Sensor technology for advanced space missions

The capability and applications of two sensors, Spatial, High-Accuracy, Position-Encoding Sensor (SHAPES) and Fiber Optics Rotation Sensor (FORS), for advanced missions are discussed. The multiple target, 3-D position sensing capability of SHAPES meets a critical technology need for many developing applications. A major milestone of the SHAPES task was completed on schedule on May 30, 1986, by demonstrating simultaneous ranging to eight moving targets at a rate of 10 measurements per second. The range resolution to static target was shown to be 25 microns. SHAPES scheduled technology readiness will support the sensor needs of a number of early users. The next phase in the development of SHAPES is to incorporate an angular measurement CCD to provide the full 3-dimensional sensing. A flight unit design and fabrication can be complete by FY89. FORS, with its significant improvement over present technology in lifetime, performance, weight, power, and recurrent cost, will be an important technology for future space systems. Technology readiness will be demonstrated with a FORS brassboard with fully integrated IO chips by FY88. The unique capability of miniature remote sensing heads, connected to a central system, will open up new areas in control and stability of large space structures. This application requires additional study

Absorbance based light emitting diode optical sensors and sensing devices

The ever increasing demand for in situ monitoring of health, environment and security has created a need for reliable, miniaturised sensing devices. To achieve this, appropriate analytical devices are required that possess operating characteristics of reliability, low power consumption, low cost, autonomous operation capability and compatibility with wireless communications systems. The use of light emitting diodes (LEDs) as light sources is one strategy, which has been successfully applied in chemical sensing. This paper summarises the development and advancement of LED based chemical sensors and sensing devices in terms of their configuration and application, with the focus on transmittance and reflectance absorptiometric measurements

NASA Tech Briefs Index, 1977, volume 2, numbers 1-4

Announcements of new technology derived from the research and development activities of NASA are presented. Abstracts, and indexes for subject, personal author, originating center, and Tech Brief number are presented for 1977

Intrinsic, multiplexable sensors for electric field strength using structural slow light in phase-shifted fibre Bragg gratings

In this paper we demonstrate through simulation the potential for phase-shifted fibre Bragg gratings incorporating structural slow light to enable intrinsic reflection-mode point sensors for electric field or voltage. It is shown that lo-bi FBGs incorporating multiple phase shifts yield large enhancements in group index (group delay) at resonance, thus amplifying and localizing time-dependent non-reciprocal effects. A relative, multiplexable measurement of electric field by comparison of the phase unbalance between linear modes on and off resonance is proposed, yielding static resolutions of 24 V and 18 mV respectively in unpoled (dc Kerr effect) and poled (Pockels effect) fibres

Index to NASA Tech Briefs, 1975

This index contains abstracts and four indexes--subject, personal author, originating Center, and Tech Brief number--for 1975 Tech Briefs

Design of a simulated cruise scene visual attachment. Volume 1 - Design report

Television-type, out-window visual simulation image generator design and specifications for aircraft or spacecraft manned flight simulatio

Design and fabrication of a miniature pressure sensor head using direct bonded ultra-thin silicon wafers

A miniature pressure sensor head is designed and fabricated using an ultra-thin silicon membrane directly bonded to an excimer laser micromachined substrate. The pressure sensor head has its intended implementation as part of an optically interrogated device with sensitivity to pressures ranging from 0.5 to 4.0 MPa. The pressure range design is shown to be easily adjusted by tailoring the thickness of the membrane wafer. The fabrication process features numerous advantages over existing pressure sensor construction technology including a maskless procedure and no chemical etching or mechanical thinning necessary to form the membrane after bonding. An optic lever is constructed and tested using a reflective aluminum surface. The response of the optic lever device was found to be 160 mV/µm in the linear region