Principles of Neuromorphic Photonics

In an age overrun with information, the ability to process reams of data has become crucial. The demand for data will continue to grow as smart gadgets multiply and become increasingly integrated into our daily lives. Next-generation industries in artificial intelligence services and high-performance computing are so far supported by microelectronic platforms. These data-intensive enterprises rely on continual improvements in hardware. Their prospects are running up against a stark reality: conventional one-size-fits-all solutions offered by digital electronics can no longer satisfy this need, as Moore's law (exponential hardware scaling), interconnection density, and the von Neumann architecture reach their limits. With its superior speed and reconfigurability, analog photonics can provide some relief to these problems; however, complex applications of analog photonics have remained largely unexplored due to the absence of a robust photonic integration industry. Recently, the landscape for commercially-manufacturable photonic chips has been changing rapidly and now promises to achieve economies of scale previously enjoyed solely by microelectronics. The scientific community has set out to build bridges between the domains of photonic device physics and neural networks, giving rise to the field of \emph{neuromorphic photonics}. This article reviews the recent progress in integrated neuromorphic photonics. We provide an overview of neuromorphic computing, discuss the associated technology (microelectronic and photonic) platforms and compare their metric performance. We discuss photonic neural network approaches and challenges for integrated neuromorphic photonic processors while providing an in-depth description of photonic neurons and a candidate interconnection architecture. We conclude with a future outlook of neuro-inspired photonic processing.Comment: 28 pages, 19 figure

DESIGN, COMPACT MODELING AND CHARACTERIZATION OF NANOSCALE DEVICES

Electronic device modeling is a crucial step in the advancement of modern nanotechnology and is gaining more and more interest. Nanoscale complementary metal oxide semiconductor (CMOS) transistors, being the backbone of the electronic industry, are pushed to below 10 nm dimensions using novel manufacturing techniques including extreme lithography. As their dimensions are pushed into such unprecedented limits, their behavior is still captured using models that are decades old. Among many other proposed nanoscale devices, silicon vacuum electron devices are regaining attention due to their presumed advantages in operating at very high power, high speed and under harsh environment, where CMOS cannot compete. Another type of devices that have the potential to complement CMOS transistors are nano-electromechanical systems (NEMS), with potential applications in filters, stable frequency sources, non-volatile memories and reconfigurable and neuromorphic electronics

Vidutinių dažnių 5G belaidžių tinklų galios stiprintuvų tyrimas

This dissertation addresses the problems of ensuring efficient radio fre-quency transmission for 5G wireless networks. Taking into account, that the next generation 5G wireless network structure will be heterogeneous, the device density and their mobility will increase and massive MIMO connectivity capability will be widespread, the main investigated problem is formulated – increasing the efficiency of portable mid-band 5G wireless network CMOS power amplifier with impedance matching networks. The dissertation consists of four parts including the introduction, 3 chapters, conclusions, references and 3 annexes. The investigated problem, importance and purpose of the thesis, the ob-ject of the research methodology, as well as the scientific novelty are de-fined in the introduction. Practical significance of the obtained results, defended state-ments and the structure of the dissertation are also included. The first chapter presents an extensive literature analysis. Latest ad-vances in the structure of the modern wireless network and the importance of the power amplifier in the radio frequency transmission chain are de-scribed in detail. The latter is followed by different power amplifier archi-tectures, parameters and their improvement techniques. Reported imped-ance matching network design methods are also discussed. Chapter 1 is concluded distinguishing the possible research vectors and defining the problems raised in this dissertation. The second chapter is focused around improving the accuracy of de-signing lumped impedance matching network. The proposed methodology of estimating lumped inductor and capacitor parasitic parameters is dis-cussed in detail provi-ding complete mathematical expressions, including a summary and conclusions. The third chapter presents simulation results for the designed radio fre-quency power amplifiers. Two variations of Doherty power amplifier archi-tectures are presented in the second part, covering the full step-by-step de-sign and simulation process. The latter chapter is concluded by comparing simulation and measurement results for all designed radio frequency power amplifiers. General conclusions are followed by an extensive list of references and a list of 5 publications by the author on the topic of the dissertation. 5 papers, focusing on the subject of the discussed dissertation, have been published: three papers are included in the Clarivate Analytics Web of Sci-ence database with a citation index, one paper is included in Clarivate Ana-lytics Web of Science database Conference Proceedings, and one paper has been published in unreferred international conference preceedings. The au-thor has also made 9 presentations at 9 scientific conferences at a national and international level.Dissertatio

