Emerging Run-Time Reconfigurable FPGA and CAD Tools

Field-programmable gate array (FPGA) is a post fabrication reconfigurable device to accelerate domain specific computing systems. It offers offer high operation speed and low power consumption. However, the design flexibility and performance of FPGAs are severely constrained by the costly on-chip memories, e.g. static random access memory (SRAM) and FLASH memory. The objective of my dissertation is to explore the opportunity and enable the use of the emerging resistance random access memory (ReRAM) in FPGA design. The emerging ReRAM technology features high storage density, low access power consumption, and CMOS compatibility, making it a promising candidate for FPGA implementation. In particular, ReRAM has advantages of the fast access and nonvolatility, enabling the on-chip storage and access of configuration data. In this dissertation, I first propose a novel three-dimensional stacking scheme, namely, high-density interleaved memory (HIM). The structure improves the density of ReRAM meanwhile effectively reducing the signal interference induced by sneak paths in crossbar arrays. To further enhance the access speed and design reliability, a fast sensing circuit is also presented which includes a new sense amplifier scheme and reference cell configuration. The proposed ReRAM FPGA leverages a similar architecture as conventional SRAM based FPGAs but utilizes ReRAM technology in all component designs. First, HIM is used to implement look-up table (LUT) and block random access memories (BRAMs) for func- tionality process. Second, a 2R1T, two ReRAM cells and one transistor, nonvolatile switch design is applied to construct connection blocks (CBs) and switch blocks (SBs) for signal transition. Furthermore, unified BRAM (uBRAM) based on the current BRAM architecture iv is introduced, offering both configuration and temporary data storage. The uBRAMs provides extremely high density effectively and enlarges the FPGA capacity, potentially saving multiple contexts of configuration. The fast configuration scheme from uBRAM to logic and routing components also makes fast run-time partial reconfiguration (PR) much easier, improving the flexibility and performance of the entire FPGA system. Finally, modern place and route tools are designed for homogeneous fabric of FPGA. The PR feature, however, requires the support of heterogeneous logic modules in order to differentiate PR modules from static ones and therefore maintain the signal integration. The existing approaches still reply on designers’ manual effort, which significantly prolongs design time and lowers design efficiency. In this dissertation, I integrate PR support into VPR – an academic place and route tool by introducing a B*-tree modular placer (BMP) and PR-aware router. As such, users are able to explore new architectures or map PR applications to a variety of FPGAs. More importantly, this enhanced feature can also support fast design automation, e.g. mapping IP core, loading pre-synthesizing logic modules, etc

Leveraging RRAM to Design Efficient Digital Circuits and Systems for Beyond Von Neumann in-Memory Computing

Due to the physical separation of their processing elements and storage units, contemporary digital computers are confronted with the thorny memory-wall problem. The strategy of in-memory computing has been considered as a promising solution to overcome the von Neumann bottleneck and design high-performance, energy-efficient computing systems. Moreover, in the post Moore era, post-CMOS technologies have received intense interests for possible future digital logic applications beyond the CMOS scaling limits. Motivated by these perspectives from system level to device level, this thesis proposes two effective processing-in-memory schemes to construct the non-von Neumann systems based on nonvolatile resistive random-access memory (RRAM). In the first scheme, we present functionally complete stateful logic gates based on a CMOS-compatible 2-transistor-2-RRAM (2T2R) structure. In this structure, the programmable logic functionality is determined by the amplitude of operation voltages, rather than its circuit topology. A reconfigurable 3T2R chain with programmable interconnects is used to implement complex combinational logic circuits. The design has a highly regular and symmetric circuit structure, making it easy for design, integration, and fabrication, while the operations are flexible yet clean. Easily integrated as 3-dimensional (3-D) stacked arrays, two proposed memory architectures not only serve as regular 3-D memory arrays but also perform in-memory-computing within the same layer and between the stacked layers. The second scheme leverages hybrid logic in the same hardware to design efficient digital circuits and systems with low computational complexity. Multiple-bit ripple-carry adder (RCA), pipelined RCA, and prefix tree adder are shown as example circuits, using the same regular chain structure, to validate the design efficiency. The design principles, computational complexity, and performance are discussed and compared to the CMOS technology and other state-of-the-art post-CMOS implementations. The overall evaluation shows superior performance in speed and area. The result of the study could build a technology cell library that can be potentially used as input to a technology-mapping algorithm. The proposed hybrid-logic methodology presents prospect of hardware acceleration and future beyond-von Neumann in-memory computing architectures

