Threat Analysis, Countermeaures and Design Strategies for Secure Computation in Nanometer CMOS Regime

Advancements in CMOS technologies have led to an era of Internet Of Things (IOT), where the devices have the ability to communicate with each other apart from their computational power. As more and more sensitive data is processed by embedded devices, the trend towards lightweight and efficient cryptographic primitives has gained significant momentum. Achieving a perfect security in silicon is extremely difficult, as the traditional cryptographic implementations are vulnerable to various active and passive attacks. There is also a threat in the form of hardware Trojans inserted into the supply chain by the untrusted third-party manufacturers for economic incentives. Apart from the threats in various forms, some of the embedded security applications such as random number generators (RNGs) suffer from the impacts of process variations and noise in nanometer CMOS. Despite their disadvantages, the random and unique nature of process variations can be exploited for generating unique identifiers and can be of tremendous use in embedded security. In this dissertation, we explore techniques for precise fault-injection in cryptographic hardware based on voltage/temperature manipulation and hardware Trojan insertion. We demonstrate the effectiveness of these techniques by mounting fault attacks on state-of-the-art ciphers. Physically Unclonable Functions (PUFs) are novel cryptographic primitives for extracting secret keys from complex manufacturing variations in integrated circuits (ICs). We explore the vulnerabilities of some of the popular strong PUF architectures to modeling attacks using Machine Learning (ML) algorithms. The attacks use silicon data from a test chip manufactured in IBM 32nm silicon-on-insulator (SOI) technology. Attack results demonstrate that the majority of strong PUF architectures can be predicted to very high accuracies using limited training data. We also explore the techniques to exploit unreliable data from strong PUF architectures and effectively use them to improve the prediction accuracies of modeling attacks. Motivated by the vulnerabilities of existing PUF architectures, we present a novel modeling attack resistant PUF architecture based on non-linear computing elements. Post-silicon validation results are used to demonstrate the effectiveness of the non-linear PUF architecture against modeling and fault-injection attacks. Apart from the techniques to improve the security of PUF circuits, we also present novel solutions to improve the performance of PUF circuits from the perspectives of IC fabrication and system/protocol design. Finally, we present a statistical benchmark suite to evaluate PUFs in conceptualization phase and also to enable fine-grained security assessments for varying PUF parameters. Data compressibility analyses for validating the statistical benchmark suite are also presented

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

New Techniques for On-line Testing and Fault Mitigation in GPUs

L'abstract è presente nell'allegato / the abstract is in the attachmen

New techniques for functional testing of microprocessor based systems

Electronic devices may be affected by failures, for example due to physical defects. These defects may be introduced during the manufacturing process, as well as during the normal operating life of the device due to aging. How to detect all these defects is not a trivial task, especially in complex systems such as processor cores. Nevertheless, safety-critical applications do not tolerate failures, this is the reason why testing such devices is needed so to guarantee a correct behavior at any time. Moreover, testing is a key parameter for assessing the quality of a manufactured product. Consolidated testing techniques are based on special Design for Testability (DfT) features added in the original design to facilitate test effectiveness. Design, integration, and usage of the available DfT for testing purposes are fully supported by commercial EDA tools, hence approaches based on DfT are the standard solutions adopted by silicon vendors for testing their devices. Tests exploiting the available DfT such as scan-chains manipulate the internal state of the system, differently to the normal functional mode, passing through unreachable configurations. Alternative solutions that do not violate such functional mode are defined as functional tests. In microprocessor based systems, functional testing techniques include software-based self-test (SBST), i.e., a piece of software (referred to as test program) which is uploaded in the system available memory and executed, with the purpose of exciting a specific part of the system and observing the effects of possible defects affecting it. SBST has been widely-studies by the research community for years, but its adoption by the industry is quite recent. My research activities have been mainly focused on the industrial perspective of SBST. The problem of providing an effective development flow and guidelines for integrating SBST in the available operating systems have been tackled and results have been provided on microprocessor based systems for the automotive domain. Remarkably, new algorithms have been also introduced with respect to state-of-the-art approaches, which can be systematically implemented to enrich SBST suites of test programs for modern microprocessor based systems. The proposed development flow and algorithms are being currently employed in real electronic control units for automotive products. Moreover, a special hardware infrastructure purposely embedded in modern devices for interconnecting the numerous on-board instruments has been interest of my research as well. This solution is known as reconfigurable scan networks (RSNs) and its practical adoption is growing fast as new standards have been created. Test and diagnosis methodologies have been proposed targeting specific RSN features, aimed at checking whether the reconfigurability of such networks has not been corrupted by defects and, in this case, at identifying the defective elements of the network. The contribution of my work in this field has also been included in the first suite of public-domain benchmark networks

Intermittent fault diagnosis and health monitoring for electronic interconnects

Literature survey and correspondence with industrial sector shows that No-Fault-Found (NFF) is a major concern in through life engineering services, especially for defence, aerospace, and other transport industry. There are various occurrences and root causes that result in NFF events but intermittent interconnections are the most frustrating. This is because it disappears while testing, and missed out by diagnostic equipment. This thesis describes the challenging and most important area of intermittent fault detection and health monitoring that focuses towards NFF situation in electronics interconnections. After introduction, this thesis starts with literature survey and describes financial impact on aerospace and other transport industry. It highlights NFF technologies and discuss different facts and their impact on NFF. Then It goes into experimental study that how repeatedly intermittent fault could be replicated. It describes a novel fault replicator that can generate repeatedly IFs for further experimental study on diagnosis techniques/algorithms. The novel IF replicator provide for single and multipoint intermittent connection. The experimental work focuses on mechanically induced intermittent conditions in connectors. This work illustrates a test regime that can be used to repeatedly reproduce intermittency in electronic connectors whilst subjected to vibration ... [cont.]

