguration, given certain financial constraints. The second model also looks at the strategic supply chain downsizing problem but extends the first model to include product portfolio selection as a downsizing decision. The third model concerns the redesign of a warranty distribution network, which requires an integrated decision-making on strategic network redesign and tactical recovery process redesign. The fourth model simultaneously determines the operational-level decisions on job assignment and process sequence in order to improve the total throughput of a production facility unit

PDNPulse: Sensing PCB Anomaly with the Intrinsic Power Delivery Network

The ubiquitous presence of printed circuit boards (PCBs) in modern electronic systems and embedded devices makes their integrity a top security concern. To take advantage of the economies of scale, today's PCB design and manufacturing are often performed by suppliers around the globe, exposing them to many security vulnerabilities along the segmented PCB supply chain. Moreover, the increasing complexity of the PCB designs also leaves ample room for numerous sneaky board-level attacks to be implemented throughout each stage of a PCB's lifetime, threatening many electronic devices. In this paper, we propose PDNPulse, a power delivery network (PDN) based PCB anomaly detection framework that can identify a wide spectrum of board-level malicious modifications. PDNPulse leverages the fact that the PDN's characteristics are inevitably affected by modifications to the PCB, no matter how minuscule. By detecting changes to the PDN impedance profile and using the Frechet distance-based anomaly detection algorithms, PDNPulse can robustly and successfully discern malicious modifications across the system. Using PDNPulse, we conduct extensive experiments on seven commercial-off-the-shelf PCBs, covering different design scales, different threat models, and seven different anomaly types. The results confirm that PDNPulse creates an effective security asymmetry between attack and defense

Assembly Line

An assembly line is a manufacturing process in which parts are added to a product in a sequential manner using optimally planned logistics to create a finished product in the fastest possible way. It is a flow-oriented production system where the productive units performing the operations, referred to as stations, are aligned in a serial manner. The present edited book is a collection of 12 chapters written by experts and well-known professionals of the field. The volume is organized in three parts according to the last research works in assembly line subject. The first part of the book is devoted to the assembly line balancing problem. It includes chapters dealing with different problems of ALBP. In the second part of the book some optimization problems in assembly line structure are considered. In many situations there are several contradictory goals that have to be satisfied simultaneously. The third part of the book deals with testing problems in assembly line. This section gives an overview on new trends, techniques and methodologies for testing the quality of a product at the end of the assembling line

AUTOMATED GUIDED ROBOT (AGR)

This project concerns the design and fabrication of the Automated Guided Robot (AGR) prototype, utilizing artificial intelligence (AI) and genetic algorithm (GA) as a mainframe in helping the robot to generate a self-understanding of the area of work and mobilization to a destination desired by the user. The main objective of this project is to create and develop a Path Planning Mobile Robot able to avoid obstacles in its path and reach a target designated position from its starting point utilizing 3 wheel-based rover body, sensors, linear motors and microcontrollers. Compared to manual mobile robots, AGRs require sensors and control systems that generate feedback for the re-evaluation of an unexpected situation and to detect obstacles in the path the AGR is required to follow. The paper describes the network algorithms developed and used in the design process of the AGR including simulations and circuit designs done for the prototype. A general robotics circuit construction of the mainframe target board for central processing, a controller board for the sensor feedbacks and a small base tri-wheeled structure has been fabricated by the author and continual troubleshooting and enhancement has been done for these components of the AGR. Algorithm conversion to C code programming has been done throughout the project for the obstacle avoidance and path planning algorithms based upon the GA platform ofAI

A machine vision based automatic optical inspection system for measuring drilling quality of printed circuit boards

In this paper, we develop and put into practice an automatic optical inspection (AOI) system based on machine vision to check the holes on a printed circuit board (PCB). We incorporate the hardware and software. For the hardware part, we combine a PC, the three-axis positioning system, a lighting device, and charge-coupled device cameras. For the software part, we utilize image registration, image segmentation, drill numbering, drill contrast, and defect displays to achieve this system. Results indicated that an accuracy of 5 mu m could be achieved in errors of the PCB holes allowing comparisons to be made. This is significant in inspecting the missing, the multi-hole, and the incorrect location of the holes. However, previous work only focuses on one or other feature of the holes. Our research is able to assess multiple features: missing holes, incorrectly located holes, and excessive holes. Equally, our results could be displayed as a bar chart and target plot. This has not been achieved before. These displays help users to analyze the causes of errors and immediately correct the problems. In addition, this AOI system is valuable for checking a large number of holes and finding out the defective ones on a PCB. Meanwhile, we apply a 0.1-mm image resolution, which is better than others used in industry. We set a detecting standard based on 2-mm diameter of circles to diagnose the quality of the holes within 10 s