Evaluation of phase change materials for reconfigurable interconnects

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2010.Cataloged from PDF version of thesis.Includes bibliographical references (p. 76-80).The possible use of programmable integrated circuit interconnect vias using an indirectly heated phase change material is evaluated. Process development and materials investigations are examined. Devices capable of multiple cycles between on/off states for reconfigurable applications have been successfully demonstrated in a standard CMOS-compatible technology. Building computer chips with these vias would create a new kind of field programmable gate array (FPGA), whereby the design can be reconfigured depending on its application. The phase change reprogrammable-via is nonvolatile, unlike SRAM-based technology. It also has a relatively low on-state resistance and occupies less real estate on the chip. As the "switches" are placed at the metallization level, it provides flexibility for the designer to place them. Programmable-via can operate at a relatively low voltage compared to FLASH-based technology. Similar to the case of antifuses, programmable-via interconnect structures are projected to be radiation hard. However, the most challenging part of implementation is the circuit design. Issues such as integration of materials and design with current tools need to be overcome. A lack of expert personnel in this area also makes the implementation of programmable-via FPGAs complicated. The market for FPGA is promising due to the attraction of the programmable logic market. An intellectual Property (IP) analysis indicates there exist a significant new space for exploration in this area. The best-suited business model is as a new start-up that demonstrates feasibility and develops intellectual property. The potential commercialization of such technology is also discussed. Although this concept is promising result, more research is needed to show the reliability and feasibility of such a technology in complex circuits. It will take some time before this approach can be considered for production.by Chee Ying Khoo.M.Eng

Nouvelles Architectures Hybrides (Logique / Mémoires Non-Volatiles et technologies associées.)

Les nouvelles approches de technologies mémoires permettront une intégration dite back-end, où les cellules élémentaires de stockage seront fabriquées lors des dernières étapes de réalisation à grande échelle du circuit. Ces approches innovantes sont souvent basées sur l'utilisation de matériaux actifs présentant deux états de résistance distincts. Le passage d'un état à l'autre est contrôlé en courant ou en tension donnant lieu à une caractéristique I-V hystérétique. Nos mémoires résistives sont composées d'argent en métal électrochimiquement actif et de sulfure amorphe agissant comme électrolyte. Leur fonctionnement repose sur la formation réversible et la dissolution d'un filament conducteur. Le potentiel d'application de ces nouveaux dispositifs n'est pas limité aux mémoires ultra-haute densité mais aussi aux circuits embarqués. En empilant ces mémoires dans la troisième dimension au niveau des interconnections des circuits logiques CMOS, de nouvelles architectures hybrides et innovantes deviennent possibles. Il serait alors envisageable d'exploiter un fonctionnement à basse énergie, à haute vitesse d'écriture/lecture et de haute performance telles que l'endurance et la rétention. Dans cette thèse, en se concentrant sur les aspects de la technologie de mémoire en vue de développer de nouvelles architectures, l'introduction d'une fonctionnalité non-volatile au niveau logique est démontrée par trois circuits hybrides: commutateurs de routage non volatiles dans un Field Programmable Gate Arrays, un 6T-SRAM non volatile, et les neurones stochastiques pour un réseau neuronal. Pour améliorer les solutions existantes, les limitations de la performances des dispositifs mémoires sont identifiés et résolus avec des nouveaux empilements ou en fournissant des défauts de circuits tolérants.Novel approaches in the field of memory technology should enable backend integration, where individual storage nodes will be fabricated during the last fabrication steps of the VLSI circuit. In this case, memory operation is often based upon the use of active materials with resistive switching properties. A topology of resistive memory consists of silver as electrochemically active metal and amorphous sulfide acting as electrolyte and relies on the reversible formation and dissolution of a conductive filament. The application potential of these new memories is not limited to stand-alone (ultra-high density), but is also suitable for embedded applications. By stacking these memories in the third dimension at the interconnection level of CMOS logic, new ultra-scalable hybrid architectures becomes possible which exploit low energy operation, fast write/read access and high performance with respect to endurance and retention. In this thesis, focusing on memory technology aspects in view of developing new architectures, the introduction of non-volatile functionality at the logic level is demonstrated through three hybrid (CMOS logic ReRAM devices) circuits: nonvolatile routing switches in a Field Programmable Gate Array, nonvolatile 6T-SRAMs, and stochastic neurons of an hardware neural network. To be competitive or even improve existing solutions, limitations on the memory devices performances are identified and solved by stack engineering of CBRAM devices or providing faults tolerant circuits.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Heterogeneous Reconfigurable Fabrics for In-circuit Training and Evaluation of Neuromorphic Architectures

