Temperature Evaluation of NoC Architectures and Dynamically Reconfigurable NoC

Advancements in the field of chip fabrication led to the integration of a large number of transistors in a small area, giving rise to the multi–core processor era. Massive multi–core processors facilitate innovation and research in the field of healthcare, defense, entertainment, meteorology and many others. Reduction in chip area and increase in the number of on–chip cores is accompanied by power and temperature issues. In high performance multi–core chips, power and heat are predominant constraints. High performance massive multicore systems suffer from thermal hotspots, exacerbating the problem of reliability in deep submicron technologies. High power consumption not only increases the chip temperature but also jeopardizes the integrity of the system. Hence, there is a need to explore holistic power and thermal optimization and management strategies for massive on–chip multi–core environments. In multi–core environments, the communication fabric plays a major role in deciding the efficiency of the system. In multi–core processor chips this communication infrastructure is predominantly a Network–on–Chip (NoC). Tradition NoC designs incorporate planar interconnects as a result these NoCs have long, multi–hop wireline links for data exchange. Due to the presence of multi–hop planar links such NoC architectures fall prey to high latency, significant power dissipation and temperature hotspots. Networks inspired from nature are envisioned as an enabling technology to achieve highly efficient and low power NoC designs. Adopting wireless technology in such architectures enhance their performance. Placement of wireless interconnects (WIs) alters the behavior of the network and hence a random deployment of WIs may not result in a thermally optimal solution. In such scenarios, the WIs being highly efficient would attract high traffic densities resulting in thermal hotspots. Hence, the location and utilization of the wireless links is a key factor in obtaining a thermal optimal highly efficient Network–on–chip. Optimization of the NoC framework alone is incapable of addressing the effects due to the runtime dynamics of the system. Minimal paths solely optimized for performance in the network may lead to excessive utilization of certain NoC components leading to thermal hotspots. Hence, architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance and energy–efficient multicore systems. This work contributes at exploring various wired and wireless NoC architectures that achieve best trade–offs between temperature, performance and energy–efficiency. It further proposes an adaptive routing scheme which factors in the thermal profile of the chip. The proposed routing mechanism dynamically reacts to the thermal profile of the chip and takes measures to avoid thermal hotspots, achieving a thermally efficient dynamically reconfigurable network on chip architecture

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

Architectural Exploration and Design Methodologies of Photonic Interconnection Networks

Photonic technology is becoming an increasingly attractive solution to the problems facing today's electronic chip-scale interconnection networks. Recent progress in silicon photonics research has enabled the demonstration of all the necessary optical building blocks for creating extremely high-bandwidth density and energy-efficient links for on- and off-chip communications. From the feasibility and architecture perspective however, photonics represents a dramatic paradigm shift from traditional electronic network designs due to fundamental differences in how electronics and photonics function and behave. As a result of these differences, new modeling and analysis methods must be employed in order to properly realize a functional photonic chip-scale interconnect design. In this work, we present a methodology for characterizing and modeling fundamental photonic building blocks which can subsequently be combined to form full photonic network architectures. We also describe a set of tools which can be utilized to assess the physical-layer and system-level performance properties of a photonic network. The models and tools are integrated in a novel open-source design and simulation environment called PhoenixSim. Next, we leverage PhoenixSim for the study of chip-scale photonic networks. We examine several photonic networks through the synergistic study of both physical-layer metrics and system-level metrics. This holistic analysis method enables us to provide deeper insight into architecture scalability since it considers insertion loss, crosstalk, and power dissipation. In addition to these novel physical-layer metrics, traditional system-level metrics of bandwidth and latency are also obtained. Lastly, we propose a novel routing architecture known as wavelength-selective spatial routing. This routing architecture is analogous to electronic virtual channels since it enables the transmission of multiple logical optical channels through a single physical plane (i.e. the waveguides). The available wavelength channels are partitioned into separate groups, and each group is routed independently in the network. Each partition is spectrally multiplexed, as opposed to temporally multiplexed in the electronic case. The wavelength-selective spatial routing technique benefits network designers by provider lower contention and increased path diversity

Advanced information processing system for advanced launch system: Hardware technology survey and projections

The major goals of this effort are as follows: (1) to examine technology insertion options to optimize Advanced Information Processing System (AIPS) performance in the Advanced Launch System (ALS) environment; (2) to examine the AIPS concepts to ensure that valuable new technologies are not excluded from the AIPS/ALS implementations; (3) to examine advanced microprocessors applicable to AIPS/ALS, (4) to examine radiation hardening technologies applicable to AIPS/ALS; (5) to reach conclusions on AIPS hardware building blocks implementation technologies; and (6) reach conclusions on appropriate architectural improvements. The hardware building blocks are the Fault-Tolerant Processor, the Input/Output Sequencers (IOS), and the Intercomputer Interface Sequencers (ICIS)

