Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Massive Data-Centric Parallelism in the Chiplet Era

Traditionally, massively parallel applications are executed on distributed systems, where computing nodes are distant enough that the parallelization schemes must minimize communication and synchronization to achieve scalability. Mapping communication-intensive workloads to distributed systems requires complicated problem partitioning and dataset pre-processing. With the current AI-driven trend of having thousands of interconnected processors per chip, there is an opportunity to re-think these communication-bottlenecked workloads. This bottleneck often arises from data structure traversals, which cause irregular memory accesses and poor cache locality. Recent works have introduced task-based parallelization schemes to accelerate graph traversal and other sparse workloads. Data structure traversals are split into tasks and pipelined across processing units (PUs). Dalorex demonstrated the highest scalability (up to thousands of PUs on a single chip) by having the entire dataset on-chip, scattered across PUs, and executing the tasks at the PU where the data is local. However, it also raised questions on how to scale to larger datasets when all the memory is on chip, and at what cost. To address these challenges, we propose a scalable architecture composed of a grid of Data-Centric Reconfigurable Array (DCRA) chiplets. Package-time reconfiguration enables creating chip products that optimize for different target metrics, such as time-to-solution, energy, or cost, while software reconfigurations avoid network saturation when scaling to millions of PUs across many chip packages. We evaluate six applications and four datasets, with several configurations and memory technologies, to provide a detailed analysis of the performance, power, and cost of data-local execution at scale. Our parallelization of Breadth-First-Search with RMAT-26 across a million PUs reaches 3323 GTEPS

Classification of networks-on-chip in the context of analysis of promising self-organizing routing algorithms

This paper contains a detailed analysis of the current state of the network-on-chip (NoC) research field, based on which the authors propose the new NoC classification that is more complete in comparison with previous ones. The state of the domain associated with wireless NoC is investigated, as the transition to these NoCs reduces latency. There is an assumption that routing algorithms from classical network theory may demonstrate high performance. So, in this article, the possibility of the usage of self-organizing algorithms in a wireless NoC is also provided. This approach has a lot of advantages described in the paper. The results of the research can be useful for developers and NoC manufacturers as specific recommendations, algorithms, programs, and models for the organization of the production and technological process.Comment: 10 p., 5 fig. Oral presentation on APSSE 2021 conferenc

Design and Implementation of High QoS 3D-NoC using Modified Double Particle Swarm Optimization on FPGA

One technique to overcome the exponential growth bottleneck is to increase the number of cores on a processor, although having too many cores might cause issues including chip overheating and communication blockage. The problem of the communication bottleneck on the chip is presently effectively resolved by networks-on-chip (NoC). A 3D stack of chips is now possible, thanks to recent developments in IC manufacturing techniques, enabling to reduce of chip area while increasing chip throughput and reducing power consumption. The automated process associated with mapping applications to form three-dimensional NoC architectures is a significant new path in 3D NoC research. This work proposes a 3D NoC partitioning approach that can identify the 3D NoC region that has to be mapped. A double particle swarm optimization (DPSO) inspired algorithmic technique, which may combine the characteristics having neighbourhood search and genetic architectures, also addresses the challenge of a particle swarm algorithm descending into local optimal solutions. Experimental evidence supports the claim that this hybrid optimization algorithm based on Double Particle Swarm Optimisation outperforms the conventional heuristic technique in terms of output rate and loss in energy. The findings demonstrate that in a network of the same size, the newly introduced router delivers the lowest loss on the longest path.  Three factors, namely energy, latency or delay, and throughput, are compared between the suggested 3D mesh ONoC and its 2D version. When comparing power consumption between 3D ONoC and its electronic and 2D equivalents, which both have 512 IP cores, it may save roughly 79.9% of the energy used by the electronic counterpart and 24.3% of the energy used by the latter. The network efficiency of the 3D mesh ONoC is simulated by DPSO in a variety of configurations. The outcomes also demonstrate an increase in performance over the 2D ONoC. As a flexible communication solution, Network-On-Chips (NoCs) have been frequently employed in the development of multiprocessor system-on-chips (MPSoCs). By outsourcing their communication activities, NoCs permit on-chip Intellectual Property (IP) cores to communicate with one another and function at a better level. The important components in assigning application duties, distributing the work to the IPs, and coordinating communication among them are mapping and scheduling methods. This study aims to present an entirely advanced form of research in the area of 3D NoC mapping and scheduling applications, grouping the results according to various parameters and offering several suggestions for further research

Cross-Layer Rapid Prototyping and Synthesis of Application-Specific and Reconfigurable Many-accelerator Platforms

