Reduction of NBTI-Induced Degradation on Ring Oscillators in FPGA

Ring Oscillators are used for variety of purposes to enhance reliability on LSIs or FPGAs. This paper introduces an aging-tolerant design structure of ring oscillators that are used in FPGAs. The structure is able to reduce NBTI-induced degradation in a ring oscillator\u27s frequency by setting PMOS transistors of look-up tables in an off-state when the oscillator is not working. The evaluation of a variety of ring oscillators using Altera Cyclone IV device (60nm technology) shows that the proposed structure is capable of controlling degradation level as well as reducing more than 37% performance degradation compared to the conventional oscillators.The 20th IEEE Pacific Rim International Symposium on Dependable Computing (PRDC 2014), Nov 19-21, 2014, Singapor

Degradation in FPGAs: Monitoring, Modeling and Mitigation

This dissertation targets the transistor aging degradation as well as the associated thermal challenges in FPGAs (since there is an exponential relation between aging and chip temperature). The main objectives are to perform experimentation, analysis and device-level model abstraction for modeling the degradation in FPGAs, then to monitor the FPGA to keep track of aging rates and ultimately to propose an aging-aware FPGA design flow to mitigate the aging

CMOS ring oscillator delay cell performance: a comparative study

A common voltage-controlled oscillator (VCO) architecture used in the phase locked loop (PLL) is the ring oscillator (RO). RO consist of number of inverters cascaded together as the input of the first stage connected to the output of the last stage. It is important to design the RO to be work at desired frequency depend on application with low power consumption. This paper presents a review the performance evaluation of different delay cell topologies the implemented in the ring oscillator. The various topologies analyzed includes current starved delay cell, differential delay cell and current follower cell. Performance evaluation includes frequency range, frequency stability, phase noise and power consumption had been reviewed and comparison of different topologies has been discussed. It is observed that starved current delay cell have lower power consumption and the different of the frequency range is small as compared to other type of delay cell

Techniques for Aging, Soft Errors and Temperature to Increase the Reliability of Embedded On-Chip Systems

This thesis investigates the challenge of providing an abstracted, yet sufficiently accurate reliability estimation for embedded on-chip systems. In addition, it also proposes new techniques to increase the reliability of register files within processors against aging effects and soft errors. It also introduces a novel thermal measurement setup that perspicuously captures the infrared images of modern multi-core processors

Bias Temperature Instability Modelling and Lifetime Prediction on Nano-scale MOSFETs

Bias Temperature Instability (BTI) is one of the most important reliability concerns for Metal Oxide Semiconductor Field Effect Transistors (MOSFET), the basic unit in integrated circuits. As the development MOSFET manufacturing technology, circuit designers need to consider device reliability during design optimization. An accurate BTI lifetime prediction methodology becomes a prerequisite. Typical BTI lifetime standard is ten years, accelerated BTI tests under high stress voltages are mandatory. BTI modelling is needed to project BTI lifetime from high voltages (accelerated condition) to operating voltage. The existing two mainstream BTI models: 1). The Reaction-Diffusion (R-D) framework and 2). The Two-Stage model cannot provide accurate lifetime prediction. Quite a few fitting parameters and unjustifiable empirical equations are needed in the R-D framework to predict the lifetime, questioning its predicting capability. The Two-stage model cannot project device lifetime from high voltages to operating voltage. Moreover, the scaling down of MOSFET feature size brings new challenges to nano-scale device lifetime prediction: 1). Nano-scale devices’ current is fluctuating due to the impact of a single charge is increasing as MOSFET scaling down, repetitive tests need to be done to achieve meaningful averaged results; 2). Nano-scale devices have significant Device-to-Device variability, making the lifetime a distribution instead of a single value. In this work a comprehensive As-grown Generation (A-G) framework based on the A-G model and defect centric theory is proposed and successfully predicts the Time Dependent Variability and lifetime on nano-scale devices. The predicting capability is validated by the good agreement between the test data and predicted values. It is speculated that the good predicting capability is due to the correct understanding of different types of defects. In the A-G framework, Time Dependent Variability is experimentally separated into Within-Device Fluctuation and the averaged degradation. Within-Device Fluctuation can be directly measured and the averaged degradation can be modelled using the A-G model. The averaged degradation in the A-G model contains: Generated Defects, As-grown Traps and Energy Alternating Defects. These defects have different kinetics against stress time thus need separate modelling. Various patterns such as Stress-Discharge-Recharge, multi-Discharging-based Multiple Pulses are designed to experimentally separate these defects based on their different charging/discharging properties. Fast-Voltage Step Stress technique is developed to reduce the testing time by 90% for the A-G framework parameter extraction, making the framework practical for potential use in industry

DEEP SUBMICRON CMOS VLSI CIRCUIT RELIABILITY MODELING, SIMULATION AND DESIGN

CMOS VLSI circuit reliability modeling and simulation have attracted intense research interest in the last two decades, and as a result almost all IC Design For Reliability (DFR) tools now try to incrementally simulate device wearout mechanisms in iterative ways. These DFR tools are capable of accurately characterizing the device wearout process and predicting its impact on circuit performance. Nevertheless, excessive simulation time and tedious parameter testing process often limit popularity of these tools in product design and fabrication. This work develops a new SPICE reliability simulation method that shifts the focus of reliability analysis from device wearout to circuit functionality. A set of accelerated lifetime models and failure equivalent circuit models are proposed for the most common MOSFET intrinsic wearout mechanisms, including Hot Carrier Injection (HCI), Time Dependent Dielectric Breakdown (TDDB), and Negative Bias Temperature Instability (NBTI). The accelerated lifetime models help to identify the most degraded transistors in a circuit in terms of the device's terminal voltage and current waveforms. Then corresponding failure equivalent circuit models are incorporated into the circuit to substitute these identified transistors. Finally, SPICE simulation is performed again to check circuit functionality and analyze the impact of device wearout on circuit operation. Device wearout effects are lumped into a very limited number of failure equivalent circuit model parameters, and circuit performance degradation and functionality are determined by the magnitude of these parameters. In this new method, it is unnecessary to perform a large number of small-step SPICE simulation iterations. Therefore, simulation time is obviously shortened in comparison to other tools. In addition, a reduced set of failure equivalent circuit model parameters, rather than a large number of device SPICE model parameters, need to be accurately characterized at each interim wearout process. Thus device testing and parameter extraction work are also significantly simplified. These advantages will allow circuit designers to perform quick and efficient circuit reliability analyses and to develop practical guidelines for reliable electronic designs

Investigating and Leveraging EM and Backscattering Side Channels for Hardware Security

This dissertation is focused on investigating and leveraging side-channel leakage for hardware security. To help designers address and take advantage of electromagnetic (EM) side channels, two methods for locating the physical sources of EM side channels have been developed. Both methods are used to investigate how the EM side-channel sources change with frequency and program activity. The second half of this dissertation introduces two methods that use side channels for component authentication. The same properties that make side channels such a threat, also make them useful for authenticating electronic components. The first method uses EM side channels for identifying integrated circuits (ICs) installed on a device. Focusing on components already integrated onto a device lets designers authenticate devices assembled by third parties. The second method uses the recently defined backscattering side channel for detecting recycled ICs. Unlike other types of side channels, backscattering is directly affected by the IC aging. Since the backscattering side channel is nondestructive and requires no additional circuitry on the IC, it is low cost. The effect of aging on the side channel is then investigated through simulation and experimentation.Ph.D

Resilient Design for Process and Runtime Variations

The main objective of this thesis is to tackle the impact of parameter variations in order to improve the chip performance and extend its lifetime