Doctor of Philosophy

dissertationPortable electronic devices will be limited to available energy of existing battery chemistries for the foreseeable future. However, system-on-chips (SoCs) used in these devices are under a demand to offer more functionality and increased battery life. A difficult problem in SoC design is providing energy-efficient communication between its components while maintaining the required performance. This dissertation introduces a novel energy-efficient network-on-chip (NoC) communication architecture. A NoC is used within complex SoCs due it its superior performance, energy usage, modularity, and scalability over traditional bus and point-to-point methods of connecting SoC components. This is the first academic research that combines asynchronous NoC circuits, a focus on energy-efficient design, and a software framework to customize a NoC for a particular SoC. Its key contribution is demonstrating that a simple, asynchronous NoC concept is a good match for low-power devices, and is a fruitful area for additional investigation. The proposed NoC is energy-efficient in several ways: simple switch and arbitration logic, low port radix, latch-based router buffering, a topology with the minimum number of 3-port routers, and the asynchronous advantages of zero dynamic power consumption while idle and the lack of a clock tree. The tool framework developed for this work uses novel methods to optimize the topology and router oorplan based on simulated annealing and force-directed movement. It studies link pipelining techniques that yield improved throughput in an energy-efficient manner. A simulator is automatically generated for each customized NoC, and its traffic generators use a self-similar message distribution, as opposed to Poisson, to better match application behavior. Compared to a conventional synchronous NoC, this design is superior by achieving comparable message latency with half the energy

Study of robotics systems applications to the space station program

Applications of robotics systems to potential uses of the Space Station as an assembly facility, and secondarily as a servicing facility, are considered. A typical robotics system mission is described along with the pertinent application guidelines and Space Station environmental assumptions utilized in developing the robotic task scenarios. A functional description of a supervised dual-robot space structure construction system is given, and four key areas of robotic technology are defined, described, and assessed. Alternate technologies for implementing the more routine space technology support subsystems that will be required to support the Space Station robotic systems in assembly and servicing tasks are briefly discussed. The environmental conditions impacting on the robotic configuration design and operation are reviewed

Optimize task distribution in grid computing

This thesis report is submitted in partial fulfillment of the requirements for the degree of Bachelor of Science in Computer Science and Engineering, 2008.Cataloged from PDF version of thesis report.Includes bibliographical references (page 73).Grid computing is designed to use free cycles of computer to perform large calculations by using free cycles of computer. Grid computing does not need dedicated computers to perform calculations instead it uses free cycles of computer in a network. It works like a virtual super computer, but it doesn’t involve extra hardware cost. As, it’s a cost effective its popularity is increasing day by day. Now a day’s popular applications are being made to support grid computing. For example Oracle database 10g is designed to support grid computing. Although grid computing is so popular, but implementing software for grid based system is tough. It needs task distribution among computers. So it uses different programming techniques and needs to use special API. The software we are currently using may not support grid environment. Software companies need to convert their programs to support grid environment that involves development cost. On other hand users are not able to use their current software in grid environment. So, they need to buy another program that involves extra cost. The objective of this project is to run traditional programs in grid system without any modification, so that we can run any executable program in grid system with parallel speeding performance. It will increase program compatibility and reduce cost.Shyen Muhabbat ShikderB. Computer Science and Engineerin

Performance measurement and analysis of PC based cluster server using SET of Architecture and modeling a scalable High performance cluster

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Memory Hierarchy Design for Next Generation Scalable Many-core Platforms

Performance and energy consumption in modern computing platforms is largely dominated by the memory hierarchy. The increasing computational power in the multiprocessors and accelerators, and the emergence of the data-intensive workloads (e.g. large-scale graph traversal and scientific algorithms) requiring fast transfer of large volumes of data, are two main trends which intensify this problem by putting even higher pressure on the memory hierarchy. This increasing gap between computation speed and data transfer speed is commonly referred as the “memory wall” problem. With the emergence of heterogeneous Three Dimensional (3D) Integration based on through-silicon-vias (TSV), this situation has started to recover in the past years. On one hand, it is now possible to improve memory access bandwidth and/or latency by either stacking memories directly on top of processors or through abstracted memory interfaces such as Micron’s Hybrid Memory Cube (HMC). On the other hand, near memory computation has become worthy of revisiting due to the cost-effective integration of logic and memory in 3D stacks. These two directions bring about several interesting opportunities including performance improvement, energy and cost reduction, product miniaturization, and modular design for improved time to market. In this research, we study the effectiveness of the 3D integration technology and the optimization opportunities which it can provide in the different layers of the memory hierarchy in cluster-based many-core platforms ranging from intra-cluster L1 to inter-cluster L2 scratchpad memories (SPMs), as well as the main memory. In addition, by moving a part of the computation to where data resides, in the 3D-stacked memory context, we demonstrate further energy and performance improvement opportunities