Hardware Acceleration of Electronic Design Automation Algorithms

With the advances in very large scale integration (VLSI) technology, hardware is going parallel. Software, which was traditionally designed to execute on single core microprocessors, now faces the tough challenge of taking advantage of this parallelism, made available by the scaling of hardware. The work presented in this dissertation studies the acceleration of electronic design automation (EDA) software on several hardware platforms such as custom integrated circuits (ICs), field programmable gate arrays (FPGAs) and graphics processors. This dissertation concentrates on a subset of EDA algorithms which are heavily used in the VLSI design flow, and also have varying degrees of inherent parallelism in them. In particular, Boolean satisfiability, Monte Carlo based statistical static timing analysis, circuit simulation, fault simulation and fault table generation are explored. The architectural and performance tradeoffs of implementing the above applications on these alternative platforms (in comparison to their implementation on a single core microprocessor) are studied. In addition, this dissertation also presents an automated approach to accelerate uniprocessor code using a graphics processing unit (GPU). The key idea is to partition the software application into kernels in an automated fashion, such that multiple instances of these kernels, when executed in parallel on the GPU, can maximally benefit from the GPU?s hardware resources. The work presented in this dissertation demonstrates that several EDA algorithms can be successfully rearchitected to maximally harness their performance on alternative platforms such as custom designed ICs, FPGAs and graphic processors, and obtain speedups upto 800X. The approaches in this dissertation collectively aim to contribute towards enabling the computer aided design (CAD) community to accelerate EDA algorithms on arbitrary hardware platforms

Probabilistische Verfahren für den Test hochintegrierter Schaltungen

Es setzt sich heute immer mehr die Erkenntnis durch, daß anwendungsspezifische hochintegrierte Schaltungen nur dann wirtschaftlich eingesetzt werden können, wenn bereits beim Entwurf die Testerzeugung und Testdurchführung berücksichtigt werden. Um die Ausbildung für den rechnergestützten Schaltungsentwurf an der Fakultät für Informatik der Universität Karlsruhe entsprechend abzurunden, hat der Autor seit dem Wintersemester 1985/1986 die Vorlesung "Testprobleme hochintegrierter Schaltungen" angeboten. Etwa zum gleichen Zeitpunkt etablierte sich am dortigen Institut für Rechnerentwurf und Fehlertoleranz die Forschungsgruppe "Prüfgerechter Entwurf und Test". Das vorliegende Buch vereinigt die Erfahrungen aus der Vorlesung und die Ergebnisse der Forschungsgruppe. Es gibt einen Überblick über wichtige Techniken des prüfgerechten Entwurfs, des Selbsttests sowie der Testerzeugung, und es enthält zahlreiche neue Vorschläge auf diesem Gebiet

Cumulative index to NASA Tech Briefs, 1986-1990, volumes 10-14

Tech Briefs are short announcements of new technology derived from the R&D activities of the National Aeronautics and Space Administration. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This cumulative index of Tech Briefs contains abstracts and four indexes (subject, personal author, originating center, and Tech Brief number) and covers the period 1986 to 1990. The abstract section is organized by the following subject categories: electronic components and circuits, electronic systems, physical sciences, materials, computer programs, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

NASA Tech Briefs, Fall 1985

Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences

Abstracts on Radio Direction Finding (1899 - 1995)

The files on this record represent the various databases that originally composed the CD-ROM issue of "Abstracts on Radio Direction Finding" database, which is now part of the Dudley Knox Library's Abstracts and Selected Full Text Documents on Radio Direction Finding (1899 - 1995) Collection. (See Calhoun record https://calhoun.nps.edu/handle/10945/57364 for further information on this collection and the bibliography). Due to issues of technological obsolescence preventing current and future audiences from accessing the bibliography, DKL exported and converted into the three files on this record the various databases contained in the CD-ROM. The contents of these files are: 1) RDFA_CompleteBibliography_xls.zip [RDFA_CompleteBibliography.xls: Metadata for the complete bibliography, in Excel 97-2003 Workbook format; RDFA_Glossary.xls: Glossary of terms, in Excel 97-2003 Workbookformat; RDFA_Biographies.xls: Biographies of leading figures, in Excel 97-2003 Workbook format]; 2) RDFA_CompleteBibliography_csv.zip [RDFA_CompleteBibliography.TXT: Metadata for the complete bibliography, in CSV format; RDFA_Glossary.TXT: Glossary of terms, in CSV format; RDFA_Biographies.TXT: Biographies of leading figures, in CSV format]; 3) RDFA_CompleteBibliography.pdf: A human readable display of the bibliographic data, as a means of double-checking any possible deviations due to conversion