A heterogeneous device technology reconfigurable logic fabric is proposed which leverages the cooperating advantages of distinct magnetic random access memory (MRAM)-based look-up tables (LUTs) to realize sequential logic circuits, along with conventional SRAM-based LUTs to realize combinational logic paths. The resulting Hybrid Spin/Charge FPGA (HSC-FPGA) using magnetic tunnel junction (MTJ) devices within this topology demonstrates commensurate reductions in area and power consumption over fabrics having LUTs constructed with either individual technology alone. Herein, a hierarchical top-down design approach is used to develop the HSCFPGA starting from the configurable logic block (CLB) and slice structures down to LUT circuits and the corresponding device fabrication paradigms. This facilitates a novel architectural approach to reduce leakage energy, minimize communication occurrence and energy cost by eliminating unnecessary data transfer, and support auto-tuning for resilience. Furthermore, HSC-FPGA enables new advantages of technology co-design which trades off alternative mappings between emerging devices and transistors at runtime by allowing dynamic remapping to adaptively leverage the intrinsic computing features of each device technology. HSC-FPGA offers a platform for fine-grained Logic-In-Memory architectures and runtime adaptive hardware. An orthogonal dimension of fabric heterogeneity is also non-determinism enabled by either low-voltage CMOS or probabilistic emerging devices. It can be realized using probabilistic devices within a reconfigurable network to blend deterministic and probabilistic computational models. Herein, consider the probabilistic spin logic p-bit device as a fabric element comprising a crossbar-structured weighted array. The Programmability of the resistive network interconnecting p-bit devices can be achieved by modifying the resistive states of the array\u27s weighted connections. Thus, the programmable weighted array forms a CLB-scale macro co-processing element with bitstream programmability. This allows field programmability for a wide range of classification problems and recognition tasks to allow fluid mappings of probabilistic and deterministic computing approaches. In particular, a Deep Belief Network (DBN) is implemented in the field using recurrent layers of co-processing elements to form an n x m1 x m2 x ::: x mi weighted array as a configurable hardware circuit with an n-input layer followed by i ≥ 1 hidden layers. As neuromorphic architectures using post-CMOS devices increase in capability and network size, the utility and benefits of reconfigurable fabrics of neuromorphic modules can be anticipated to continue to accelerate

