The Quantum Socket: Three-Dimensional Wiring for Extensible Quantum Computing

Quantum computing architectures are on the verge of scalability, a key requirement for the implementation of a universal quantum computer. The next stage in this quest is the realization of quantum error correction codes, which will mitigate the impact of faulty quantum information on a quantum computer. Architectures with ten or more quantum bits (qubits) have been realized using trapped ions and superconducting circuits. While these implementations are potentially scalable, true scalability will require systems engineering to combine quantum and classical hardware. One technology demanding imminent efforts is the realization of a suitable wiring method for the control and measurement of a large number of qubits. In this work, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket fully exploits the third dimension to connect classical electronics to qubits with higher density and better performance than two-dimensional methods based on wire bonding. The quantum socket is based on spring-mounted micro wires the three-dimensional wires that push directly on a micro-fabricated chip, making electrical contact. A small wire cross section (~1 mmm), nearly non-magnetic components, and functionality at low temperatures make the quantum socket ideal to operate solid-state qubits. The wires have a coaxial geometry and operate over a frequency range from DC to 8 GHz, with a contact resistance of ~150 mohm, an impedance mismatch of ~10 ohm, and minimal crosstalk. As a proof of principle, we fabricated and used a quantum socket to measure superconducting resonators at a temperature of ~10 mK.Comment: Main: 31 pages, 19 figs., 8 tables, 8 apps.; suppl.: 4 pages, 5 figs. (HiRes figs. and movies on request). Submitte

Wi-PoS : a low-cost, open source ultra-wideband (UWB) hardware platform with long range sub-GHz backbone

Ultra-wideband (UWB) localization is one of the most promising approaches for indoor localization due to its accurate positioning capabilities, immunity against multipath fading, and excellent resilience against narrowband interference. However, UWB researchers are currently limited by the small amount of feasible open source hardware that is publicly available. We developed a new open source hardware platform, Wi-PoS, for precise UWB localization based on Decawave’s DW1000 UWB transceiver with several unique features: support of both long-range sub-GHz and 2.4 GHz back-end communication between nodes, flexible interfacing with external UWB antennas, and an easy implementation of the MAC layer with the Time-Annotated Instruction Set Computer (TAISC) framework. Both hardware and software are open source and all parameters of the UWB ranging can be adjusted, calibrated, and analyzed. This paper explains the main specifications of the hardware platform, illustrates design decisions, and evaluates the performance of the board in terms of range, accuracy, and energy consumption. The accuracy of the ranging system was below 10 cm in an indoor lab environment at distances up to 5 m, and accuracy smaller than 5 cm was obtained at 50 and 75 m in an outdoor environment. A theoretical model was derived for predicting the path loss and the influence of the most important ground reflection. At the same time, the average energy consumption of the hardware was very low with only 81 mA for a tag node and 63 mA for the active anchor nodes, permitting the system to run for several days on a mobile battery pack and allowing easy and fast deployment on sites without an accessible power supply or backbone network. The UWB hardware platform demonstrated flexibility, easy installation, and low power consumption

Multi-layer atom chips for versatile atom micro manipulation

We employ a combination of optical UV- and electron-beam-lithography to create an atom chip combining sub-micron wire structures with larger conventional wires on a single substrate. The new multi-layer fabrication enables crossed wire configurations, greatly enhancing the flexibility in designing potentials for ultra cold quantum gases and Bose-Einstein condensates. Large current densities of >6 x 10^7 A/cm^2 and high voltages of up to 65 V across 0.3 micron gaps are supported by even the smallest wire structures. We experimentally demonstrate the flexibility of the next generation atom chip by producing Bose-Einstein condensates in magnetic traps created by a combination of wires involving all different fabrication methods and structure sizes.Comment: 4 pages, 5 figure

Thermosonic flip chip interconnection using electroplated copper column arrays

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