Investigation into Detection of Hardware Trojans on Printed Circuit Boards

The modern semiconductor device manufacturing flow is becoming increasingly vulnerable to malicious implants called Hardware Trojans (HT). With HTs becoming stealthier, a need for more accurate and efficient detection methods is becoming increasingly crucial at both Integrated Circuit (IC) and Printed Circuit Board (PCB) levels. While HT detection at an IC level has been widely studied, there is still very limited research on detecting and preventing HTs implanted on PCBs. In recent years the rise of outsourcing design and fabrication of electronics, including PCBs, to third parties has dramatically increased the possibility of malicious alteration and consequently the security risk for systems incorporating PCBs. Providing mechanical support for the electrical interconnections between different components, PCBs are an important part of electronic systems. Modern, complex and highly integrated designs may contain up to thirty layers, with concealed micro-vias and embedded passive components. An adversary can aim to modify the PCB design by tampering the copper interconnections or inserting extra components in an internal layer of a multi-layer board. Similar to its IC counterpart, a PCB HT can, among other things, cause system failure or leakage of private information. The disruptive actions of a carefully designed HT attack can have catastrophic implications and should therefore be taken seriously by industry, academia and the government. This thesis gives an account of work carried out in three projects concerned with HT detection on a PCB. In the first contribution a power analysis method is proposed for detecting HT components, implanted on the surface or otherwise, consuming power from the power distribution network. The assumption is that any HT device actively tampering or eavesdropping on the signals in the PCB circuit will consume electrical power. Harvesting this side-channel effect and observing the fluctuations of power consumption on the PCB power distribution network enables evincing the HT. Using a purpose-built PCB prototype, an experimental setup is developed for verification of the methodology. The results confirm the ability to detect alien components on a PCB without interference with its main functionality. In the second contribution the monitoring methodology is further developed by applying machine learning (ML) techniques to detect stealthier HTs, consuming power from I/O ports of legitimate ICs on the PCB. Two algorithms, One-Class Support Vector Machine (SVM) and Local Outlier Factor (LOF), are implemented on the legitimate power consumption data harvested experimentally from the PCB prototype. Simulation results are validated through real-life measurements and experiments are carried out on the prototype PCB. For validation of the ML classification models, one hundred categories of HTs are modelled and inserted into the datasets. Simulation results show that using the proposed methodology an HT can be detected with high prediction accuracy (F1-score at 99% for a 15 mW HT). Further, the developed ML model is uploaded to the prototype PCB for experimental validation. The results show consistency between simulations and experiments, with an average discrepancy of ±5.9% observed between One-Class SVM simulations and real-life experiments. The machine learning models developed for HT detection are low-cost in terms of memory (around 27 KB). In the third contribution an automated visual inspection methodology is proposed for detecting HTs on the surface of a PCB. It is based on a combination of conventional computer vision techniques and a dual tower Siamese Neural Network (SNN), modelled in a three stage pipeline. In the interest of making the proposed methodology broadly applicable a particular emphasis is made on the imaging modality of choice, whereby a regular digital optical camera is chosen. The dataset of PCB images is developed in a controlled environment of a photographic tent. The novelty in this work is that, instead of a generic production fault detection, the algorithm is optimised and trained specifically for implanted HT component detection on a PCB, be it active or passive. The proposed HT detection methodology is trained and tested with three groups of HTs, categorised based on their surface area, ranging from 4 mm² to 280 mm² and above. The results show that it is possible to reach effective detection accuracy of 95.1% for HTs as small as 4 mm². In case of HTs with surface area larger than 280 mm² the detection accuracy is around 96.1%, while the average performance across all HT groups is 95.6%

Smart FRP Composite Sandwich Bridge Decks in Cold Regions

INE/AUTC 12.0