Technological advances of recent years laid the foundation consolidation of informatisationof society, impacting on economic, political, cultural and socialdimensions. At the peak of this realization, today, more and more everydaydevices are connected to the web, giving the term ”Internet of Things”. The futureholds the full connection and interaction of IT and communications systemsto the natural world, delimiting the transition to natural cyber systems and offeringmeta-services in the physical world, such as personalized medical care, autonomoustransportation, smart energy cities etc. . Outlining the necessities of this dynamicallyevolving market, computer engineers are required to implement computingplatforms that incorporate both increased systemic complexity and also cover awide range of meta-characteristics, such as the cost and design time, reliabilityand reuse, which are prescribed by a conflicting set of functional, technical andconstruction constraints. This thesis aims to address these design challenges bydeveloping methodologies and hardware/software co-design tools that enable therapid implementation and efficient synthesis of architectural solutions, which specifyoperating meta-features required by the modern market. Specifically, this thesispresents a) methodologies to accelerate the design flow for both reconfigurableand application-specific architectures, b) coarse-grain heterogeneous architecturaltemplates for processing and communication acceleration and c) efficient multiobjectivesynthesis techniques both at high abstraction level of programming andphysical silicon level.Regarding to the acceleration of the design flow, the proposed methodologyemploys virtual platforms in order to hide architectural details and drastically reducesimulation time. An extension of this framework introduces the systemicco-simulation using reconfigurable acceleration platforms as co-emulation intermediateplatforms. Thus, the development cycle of a hardware/software productis accelerated by moving from a vertical serial flow to a circular interactive loop.Moreover the simulation capabilities are enriched with efficient detection and correctiontechniques of design errors, as well as control methods of performancemetrics of the system according to the desired specifications, during all phasesof the system development. In orthogonal correlation with the aforementionedmethodological framework, a new architectural template is proposed, aiming atbridging the gap between design complexity and technological productivity usingspecialized hardware accelerators in heterogeneous systems-on-chip and networkon-chip platforms. It is presented a novel co-design methodology for the hardwareaccelerators and their respective programming software, including the tasks allocationto the available resources of the system/network. The introduced frameworkprovides implementation techniques for the accelerators, using either conventionalprogramming flows with hardware description language or abstract programmingmodel flows, using techniques from high-level synthesis. In any case, it is providedthe option of systemic measures optimization, such as the processing speed,the throughput, the reliability, the power consumption and the design silicon area.Finally, on addressing the increased complexity in design tools of reconfigurablesystems, there are proposed novel multi-objective optimization evolutionary algo-rithms which exploit the modern multicore processors and the coarse-grain natureof multithreaded programming environments (e.g. OpenMP) in order to reduce theplacement time, while by simultaneously grouping the applications based on theirintrinsic characteristics, the effectively explore the design space effectively.The efficiency of the proposed architectural templates, design tools and methodologyflows is evaluated in relation to the existing edge solutions with applicationsfrom typical computing domains, such as digital signal processing, multimedia andarithmetic complexity, as well as from systemic heterogeneous environments, suchas a computer vision system for autonomous robotic space navigation and manyacceleratorsystems for HPC and workstations/datacenters. The results strengthenthe belief of the author, that this thesis provides competitive expertise to addresscomplex modern - and projected future - design challenges.Οι τεχνολογικές εξελίξεις των τελευταίων ετών έθεσαν τα θεμέλια εδραίωσης της πληροφοριοποίησης της κοινωνίας, επιδρώντας σε οικονομικές,πολιτικές, πολιτιστικές και κοινωνικές διαστάσεις. Στο απόγειο αυτής τη ςπραγμάτωσης, σήμερα, ολοένα και περισσότερες καθημερινές συσκευές συνδέονται στο παγκόσμιο ιστό, αποδίδοντας τον όρο «Ίντερνετ των πραγμάτων».