Virtualizing Reconfigurable Architectures: From Fpgas To Beyond

With field-programmable gate arrays (FPGAs) being widely deployed in data centers to enhance the computing performance, an efficient virtualization support is required to fully unleash the potential of cloud FPGAs. However, the system support for FPGAs in the context of the cloud environment is still in its infancy, which leads to a low resource utilization due to the tight coupling between compilation and resource allocation. Moreover, the system support proposed in existing works is limited to a homogeneous FPGA cluster comprising identical FPGA devices, which is hard to be extended to a heterogeneous FPGA cluster that comprises multiple types of FPGAs. As the FPGA cloud is expected to become increasingly heterogeneous due to the hardware rolling upgrade strategy, it is necessary to provide efficient virtualization support for the heterogeneous FPGA cluster. In this dissertation, we first identify three pairs of conflicting requirements from runtime management and offline compilation, which are related to the tradeoff between flexibility and efficiency. These conflicting requirements are the fundamental reason why the single-level abstraction proposed in prior works for the homogeneous FPGA cluster cannot be trivially extended to the heterogeneous cluster. To decouple these conflicting requirements, we provide a two-level system abstraction. Specifically, the high-level abstraction is FPGA-agnostic and provides a simple and homogeneous view of the FPGA resources to simplify the runtime management and maximize the flexibility. On the contrary, the low-level abstraction is FPGA-specific and exposes sufficient low-level hardware details to the compilation framework to ensure the mapping quality and maximize the efficiency. This generic two-level system abstraction can also be specialized to the homogeneous FPGA cluster and/or be extended to leverage application-specific information to further improve the efficiency. We also develop a compilation framework and a modular runtime system with a heuristic-based runtime management policy to support this two-level system abstraction. By enabling a dynamic FPGA sharing at the sub-FPGA granularity, the proposed virtualization solution can deploy 1.62x more applications using the same amount of FPGA resources and reduce the compilation time by 22.6% (perform as many compilation tasks in parallel as possible) with an acceptable virtualization overhead, i.e., Finally, we use Liquid Silicon as a case study to show that the proposed virtualization solution can be extended to other spatial reconfigurable architectures. Liquid Silicon is a homogeneous reconfigurable architecture enabled by the non-volatile memory technology (i.e., RRAM). It extends the configuration capability of existing FPGAs from computation to the whole spectrum ranging from computation to data storage. It allows users to better customize hardware by flexibly partitioning hardware resources between computation and memory based on the actual usage. Instead of naively applying the proposed virtualization solution onto Liquid Silicon, we co-optimize the system abstraction and Liquid Silicon architecture to improve the performance

ENERGY EFFICIENCY EXPLORATION OF COARSE-GRAIN RECONFIGURABLE ARCHITECTURE WITH EMERGING NONVOLATILE MEMORY

With the rapid growth in consumer electronics, people expect thin, smart and powerful devices, e.g. Google Glass and other wearable devices. However, as portable electronic products become smaller, energy consumption becomes an issue that limits the development of portable systems due to battery lifetime. In general, simply reducing device size cannot fully address the energy issue. To tackle this problem, we propose an on-chip interconnect infrastructure and pro- gram storage structure for a coarse-grained reconfigurable architecture (CGRA) with emerging non-volatile embedded memory (MRAM). The interconnect is composed of a matrix of time-multiplexed switchboxes which can be dynamically reconfigured with the goal of energy reduction. The number of processors performing computation can also be adapted. The use of MRAM provides access to high-density storage and lower memory energy consumption versus more standard SRAM technologies. The combination of CGRA, MRAM, and flexible on-chip interconnection is considered for signal processing. This application domain is of interest based on its time-varying computing demands. To evaluate CGRA architectural features, prototype architectures have been pro- totyped in a field-programmable gate array (FPGA). Measurements of energy, power, instruction count, and execution time performance are considered for a scalable num- ber of processors. Applications such as adaptive Viterbi decoding and Reed Solomon coding are used for evaluation. To complete this thesis, a time-scheduled switchbox was integrated into our CGRA model. This model was prototyped on an FPGA. It is shown that energy consumption can be reduced by about 30% if dynamic design reconfiguration is performed