High-Density Solid-State Memory Devices and Technologies

This Special Issue aims to examine high-density solid-state memory devices and technologies from various standpoints in an attempt to foster their continuous success in the future. Considering that broadening of the range of applications will likely offer different types of solid-state memories their chance in the spotlight, the Special Issue is not focused on a specific storage solution but rather embraces all the most relevant solid-state memory devices and technologies currently on stage. Even the subjects dealt with in this Special Issue are widespread, ranging from process and design issues/innovations to the experimental and theoretical analysis of the operation and from the performance and reliability of memory devices and arrays to the exploitation of solid-state memories to pursue new computing paradigms

Flash Memory Devices

Flash memory devices have represented a breakthrough in storage since their inception in the mid-1980s, and innovation is still ongoing. The peculiarity of such technology is an inherent flexibility in terms of performance and integration density according to the architecture devised for integration. The NOR Flash technology is still the workhorse of many code storage applications in the embedded world, ranging from microcontrollers for automotive environment to IoT smart devices. Their usage is also forecasted to be fundamental in emerging AI edge scenario. On the contrary, when massive data storage is required, NAND Flash memories are necessary to have in a system. You can find NAND Flash in USB sticks, cards, but most of all in Solid-State Drives (SSDs). Since SSDs are extremely demanding in terms of storage capacity, they fueled a new wave of innovation, namely the 3D architecture. Today “3D” means that multiple layers of memory cells are manufactured within the same piece of silicon, easily reaching a terabit capacity. So far, Flash architectures have always been based on "floating gate," where the information is stored by injecting electrons in a piece of polysilicon surrounded by oxide. On the contrary, emerging concepts are based on "charge trap" cells. In summary, flash memory devices represent the largest landscape of storage devices, and we expect more advancements in the coming years. This will require a lot of innovation in process technology, materials, circuit design, flash management algorithms, Error Correction Code and, finally, system co-design for new applications such as AI and security enforcement

A cross-layer approach for new reliability-performance trade-offs in MLC NAND flash memories

In spite of the mature cell structure, the memory controller architecture of Multi-level cell (MLC) NAND Flash memories is evolving fast in an attempt to improve the uncorrected/miscorrected bit error rate (UBER) and to provide a more flexible usage model where the performance-reliability trade-off point can be adjusted at runtime. However, optimization techniques in the memory controller architecture cannot avoid a strict trade-off between UBER and read throughput. In this paper, we show that co-optimizing ECC architecture configuration in the memory controller with program algorithm selection at the technology layer, a more flexible memory sub-system arises, which is capable of unprecedented trade-offs points between performance and reliability

On the Capacity of Multilevel NAND Flash Memory Channels

In this paper, we initiate a first information-theoretic study on multilevel NAND flash memory channels with intercell interference. More specifically, for a multilevel NAND flash memory channel under mild assumptions, we first prove that such a channel is indecomposable and it features asymptotic equipartition property; we then further prove that stationary processes achieve its information capacity, and consequently, as its order tends to infinity, its Markov capacity converges to its information capacity; eventually, we establish that its operational capacity is equal to its information capacity. Our results suggest that it is highly plausible to apply the ideas and techniques in the computation of the capacity of finite-state channels, which are relatively better explored, to that of the capacity of multilevel NAND flash memory channels.Comment: Submitted to IEEE Transactions on Information Theor

Investigating ferroelectric and metal-insulator phase transition devices for neuromorphic computing

Neuromorphic computing has been proposed to accelerate the computation for deep neural networks (DNNs). The objective of this thesis work is to investigate the ferroelectric and metal-insulator phase transition devices for neuromorphic computing. This thesis proposed and experimentally demonstrated the drain erase scheme in FeFET to enable the individual cell program/erase/inhibition for in-situ training in 3D NAND-like FeFET array. To achieve multi-level states for analog in-memory computing, the ferroelectric thin film needs to be partially switched. This thesis identified a new challenge of ferroelectric partial switching, namely “history effect” in minor loop dynamics. The experimental characterization of both FeCap and FeFET validated the history effect, suggesting that the intermediate states programming condition depends on the prior states that the device has gone through. A phase-field model was constructed to understand the origin. Such history effect was then modelled into the FeFET based neural network simulation and analyze its negative impact on the training accuracy and then propose a possible mitigation strategy. Apart from using FeFET as synaptic devices, using metal-insulator phase transition device, as neuron was also explored experimentally. A NbOx metal-insulator phase transition threshold switch was integrated at the edge of the crossbar array as an oscillation neuron. One promising application for FeFET+NbOx neuromorphic system is to implement quantum error correction (QEC) circuitry at 4K. Cryo-NeuroSim, a device-to-system modeling framework that calibrates data at cryogenic temperature was developed to benchmark the performance of the FeFET+NbOx neuromorphic system.Ph.D