Το μέλλον επιφυλάσσει την πλήρη σύνδεση και αλληλεπίδραση των συστημάτων πληροφορικής και επικοινωνιών με τον φυσικό κόσμο, οριοθετώντας τη μετάβαση στα συστήματα φυσικού κυβερνοχώρου και προσφέροντας μεταυπηρεσίες στον φυσικό κόσμο όπως προσωποποιημένη ιατρική περίθαλψη, αυτόνομες μετακινήσεις, έξυπνες ενεργειακά πόλεις κ.α. . Σκιαγραφώντας τις ανάγκες αυτής της δυναμικά εξελισσόμενης αγοράς, οι μηχανικοί υπολογιστών καλούνται να υλοποιήσουν υπολογιστικές πλατφόρμες που αφενός ενσωματώνουν αυξημένη συστημική πολυπλοκότητα και αφετέρου καλύπτουν ένα ευρύ φάσμα μεταχαρακτηριστικών, όπως λ.χ. το κόστος σχεδιασμού, ο χρόνος σχεδιασμού, η αξιοπιστία και η επαναχρησιμοποίηση, τα οποία προδιαγράφονται από ένα αντικρουόμενο σύνολο λειτουργικών, τεχνολογικών και κατασκευαστικών περιορισμών. Η παρούσα διατριβή στοχεύει στην αντιμετώπιση των παραπάνω σχεδιαστικών προκλήσεων, μέσω της ανάπτυξης μεθοδολογιών και εργαλείων συνσχεδίασης υλικού/λογισμικού που επιτρέπουν την ταχεία υλοποίηση καθώς και την αποδοτική σύνθεση αρχιτεκτονικών λύσεων, οι οποίες προδιαγράφουν τα μετα-χαρακτηριστικά λειτουργίας που απαιτεί η σύγχρονη αγορά. Συγκεκριμένα, στα πλαίσια αυτής της διατριβής, παρουσιάζονται α) μεθοδολογίες επιτάχυνσης της ροής σχεδιασμού τόσο για επαναδιαμορφούμενες όσο και για εξειδικευμένες αρχιτεκτονικές, β) ετερογενή αδρομερή αρχιτεκτονικά πρότυπα επιτάχυνσης επεξεργασίας και επικοινωνίας και γ) αποδοτικές τεχνικές πολυκριτηριακής σύνθεσης τόσο σε υψηλό αφαιρετικό επίπεδο προγραμματισμού,όσο και σε φυσικό επίπεδο πυριτίου.Αναφορικά προς την επιτάχυνση της ροής σχεδιασμού, προτείνεται μια μεθοδολογία που χρησιμοποιεί εικονικές πλατφόρμες, οι οποίες αφαιρώντας τις αρχιτεκτονικές λεπτομέρειες καταφέρνουν να μειώσουν σημαντικά το χρόνο εξομοίωσης. Παράλληλα, εισηγείται η συστημική συν-εξομοίωση με τη χρήση επαναδιαμορφούμενων πλατφορμών, ως μέσων επιτάχυνσης. Με αυτόν τον τρόπο, ο κύκλος ανάπτυξης ενός προϊόντος υλικού, μετατεθειμένος από την κάθετη σειριακή ροή σε έναν κυκλικό αλληλεπιδραστικό βρόγχο, καθίσταται ταχύτερος, ενώ οι δυνατότητες προσομοίωσης εμπλουτίζονται με αποδοτικότερες μεθόδους εντοπισμού και διόρθωσης σχεδιαστικών σφαλμάτων, καθώς και μεθόδους ελέγχου των μετρικών απόδοσης του συστήματος σε σχέση με τις επιθυμητές προδιαγραφές, σε όλες τις φάσεις ανάπτυξης του συστήματος. Σε ορθογώνια συνάφεια με το προαναφερθέν μεθοδολογικό πλαίσιο, προτείνονται νέα αρχιτεκτονικά πρότυπα που στοχεύουν στη γεφύρωση του χάσματος μεταξύ της σχεδιαστικής πολυπλοκότητας και της τεχνολογικής παραγωγικότητας, με τη χρήση συστημάτων εξειδικευμένων επιταχυντών υλικού σε ετερογενή συστήματα-σε-ψηφίδα καθώς και δίκτυα-σε-ψηφίδα. Παρουσιάζεται κατάλληλη μεθοδολογία συν-σχεδίασης των επιταχυντών υλικού και του λογισμικού προκειμένου να αποφασισθεί η κατανομή των εργασιών στους διαθέσιμους πόρους του συστήματος/δικτύου. Το μεθοδολογικό πλαίσιο προβλέπει την υλοποίηση των επιταχυντών είτε με συμβατικές μεθόδους προγραμματισμού σε γλώσσα περιγραφής υλικού είτε με αφαιρετικό προγραμματιστικό μοντέλο με τη χρήση τεχνικών υψηλού επιπέδου σύνθεσης. Σε κάθε περίπτωση, δίδεται η δυνατότητα στο σχεδιαστή για βελτιστοποίηση συστημικών μετρικών, όπως η ταχύτητα επεξεργασίας, η ρυθμαπόδοση, η αξιοπιστία, η κατανάλωση ενέργειας και η επιφάνεια πυριτίου του σχεδιασμού. Τέλος, προκειμένου να αντιμετωπισθεί η αυξημένη πολυπλοκότητα στα σχεδιαστικά εργαλεία επαναδιαμορφούμενων συστημάτων, προτείνονται νέοι εξελικτικοί αλγόριθμοι πολυκριτηριακής βελτιστοποίησης, οι οποίοι εκμεταλλευόμενοι τους σύγχρονους πολυπύρηνους επεξεργαστές και την αδρομερή φύση των πολυνηματικών περιβαλλόντων προγραμματισμού (π.χ. OpenMP), μειώνουν το χρόνο επίλυσης του προβλήματος της τοποθέτησης των λογικών πόρων σε φυσικούς,ενώ ταυτόχρονα, ομαδοποιώντας τις εφαρμογές βάση των εγγενών χαρακτηριστικών τους, διερευνούν αποτελεσματικότερα το χώρο σχεδίασης.Η αποδοτικότητά των προτεινόμενων αρχιτεκτονικών προτύπων και μεθοδολογιών επαληθεύτηκε σε σχέση με τις υφιστάμενες λύσεις αιχμής τόσο σε αυτοτελής εφαρμογές, όπως η ψηφιακή επεξεργασία σήματος, τα πολυμέσα και τα προβλήματα αριθμητικής πολυπλοκότητας, καθώς και σε συστημικά ετερογενή περιβάλλοντα, όπως ένα σύστημα όρασης υπολογιστών για αυτόνομα διαστημικά ρομποτικά οχήματα και ένα σύστημα πολλαπλών επιταχυντών υλικού για σταθμούς εργασίας και κέντρα δεδομένων, στοχεύοντας εφαρμογές υψηλής υπολογιστικής απόδοσης (HPC). Τα αποτελέσματα ενισχύουν την πεποίθηση του γράφοντα, ότι η παρούσα διατριβή παρέχει ανταγωνιστική τεχνογνωσία για την αντιμετώπιση των πολύπλοκων σύγχρονων και προβλεπόμενα μελλοντικών σχεδιαστικών προκλήσεων

