Design of High-Speed Multiplier with Optimised Builtinself-Test

Current trend in Integrated Circuits (IC) implementation such as System-on-Chip has contributed significant advantages in electronic product features such as high circuit performance with high number of functions, small physical area and high reliability. Since the development of System-on-Chip, which is based on integrating subsystems supplied by various Intellectual Properties (IP) Block vendors, the required design time is shorter when compared to that of full-custom IC implementation. However, testing each internal subsystems using the common scan-path method where test data are generated and analyzed externally is considered too time consuming when the number of subsystems is high. Therefore, by including Built-In-Self-Test (BIST) facility into each subsystem is considered a good solution. Commonly, BIST structure is based on random test data generation from a Linear Feedback Shift Register (LFSR) due to its simple, small and economical circuit structure. Since t he number of subsystems in an IC chip is going to be increased from time to time, improvement on the BIST approach is required to provide shorter testing time while keeping the good features of LFSR. For this reason, development of test pattern for BIST based on combination of LFSR and deterministic approach could provide one of the solutions to reduce the testing time. In this research, the possibility of combining LFSR features and deterministic test pattern was carried out. A parallel high-speed multiplier considered as one of the demanding subsystems was chosen to verify the proposed BIST performance. Results show that the testing time (with 100% fault coverage) was reduced significantly when compared to the testing time taken for the BIST that was totally based on random test data generation. One of the reasons for this achievement is only one basic cell of the multiplier is required to determine the test pattern by considering the data flow from one cell to another. Identical test data can then be applied to both multiplier inputs simultaneously. This is the significant finding of the research. Further works based on the finding are also identified

Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours

A comprehensive comparison between design for testability techniques for total dose testing of flash-based FPGAs

Radiation sources exist in different kinds of environments where electronic devices often operate. Correct device operation is usually affected negatively by radiation. The radiation resultant effect manifests in several forms depending on the operating environment of the device like total ionizing dose effect (TID), or single event effects (SEEs) such as single event upset (SEU), single event gate rupture (SEGR), and single event latch up (SEL). CMOS circuits and Floating gate MOS circuits suffer from an increase in the delay and the leakage current due to TID effect. This may damage the proper operation of the integrated circuit. Exhaustive testing is needed for devices operating in harsh conditions like space and military applications to ensure correct operations in the worst circumstances. The use of worst case test vectors (WCTVs) for testing is strongly recommended by MIL-STD-883, method 1019, which is the standard describing the procedure for testing electronic devices under radiation. However, the difficulty of generating these test vectors hinders their use in radiation testing. Testing digital circuits in the industry is usually done nowadays using design for testability (DFT) techniques as they are very mature and can be relied on. DFT techniques include, but not limited to, ad-hoc technique, built-in self test (BIST), muxed D scan, clocked scan and enhanced scan. DFT is usually used with automatic test patterns generation (ATPG) software to generate test vectors to test application specific integrated circuits (ASICs), especially with sequential circuits, against faults like stuck at faults and path delay faults. Despite all these recommendations for DFT, radiation testing has not benefited from this reliable technology yet. Also, with the big variation in the DFT techniques, choosing the right technique is the bottleneck to achieve the best results for TID testing. In this thesis, a comprehensive comparison between different DFT techniques for TID testing of flash-based FPGAs is made to help designers choose the best suitable DFT technique depending on their application. The comparison includes muxed D scan technique, clocked scan technique and enhanced scan technique. The comparison is done using ISCAS-89 benchmarks circuits. Points of comparisons include FPGA resources utilization, difficulty of designs bring-up, added delay by DFT logic and robust testable paths in each technique

Design for Test and Hardware Security Utilizing Tester Authentication Techniques

Design-for-Test (DFT) techniques have been developed to improve testability of integrated circuits. Among the known DFT techniques, scan-based testing is considered an efficient solution for digital circuits. However, scan architecture can be exploited to launch a side channel attack. Scan chains can be used to access a cryptographic core inside a system-on-chip to extract critical information such as a private encryption key. For a scan enabled chip, if an attacker is given unlimited access to apply all sorts of inputs to the Circuit-Under-Test (CUT) and observe the outputs, the probability of gaining access to critical information increases. In this thesis, solutions are presented to improve hardware security and protect them against attacks using scan architecture. A solution based on tester authentication is presented in which, the CUT requests the tester to provide a secret code for authentication. The tester authentication circuit limits the access to the scan architecture to known testers. Moreover, in the proposed solution the number of attempts to apply test vectors and observe the results through the scan architecture is limited to make brute-force attacks practically impossible. A tester authentication utilizing a Phase Locked Loop (PLL) to encrypt the operating frequency of both DUT/Tester has also been presented. In this method, the access to the critical security circuits such as crypto-cores are not granted in the test mode. Instead, a built-in self-test method is used in the test mode to protect the circuit against scan-based attacks. Security for new generation of three-dimensional (3D) integrated circuits has been investigated through 3D simulations COMSOL Multiphysics environment. It is shown that the process of wafer thinning for 3D stacked IC integration reduces the leakage current which increases the chip security against side-channel attacks

A design for testability study on a high performance automatic gain control circuit.

A comprehensive testability study on a commercial automatic gain control circuit is presented which aims to identify design for testability (DfT) modifications to both reduce production test cost and improve test quality. A fault simulation strategy based on layout extracted faults has been used to support the study. The paper proposes a number of DfT modifications at the layout, schematic and system levels together with testability. Guidelines that may well have generic applicability. Proposals for using the modifications to achieve partial self test are made and estimates of achieved fault coverage and quality levels presente

Reconfiguration based built-in self-test for analogue front-end circuits

Previous work has shown that it is feasible to implement a fully digital test evaluation function to realise partial self-test on an automatic gain control circuit (AGC). This paper extends the technique to INL, DNL, offset & gain error testing of analogue to digital converters (ADC's). It also shows how the same function can be used to test an AGC / ADC pair. An extension to full self-test is also proposed by the on-chip generation of input stimuli through reconfiguration of existing functions

Development of generic testing strategies for mixed-signal integrated circuits

Describes work at the Polytechnic of Huddersfield SERC/DTI research project IED 2/1/2121 conducted in collaboration with GEC-Plessey Semiconductors, Wolfson Microelectronics, and UMIST. The aim of the work is to develop generic testing strategies for mixed-signal (mixed analogue and digital) integrated circuits. The paper proposes a test structure for mixed-signal ICs, and details the development of a test technique and fault model for the analogue circuit cells encountered in these devices. Results obtained during the evaluation of this technique in simulation are presented, and the ECAD facilities that have contributed to this and other such projects are described