Towards Faster Data Transfer by Spoof Plasmonics

With the emergence of complex architectures in modern electronics such as multi-chip modules, the increasing electromagnetic cross-talk in the circuitry causes a serious issue for high-speed, reliable data transfer among the chips. This thesis aims at developing a cross-talk resilient communication technology by utilizing a special form of electromagnetic mode, called spoof surface plasmon polariton for information transfer. The technique is based on the fact that a metal wire with periodic sub-wavelength patterns can support the propagation of confined electromagnetic mode, which can suppress cross-talk noise among the adjacent channels; and thus outperform conventional electrical interconnects in a parallel, high channel density data-bus. My developed model shows that, with 1 THz carrier frequency, the optimal design of cross-talk resilient spoof plasmon data-bus would allow each channel to support as high as 300 Gbps data, the bandwidth density can reach 1 Tbps per millimeter width of data-bus, and the digital pulse modulated carrier can travel more than 5 mm distance on the substrate. I have demonstrated that spoof plasmonic interconnects, comprised of patterned metallic conductors, can simultaneously accommodate electronic TEM mode, which is superior in cross-talk suppression at low-frequencies; and spoof plasmon mode, which is superior at high-frequencies. The research work is divided into two complementary parts: developing a theory for electromagnetic property analysis of spoof plasmon waveguide, and manipulating these properties for high-speed data transfer. Based on the theory developed, I investigated the complex interplay among various figure-of-merits of data transfer in spoof plasmonics, such as bandwidth density, propagation loss, thermal noise, speed of modulation, etc. My developed model predicts that with the availability of 1 THz carrier, the bit-error-rate of spoof plasmon data bus, subject to thermal noise would be $sim10^{-8}$ while the Shannon information capacity of the bus would be $10$ Tbps/mm. The model also predicts that, by proper designing of the modulator, it can be possible to alter the transmission property of the waveguide over one-fifth ($1/5$) of the spoof plasmon band which spans from DC frequency to the frequency of spoof plasmon resonance. To exemplify, if the spoof plasmon resonance is set at $1$ THz, then we can achieve more than $200$ Gbps speed of modulation with a very high extinction ratio, assuming the switching latency of the transistors at our disposal is negligible to the time-resolution of interest. We envision spoof plasmonic interconnects to constitute the next generation communication technology that will be transferring data at hundreds of Gigabit per second (Gbps) speed among different chips on a multi-chip module (MCM) carrier or system-on-chip (SoC) packaging.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/163041/1/srjoy_1.pd

Metamodeling-based Fast Optimization of Nanoscale Ams-socs

Modern consumer electronic systems are mostly based on analog and digital circuits and are designed as analog/mixed-signal systems on chip (AMS-SoCs). the integration of analog and digital circuits on the same die makes the system cost effective. in AMS-SoCs, analog and mixed-signal portions have not traditionally received much attention due to their complexity. As the fabrication technology advances, the simulation times for AMS-SoC circuits become more complex and take significant amounts of time. the time allocated for the circuit design and optimization creates a need to reduce the simulation time. the time constraints placed on designers are imposed by the ever-shortening time to market and non-recurrent cost of the chip. This dissertation proposes the use of a novel method, called metamodeling, and intelligent optimization algorithms to reduce the design time. Metamodel-based ultra-fast design flows are proposed and investigated. Metamodel creation is a one time process and relies on fast sampling through accurate parasitic-aware simulations. One of the targets of this dissertation is to minimize the sample size while retaining the accuracy of the model. in order to achieve this goal, different statistical sampling techniques are explored and applied to various AMS-SoC circuits. Also, different metamodel functions are explored for their accuracy and application to AMS-SoCs. Several different optimization algorithms are compared for global optimization accuracy and convergence. Three different AMS circuits, ring oscillator, inductor-capacitor voltage-controlled oscillator (LC-VCO) and phase locked loop (PLL) that are present in many AMS-SoC are used in this study for design flow application. Metamodels created in this dissertation provide accuracy with an error of less than 2% from the physical layout simulations. After optimal sampling investigation, metamodel functions and optimization algorithms are ranked in terms of speed and accuracy. Experimental results show that the proposed design flow provides roughly 5,000x speedup over conventional design flows. Thus, this dissertation greatly advances the state-of-the-art in mixed-signal design and will assist towards making consumer electronics cheaper and affordable

Terahertz Communications and Sensing for 6G and Beyond: A Comprehensive View

The next-generation wireless technologies, commonly referred to as the sixth generation (6G), are envisioned to support extreme communications capacity and in particular disruption in the network sensing capabilities. The terahertz (THz) band is one potential enabler for those due to the enormous unused frequency bands and the high spatial resolution enabled by both short wavelengths and bandwidths. Different from earlier surveys, this paper presents a comprehensive treatment and technology survey on THz communications and sensing in terms of the advantages, applications, propagation characterization, channel modeling, measurement campaigns, antennas, transceiver devices, beamforming, networking, the integration of communications and sensing, and experimental testbeds. Starting from the motivation and use cases, we survey the development and historical perspective of THz communications and sensing with the anticipated 6G requirements. We explore the radio propagation, channel modeling, and measurements for THz band. The transceiver requirements, architectures, technological challenges, and approaches together with means to compensate for the high propagation losses by appropriate antenna and beamforming solutions. We survey also several system technologies required by or beneficial for THz systems. The synergistic design of sensing and communications is explored with depth. Practical trials, demonstrations, and experiments are also summarized. The paper gives a holistic view of the current state of the art and highlights the issues and challenges that are open for further research towards 6G.Comment: 55 pages, 10 figures, 8 tables, submitted to IEEE Communications Surveys & Tutorial

The 2017 Terahertz Science and Technology Roadmap

Science and technologies based on terahertz frequency electromagnetic radiation (100GHz-30THz) have developed rapidly over the last 30 years. For most of the 20th century, terahertz radiation, then referred to as sub-millimeter wave or far-infrared radiation, was mainly utilized by astronomers and some spectroscopists. Following the development of laser based terahertz time-domain spectroscopy in the 1980s and 1990s the field of THz science and technology expanded rapidly, to the extent that it now touches many areas from fundamental science to “real world” applications. For example THz radiation is being used to optimize materials for new solar cells, and may also be a key technology for the next generation of airport security scanners. While the field was emerging it was possible to keep track of all new developments, however now the field has grown so much that it is increasingly difficult to follow the diverse range of new discoveries and applications that are appearing. At this point in time, when the field of THz science and technology is moving from an emerging to a more established and interdisciplinary field, it is apt to present a roadmap to help identify the breadth and future directions of the field. The aim of this roadmap is to present a snapshot of the present state of THz science and technology in 2016, and provide an opinion on the challenges and opportunities that the future holds. To be able to achieve this aim, we have invited a group of international experts to write 17 sections that cover most of the key areas of THz Science and Technology. We hope that The 2016 Roadmap on THz Science and Technology will prove to be a useful resource by providing a wide ranging introduction to the capabilities of THz radiation for those outside or just entering the field as well as providing perspective and breadth for those who are well established. We also feel that this review should serve as a useful guide for government and funding agencies