Energy and performance-aware application mapping for inhomogeneous 3D networks-on-chip

Three dimensional Networks-on-Chip (3D NoCs) have evolved as an ideal solution to the communication demands and complexity of future high density many core architectures. However, the design practicality of 3D NoCs faces several challenges such as thermal issues, high power consumption and area overhead of 3D routers as well as high complexity and cost of vertical link implementation. To mitigate the performance and manufacturing cost of 3D NoCs, inhomogeneous architectures have emerged to combine 2D and 3D routers in 3D NoCs producing lower area and energy consumption while maintaining the performance of homogeneous 3D NoCs. Due to the limited number of vertical links, application mapping on inhomogeneous 3D NoCs can be complex. However, application mapping has a great impact on the performance and energy consumption of NoCs. This paper presents an energy and performance aware application mapping algorithm for inhomogeneous 3D NoCs. The algorithm has been evaluated with various realistic traffic patterns and compared with existing mapping algorithms. Experimental results show NoCs mapped with the proposed algorithm have lower energy consumption and significant reduction in packet delays compared to the existing algorithms and comparable average packet latency with Branch-and-Bound

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Performance and Energy Trade-offs for 3D IC NoC Interconnects and Architectures

With the increased complexity and continual scaling of integrated circuit performance, multi-core chips with dozens, hundreds, even thousands of parallel computing units require high performance interconnects to maximize data throughput and minimize latency and energy consumption. High core counts render bus based interconnects inefficient and lackluster in performance. Networks-on-Chip were introduced to simplify the interconnect design process and maintain a more scalable interconnection architecture. With the continual scaling of feature sizes for smaller and smaller transistors, the global interconnections of planar integrated circuits are consuming higher energy proportional to the rest of the chip power dissipation as well as increasing communication delays. Three-dimensional integrated circuits were introduced to shorten global wire lengths and increase chip connectivity. These 3D ICs bring heat dissipation challenges as the power density increases drastically for each additional chip layer. One of the most popularly researched vertical interconnection technologies is through-silicon vias (TSVs). TSVs require additional manufacturing steps to build but generally have low energy dissipation and good performance. Alternative wireless technologies such as capacitive or inductive coupling do not require additional manufacturing steps and also provide the option of having a liquid cooling layer between planar chips. They are typically much slower and consume more energy than their wired counterparts, however. This work compares the interconnection technologies across several different NoC architectures including a proposed sparse 3D mesh for inductive coupling that increases vertical throughput per link and reduces chip area compared to the other wireless architectures and technologies

A survey on scheduling and mapping techniques in 3D Network-on-chip

Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions