State of the art in chip-to-chip interconnects

This thesis presents a study of short-range links for chips mounted in the same package, on printed circuit boards or interposers. Implemented in CMOS technology between 7 and 250 nm, with links that operate at a data rate between 0,4 and 112 Gb/s/pin and with energy efficiencies from 0,3 to 67,7 pJ/bit. The links operate on channels with an attenuation lower than 50 dB. A comparison is made with graphical representations between the different articles that shows the correlation between the different essential metrics of chip-to-chip interconnects, as well as its evolution over the last 20 years.Esta tesis presenta un estudio de enlaces de corto alcance para chips montados en un mismo paquete, en placas de circuito impreso o intercaladores. Implementado en tecnología CMOS entre 7 y 250 nm, con enlaces que operan a una velocidad de datos entre 0,4 y 112 Gb/s/pin y con eficiencias energéticas de 0,3 a 67,7 pJ/bit. Los enlaces operan en canales con una atenuación inferior a 50 dB. Se realiza una comparación con representaciones gráficas entre los diferentes artículos que muestra la correlación entre las distintas métricas esenciales de las interconexiones chip a chip, así como su evolución en los últimos 20 años.Aquesta tesi presenta un estudi d'enllaços de curt abast per a xips muntats en el mateix paquet, en plaques de circuits impresos o interposers. Implementat en tecnologia CMOS entre 7 i 250 nm, amb enllaços que funcionen a una velocitat de dades entre 0,4 i 112 Gb/s/pin i amb eficiències energètiques de 0,3 a 67,7 pJ/bit. Els enllaços funcionen en canals amb una atenuació inferior a 50 dB. Es fa una comparació amb representacions gràfiques entre els diferents articles que mostra la correlació entre les diferents mètriques essencials d'interconnexions xip a xip, així com la seva evolució en els darrers 20 anys

High Speed Reconfigurable NRZ/PAM4 Transceiver Design Techniques

While the majority of wireline standards use simple binary non-return-to-zero (NRZ) signaling, four-level pulse-amplitude modulation (PAM4) standards are emerging to increase bandwidth density. This dissertation proposes efficient implementations for high speed NRZ/PAM4 transceivers. The first prototype includes a dual-mode NRZ/PAM4 serial I/O transmitter which can support both modulations with minimum power and hardware overhead. A source-series-terminated (SST) transmitter achieves 1.2Vpp output swing and employs lookup table (LUT) control of a 31-segment output digital-to-analog converter (DAC) to implement 4/2-tap feed-forward equalization (FFE) in NRZ/PAM4 modes, respectively. Transmitter power is improved with low-overhead analog impedance control in the DAC cells and a quarter-rate serializer based on a tri-state inverter-based mux with dynamic pre-driver gates. The transmitter is designed to work with a receiver that implements an NRZ/PAM4 decision feedback equalizer (DFE) that employs 1 finite impulse response (FIR) and 2 infinite impulse response (IIR) taps for first post-cursor and long-tail ISI cancellation, respectively. Fabricated in GP 65-nm CMOS, the transmitter occupies 0.060mm² area and achieves 16Gb/s NRZ and 32Gb/s PAM4 operation at 10.4 and 4.9 mW/Gb/s while operating over channels with 27.6 and 13.5dB loss at Nyquist, respectively. The second prototype presents a 56Gb/s four-level pulse amplitude modulation (PAM4) quarter-rate wireline receiver which is implemented in a 65nm CMOS process. The frontend utilize a single stage continuous time linear equalizer (CTLE) to boost the main cursor and relax the pre-cursor cancelation requirement, requiring only a 2-tap pre-cursor feed-forward equalization (FFE) on the transmitter side. A 2-tap decision feedback equalizer (DFE) with one finite impulse response (FIR) tap and one infinite impulse response (IIR) tap is employed to cancel first post-cursor and longtail inter-symbol interference (ISI). The FIR tap direct feedback is implemented inside the CML slicers to relax the critical timing of DFE and maximize the achievable data-rate. In addition to the per-slice main 3 data samplers, an error sampler is utilized for background threshold control and an edge-based sampler performs both PLL-based CDR phase detection and generates information for background DFE tap adaptation. The receiver consumes 4.63mW/Gb/s and compensates for up to 20.8dB loss when operated with a 2- tap FFE transmitter. The experimental results and comparison with state-of-the-art shows superior power efficiency of the presented prototypes for similar data-rate and channel loss. The usage of proposed design techniques are not limited to these specific prototypes and can be applied for any wireline transceiver with different modulation, data-rate and CMOS technology

Design of High-Speed Power-Efficient A/D Converters for Wireline ADC-Based Receiver Applications

Serial input/output (I/O) data rates are increasing in order to support the explosion in network traffic driven by big data applications such as the Internet of Things (IoT), cloud computing and etc. As the high-speed data symbol times shrink, this results in an increased amount of inter-symbol interference (ISI) for transmission over both severe low-pass electrical channels and dispersive optical channels. This necessitates increased equalization complexity and consideration of advanced modulation schemes, such as four-level pulse amplitude modulation (PAM-4). Serial links which utilize an analog-to-digital converter (ADC) receiver front-end offer a potential solution, as they enable more powerful and flexible digital signal processing (DSP) for equalization and symbol detection and can easily support advanced modulation schemes. Moreover, the DSP back-end provides robustness to process, voltage, and temperature (PVT) variations, benefits from improved area and power with CMOS technology scaling and offers easy design transfer between different technology nodes and thus improved time-to-market. However, ADC-based receivers generally consume higher power relative to their mixed-signal counterparts because of the significant power consumed by conventional multi-GS/s ADC implementations. This motivates exploration of energy-efficient ADC designs with moderate resolution and very high sampling rates to support data rates at or above 50Gb/s. This dissertation presents two power-efficient designs of ≥25GS/s time-interleaved ADCs for ADC-based wireline receivers. The first prototype includes the implementation of a 6b 25GS/s time-interleaved multi-bit search ADC in 65nm CMOS with a soft-decision selection algorithm that provides redundancy for relaxed track-and-hold (T/H) settling and improved metastability tolerance, achieving a figure-of-merit (FoM) of 143fJ/conversion step and 1.76pJ/bit for a PAM-4 receiver design. The second prototype features the design of a 52Gb/s PAM-4 ADC-based receiver in 65nm CMOS, where the front-end consists of a 4-stage continuous-time linear equalizer (CTLE)/variable gain amplifier (VGA) and a 6b 26GS/s time-interleaved SAR ADC with a comparator-assisted 2b/stage structure for reduced digital-to-analog converter (DAC) complexity and a 3-tap embedded feed-forward equalizer (FFE) for relaxed ADC resolution requirement. The receiver front-end achieves an efficiency of 4.53bJ/bit, while compensating for up to 31dB loss with DSP and no transmitter (TX) equalization

Hybrid NRZ/Multi-Tone Signaling for High-Speed Low-Power Wireline Transceivers

Over the past few decades, incessant growth of Internet networking traffic and High-Performance Computing (HPC) has led to a tremendous demand for data bandwidth. Digital communication technologies combined with advanced integrated circuit scaling trends have enabled the semiconductor and microelectronic industry to dramatically scale the bandwidth of high-loss interfaces such as Ethernet, backplane, and Digital Subscriber Line (DSL). The key to achieving higher bandwidth is to employ equalization technique to compensate the channel impairments such as Inter-Symbol Interference (ISI), crosstalk, and environmental noise. Therefore, todayâs advanced input/outputs (I/Os) has been equipped with sophisticated equalization techniques to push beyond the uncompensated bandwidth of the system. To this end, process scaling has continually increased the data processing capability and improved the I/O performance over the last 15 years. However, since the channel bandwidth has not scaled with the same pace, the required signal processing and equalization circuitry becomes more and more complicated. Thereby, the energy efficiency improvements are largely offset by the energy needed to compensate channel impairments. In this design paradigm, re-thinking about the design strategies in order to not only satisfy the bandwidth performance, but also to improve power-performance becomes an important necessity. It is well known in communication theory that coding and signaling schemes have the potential to provide superior performance over band-limited channels. However, the choice of the optimum data communication algorithm should be considered by accounting for the circuit level power-performance trade-offs. In this thesis we have investigated the application of new algorithm and signaling schemes in wireline communications, especially for communication between microprocessors, memories, and peripherals. A new hybrid NRZ/Multi-Tone (NRZ/MT) signaling method has been developed during the course of this research. The system-level and circuit-level analysis, design, and implementation of the proposed signaling method has been performed in the frame of this work, and the silicon measurement results have proved the efficiency and the robustness of the proposed signaling methodology for wireline interfaces. In the first part of this work, a 7.5 Gb/s hybrid NRZ/MT transceiver (TRX) for multi-drop bus (MDB) memory interfaces is designed and fabricated in 40 nm CMOS technology. Reducing the complexity of the equalization circuitry on the receiver (RX) side, the proposed architecture achieves 1 pJ/bit link efficiency for a MDB channel bearing 45 dB loss at 2.5 GHz. The measurement results of the first prototype confirm that NRZ/MT serial data TRX can offer an energy-efficient solution for MDB memory interfaces. Motivated by the satisfying results of the first prototype, in the second phase of this research we have exploited the properties of multi-tone signaling, especially orthogonality among different sub-bands, to reduce the effect of crosstalk in high-dense wireline interconnects. A four-channel transceiver has been implemented in a standard CMOS 40 nm technology in order to demonstrate the performance of NRZ/MT signaling in presence of high channel loss and strong crosstalk noise. The proposed system achieves 1 pJ/bit power efficiency, while communicating over a MDB memory channel at 36 Gb/s aggregate data rate

Research and design of high-speed advanced analogue front-ends for fibre-optic transmission systems

In the last decade, we have witnessed the emergence of large, warehouse-scale data centres which have enabled new internet-based software applications such as cloud computing, search engines, social media, e-government etc. Such data centres consist of large collections of servers interconnected using short-reach (reach up to a few hundred meters) optical interconnect. Today, transceivers for these applications achieve up to 100Gb/s by multiplexing 10x 10Gb/s or 4x 25Gb/s channels. In the near future however, data centre operators have expressed a need for optical links which can support 400Gb/s up to 1Tb/s. The crucial challenge is to achieve this in the same footprint (same transceiver module) and with similar power consumption as today’s technology. Straightforward scaling of the currently used space or wavelength division multiplexing may be difficult to achieve: indeed a 1Tb/s transceiver would require integration of 40 VCSELs (vertical cavity surface emitting laser diode, widely used for short‐reach optical interconnect), 40 photodiodes and the electronics operating at 25Gb/s in the same module as today’s 100Gb/s transceiver. Pushing the bit rate on such links beyond today’s commercially available 100Gb/s/fibre will require new generations of VCSELs and their driver and receiver electronics. This work looks into a number of state‐of-the-art technologies and investigates their performance restraints and recommends different set of designs, specifically targeting multilevel modulation formats. Several methods to extend the bandwidth using deep submicron (65nm and 28nm) CMOS technology are explored in this work, while also maintaining a focus upon reducing power consumption and chip area. The techniques used were pre-emphasis in rising and falling edges of the signal and bandwidth extensions by inductive peaking and different local feedback techniques. These techniques have been applied to a transmitter and receiver developed for advanced modulation formats such as PAM-4 (4 level pulse amplitude modulation). Such modulation format can increase the throughput per individual channel, which helps to overcome the challenges mentioned above to realize 400Gb/s to 1Tb/s transceivers

최적에 가까운 타이밍 적응을 위해 치우친 데이터 레벨과 눈 경사 디텍터를 사용한 최대 눈크기추적 클럭 및 데이터 복원회로 설계

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2021. 2. 정덕균.이 논문에서는 최소-비트 비트 에러율 (BER)에 대한 최대 눈크기 추적 CDR (MET-CDR)의 설계가 제안되었다. 제안 된 CDR 은 최적의 샘플링 단계를 찾기 위해 반복 절차를 가진 BER 카운터 또는 아이 모니터가 필 요하지 않다. 에러 샘플러 출력에 가중치를 두어 더하여 얻은 치우친 데 이터 레벨 (biased dLev) 은 사전 커서 ISI(pre-cursor ISI) 의 정보도 고려한 눈 높이 정보를 추출한다. 델타 T 만큼의 시간 차이를 둔 지점에서 작동 하는 두 샘플러는 현재 눈 높이와 눈 기울기의 극성을 감지하고, 이 정보 를 통해 제안하는 CDR 은 눈 기울기가 0 이되는 최대 눈 높이로 수렴한 다. 측정 결과는 최대 눈 높이와 최소 BER 의 샘플링 위치가 잘 일치 함 을 보여준다. 28nm CMOS 공정으로 구현된 수신기 칩은 23.5dB 의 채널 손실이 있는 상태에서 26Gb/s 에서 동작 가능하다. 0.25UI 의 아이 오프닝 을 가지며, 87mW 의 파워를 소비한다.In this thesis, design of a maximum-eye-tracking CDR (MET-CDR) for minimum bit error rate (BER) is proposed. The proposed CDR does not require a BER coun-ter or an eye-opening monitor with any iterative procedure to find the near-optimal sampling phase. The biased data-level obtained from the weighted sum of error sampler outputs, UP and DN, extracts the actual eye height information in the presence of pre-cursor ISI. Two samplers operating on two slightly different tim-ings detect the current eye height and the polarity of the eye slope so that the CDR tracks the maximum eye height where the slope becomes zero. Measured results show that the sampling phase of the maximum eye height and that of the mini-mum BER match well. A prototype receiver fabricated in 28 nm CMOS process operates at 26 Gb/s with an eye-opening of 0.25 UI and consumes 87 mW while equalizing 23.5 dB of loss at 13 GHz.ABSTRACT I CONTENTS II LIST OF FIGURES IV LIST OF TABLES VIII CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 4 CHAPTER 2 BACKGROUNDS 5 2.1 RECEIVER FRONT-END 5 2.1.1 CHANNEL 7 2.1.2 EQUALIZER 17 2.1.3 CDR 32 2.2 PRIOR ARTS ON CLOCK RECOVERY 39 2.2.1 BB-CDR 39 2.2.2 BER-BASED CDR 41 2.2.3 EOM-BASED CDR 44 2.3 CONCEPT OF THE PROPOSED CDR 47 CHAPTER 3 MAXIMUM-EYE-TRACKING CDR WITH BIASED DATA-LEVEL AND EYE SLOPE DETECTOR 49 3.1 OVERVIEW 49 3.2 DESIGN OF MET-CDR 50 3.2.1 EYE HEIGHT INFORMATION FROM BIASED DATA-LEVEL 50 3.2.2 EYE SLOPE DETECTOR AND ADAPTATION ALGORITHM 60 3.2.3 ARCHITECTURE AND IMPLEMENTATION 67 3.2.4 VERIFICATION OF THE ALGORITHM 71 3.2.5 ANALYSIS ON THE BIASED DATA-LEVEL 76 3.3 EXPANSION OF MET-CDR TO PAM4 SIGNALING 84 3.3.1 MET-CDR WITH PAM4 84 3.3.2 CONSIDERATIONS FOR PAM4 87 CHAPTER 4 MEASUREMENT RESULTS 89 CHAPTER 5 CONCLUSION 99 APPENDIX A MATLAB CODE FOR SIMULATING RECEIVER WITH MET-CDR 100 BIBLIOGRAPHY 105 초 록 113Docto

Low Power Analog Processing for Ultra-High-Speed Receivers with RF Correlation

Ultra-high-speed data communication receivers (Rxs) conventionally require analog digital converters (ADC)s with high sampling rates which have design challenges in terms of adequate resolution and power. This leads to ultra-high-speed Rxs utilising expensive and bulky high-speed oscilloscopes which are extremely inefficient for demodulation, in terms of power and size. Designing energy-efficient mixed-signal and baseband units for ultra-high-speed Rxs requires a paradigm approach detailed in this paper that circumvents the use of power-hungry ADCs by employing low-power analog processing. The low-power analog Rx employs direct-demodulation with RF correlation using low-power comparators. The Rx is able to support multiple modulations with highest modulation of 16-QAM reported so far for direct-demodulation with RF correlation. Simulations using Matlab, Simulink R2020a® indicate sufficient symbol-error rate (SER) performance at a symbol rate of 8 GS/s for the 71 GHz Urban Micro Cell and 140 GHz indoor channels. Power analysis undertaken with current analog, hybrid and digital beamforming approaches requiring ADCs indicates considerable power savings. This novel approach can be adopted for ultra-high-speed Rxs envisaged for beyond fifth generation (B5G)/sixth generation (6G)/ terahertz (THz) communication without the power-hungry ADCs, leading to low-power integrated design solutions

저전력, 저면적 유선 송수신기 설계를 위한 회로 기술

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2016. 8. 정덕균.In this thesis, novel circuit techniques for low-power and area-efficient wireline transceiver, including a phase-locked loop (PLL) based on a two-stage ring oscillator, a scalable voltage-mode transmitter, and a forwarded-clock (FC) receiver based on a delay-locked-loop (DLL) based per-pin deskew, are proposed. At first, a two-stage ring PLL that provides a four-phase, high-speed clock for a quarter-rate TX in order to minimize power consumption is presented. Several analyses and verification techniques, ranging from the clocking architectures for a high-speed TX to oscillation failures in a two-stage ring oscillator, are addressed in this thesis. A tri-state-inverter–based frequency-divider and an AC-coupled clock-buffer are used for high-speed operations with minimal power and area overheads. The proposed PLL fabricated in the 65-nm CMOS technology occupies an active area of 0.009 mm2 with an integrated-RMS-jitter of 414 fs from 10 kHz to 100 MHz while consuming 7.6 mW from a 1.2-V supply at 10 GHz. The resulting figure-of-merit is -238.8 dB, which surpasses that of the state-of-the-art ring-PLLs by 4 dB. Secondly, a voltage-mode (VM) transmitter which offers a wide operation range of 6 to 32 Gb/s, controllable pre-emphasis equalization and output voltage swing without altering output impedance, and a power supply scalability is presented. A quarter-rate clocking architecture is employed in order to maximize the scalability and energy efficiency across the variety of operating conditions. A P-over-N VM driver is used for CMOS compatibility and wide voltage-swing range required for various I/O standards. Two supply regulators calibrate the output impedance of the VM driver across the wide swing and pre-emphasis range. A single phase-locked loop is used to provide a wide frequency range of 1.5-to-8 GHz. The prototype chip is fabricated in 65-nm CMOS technology and occupies active area of 0.48x0.36 mm2. The proposed transmitter achieves 250-to-600-mV single-ended swing and exhibits the energy efficiency of 2.10-to-2.93 pJ/bit across the data rate of 6-to-32 Gb/s. And last, this thesis describes a power and area-efficient FC receiver and includes an analysis of the jitter tolerance of the FC receiver. In the proposed design, jitter tolerance is maximized according to the analysis by employing a DLL-based de-skewing. A sample-swapping bang-bang phase-detector (SS-BBPD) eliminates the stuck locking caused by the finite delay range of the voltage-controlled delay line (VCDL), and also reduces the required delay range of the VCDL by half. The proposed FC receiver is fabricated in 65-nm CMOS technology and occupies an active area of 0.025 mm2. At a data rate of 12.5 Gb/s, the proposed FC receiver exhibits an energy efficiency of 0.36 pJ/bit, and tolerates 1.4-UIpp sinusoidal jitter of 300 MHz.Chapter 1. Introduction 1 1.1. Motivation 1 1.2. Thesis organization 5 Chapter 2. Phase-Locked Loop Based on Two-Stage Ring Oscillator 7 2.1. Overivew 7 2.2. Background and Analysis of a Two-stage Ring Oscillator 11 2.3. Circuit Implementation of The Proposed PLL 25 2.4. Measurement Results 33 Chapter 3. A Scalable Voltage-Mode Transmitter 37 3.1. Overview 37 3.2. Design Considerations on a Scalable Serial Link Transmitter 40 3.3. Circuit Implementation 46 3.4. Measurement Results 56 Chapter 4. Delay-Locked Loop Based Forwarded-Clock Receiver 62 4.1. Overview 62 4.2. Timing and Data Recovery in a Serial Link 65 4.3. DLL-Based Forwarded-Clock Receiver Characteristics 70 4.4. Circuit Implementation 79 4.5. Measurement Results 89 Chapter 5. Conclusion 94 Appendix 96 Appendix A. Design flow to optimize a high-speed ring oscillator 96 Appendix B. Reflection Issues in N-over-N Voltage-Mode Driver 99 Appendix C. Analysis on output swing and power consumption of the P-over-N voltage-mode driver 107 Appendix D. Loop Dynamics of DLL 112 Bibliography 121 Abstract 128Docto

High-speed equalization and transmission in electrical interconnections

The relentless growth of data traffic and increasing digital signal processing capabilities of integrated circuits (IC) are demanding ever faster chip-to-chip / chip-to-module serial electrical interconnects. As data rates increase, the signal quality after transmission over printed circuit board (PCB) interconnections is severely impaired. Frequency-dependent loss and crosstalk noise lead to a reduced eye opening, a reduced signal-to-noise ratio and an increased inter-symbol interference (ISI). This, in turn, requires the use of improved signal processing or PCB materials, in order to overcome the bandwidth (BW) limitations and to improve signal integrity. By applying an optimal combination of equalizer and receiver electronics together with BW-efficient modulation schemes, the transmission rate over serial electrical interconnections can be pushed further. At the start of this research, most industrial backplane connectors, meeting the IEEE and OIF specifications such as manufactured by e.g. FCI or TE connectivity, had operational capabilities of up to 25 Gb/s. This research was mainly performed under the IWT ShortTrack project. The goal of this research was to increase the transmission speed over electrical backplanes up to 100 Gb/s per channel for next-generation telecom systems and data centers. This requirement greatly surpassed the state-ofthe-art reported in previous publications, considering e.g. 25 Gb/s duobinary and 42.8 Gb/s PAM-4 transmission over a low-loss Megtron 6 electrical backplane using off-line processing. The successful implementation of the integrated transmitter (TX) and receiver (RX) (1) , clearly shows the feasibility of single lane interconnections beyond 80 Gb/s and opens the potential of realizing industrial 100 Gb/s links using a recent IC technology process. Besides the advancement of the state-of-the-art in the field of high-speed transceivers and backplane transmission systems, which led to several academic publications, the output of this work also attracts a lot of attention from the industry, showing the potential to commercialize the developed chipset and technologies used in this research for various applications: not only in high-speed electrical transmission links, but also in high-speed opto-electronic communications such as access, active optical cables and optical backplanes. In this dissertation, the background of this research, an overview of this work and the thesis organization are illustrated in Chapter 1. In Chapter 2, a system level analysis is presented, showing that the channel losses are limiting the transmission speed over backplanes. In order to enhance the serial data rate over backplanes and to eliminate the signal degradation, several technologies are discussed, such as signal equalization and modulation techniques. First, a prototype backplane channel, from project partner FCI, implemented with improved backplane connectors is characterized. Second, an integrated transversal filter as a feed-forward equalizer (FFE) is selected to perform the signal equalization, based on a comprehensive consideration of the backplane channel performance, equalization capabilities, implementation complexity and overall power consumption. NRZ, duobinary and PAM-4 are the three most common modulation schemes for ultra-high speed electrical backplane communication. After a system-level simulation and comparison, the duobinary format is selected due to its high BW efficiency and reasonable circuit complexity. Last, different IC technology processes are compared and the ST microelectronics BiCMOS9MW process (featuring a fT value of over 200 GHz) is selected, based on a trade-off between speed and chip cost. Meanwhile it also has a benefit for providing an integrated microstrip model, which is utilized for the delay elements of the FFE. Chapter 3 illustrates the chip design of the high-speed backplane TX, consisting of a multiplexer (MUX) and a 5-tap FFE. The 4:1 MUX combines four lower rate streams into a high-speed differential NRZ signal up to 100 Gb/s as the FFE input. The 5-tap FFE is implemented with a novel topology for improved testability, such that the FFE performance can be individually characterized, in both frequency- and time-domain, which also helps to perform the coefficient optimization of the FFE. Different configurations for the gain cell in the FFE are compared. The gilbert configuration shows most advantages, in both a good high-frequency performance and an easy way to implement positive / negative amplification. The total chip, including the MUX and the FFE, consumes 750mW from a 2.5V supply and occupies an area of 4.4mm × 1.4 mm. In Chapter 4, the TX chip is demonstrated up to 84 Gb/s. First, the FFE performance is characterized in the frequency domain, showing that the FFE is able to work up to 84 Gb/s using duobinary formats. Second, the combination of the MUX and the FFE is tested. The equalized TX outputs are captured after different channels, for both NRZ and duobinary signaling at speeds from 64 Gb/s to 84 Gb/s. Then, by applying the duobinary RX 2, a serial electrical transmission link is demonstrated across a pair of 10 cm coax cables and across a 5 cm FX-2 differential stripline. The 5-tap FFE compensates a total loss between the TX and the RX chips of about 13.5 dB at the Nyquist frequency, while the RX receives the equalized signal and decodes the duobinary signal to 4 quarter rate NRZ streams. This shows a chip-to-chip data link with a bit error rate (BER) lower than 10−11. Last, the electrical data transmission between the TX and the RX over two commercial backplanes is demonstrated. An error-free, serial duobinary transmission across a commercial Megtron 6, 11.5 inch backplane is demonstrated at 48 Gb/s, which indicates that duobinary outperforms NRZ for attaining higher speed or longer reach backplane applications. Later on, using an ExaMAX® backplane demonstrator, duobinary transmission performance is verified and the maximum allowed channel loss at 40 Gb/s transmission is explored. The eye diagram and BER measurements over a backplane channel up to 26.25 inch are performed. The results show that at 40 Gb/s, a total channel loss up to 37 dB at the Nyquist frequency allows for error-free duobinary transmission, while a total channel loss of 42 dB was overcome with a BER below 10−8. An overview of the conclusions is summarized in Chapter 5, along with some suggestions for further research in this field. (1) The duobinary receiver was developed by my colleague Timothy De Keulenaer, as described in his PhD dissertation. (2) Described in the PhD dissertation of Timothy De Keulenaer