Design of an electrochemical micromachining machine

Electrochemical micromachining (μECM) is a non-conventional machining process based on the phenomenon of electrolysis. μECM became an attractive area of research due to the fact that this process does not create any defective layer after machining and that there is a growing demand for better surface integrity on different micro applications including microfluidics systems, stress-free drilled holes in automotive and aerospace manufacturing with complex shapes, etc. This work presents the design of a next generation μECM machine for the automotive, aerospace, medical and metrology sectors. It has three axes of motion (X, Y, Z) and a spindle allowing the tool-electrode to rotate during machining. The linear slides for each axis use air bearings with linear DC brushless motors and 2-nm resolution encoders for ultra precise motion. The control system is based on the Power PMAC motion controller from Delta Tau. The electrolyte tank is located at the rear of the machine and allows the electrolyte to be changed quickly. This machine features two process control algorithms: fuzzy logic control and adaptive feed rate. A self-developed pulse generator has been mounted and interfaced with the machine and a wire ECM grinding device has been added. The pulse generator has the possibility to reverse the pulse polarity for on-line tool fabrication.The research reported in this paper is supported by the European Commission within the project “Minimizing Defects in Micro-Manufacturing Applications (MIDEMMA)” (FP7-2011-NMPICT- FoF-285614)

Experimental research to Optimize Process Parameters in Machining of Non Conducting Material with hybrid non conconventional machining

Among all non conventional micro machining, electrochemical discharge machining ECDM is having high quality of material removal rate with zero residual stress. This machining has been accepted as a highly modern technology in micromachining. In this paper an effort has been done on micro drilling of glass using electrochemical discharge machining ECDM . A fixed tool and a step down transformer have been used to support the steady machining to increase the accuracy of work piece. The input parameters used in this experiment are voltage, concentration of electrolyte, enter electrode gap and ratio of area of electrode. MRR has been investigated over the input parameters. Feed rate and electrolyte temperature has been made constant of 3µm sec and 30°c respectively. Taguchi method is used to optimize the effect of the process parameters on MRR. The signal to noise S N ratio and the ANOVA analysis are employed to find the contributions of input parameters. Vikrant Sharma | Sunil Kumar "Experimental research to Optimize Process Parameters in Machining of Non Conducting Material with hybrid non conconventional machining" Published in International Journal of Trend in Scientific Research and Development (ijtsrd), ISSN: 2456-6470, Volume-1 | Issue-4 , June 201

Micromachining of buried micro channels in silicon

A new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented in this paper. The micro structures are constructed by trench etching, coating of the sidewalls of the trench, removal of the coating at the bottom of the trench, and etching into the bulk of the silicon substrate. The structures can be sealed by deposition of a suitable layer that closes the trench. BCT is a process that can be used to fabricate complete micro channels in a single wafer with only one lithographic mask and processing on one side of the wafer, without the need for assembly and bonding. The process leaves a substrate surface with little topography, which easily allows further processing, such as the integration of electronic circuits or solid-state sensors. The essential features of the technology, as well as design rules and feasible process schemes, will be demonstrated on examples from the field of ¿-fluidic

Electrochemical Micro Machining: A Case Study for Synergistic International Industry - Academia Collaboration

Micro fabrication is generally confined to silicon-based processes for microelectronic applications. The advent of micro electromechanical systems (MEMS) using silicon and silicon based processes has opened up a new basis for micro fabrication technology, but the applications have been limited due to the brittle nature of silicon. Novel technologies have been sought for non-silicon micro components and systems. The electrochemical micro machining (µECM) is standing out among other solutions. An international group comprised of industry and academic institutes in Mexico and USA was formed to provide synergistic effort in developing this new technology. The funding came from the involved companies, National Science Foundation, National Consortium of Science and Technology (CONACyT, Mexico), and Texas A&M University. Both graduate and undergraduate students are involved in this research and educational project. Some research objectives have been achieved by dividing an objective into manageable laboratory projects that can be completed by undergraduate students in a few weeks. The anodic dissolution µECM process effectively forms and shapes micro components from any conductive material. Unlike classical ECM technology, the novel µECM utilizes very high frequency pulses and proprietary electrode shapes/motions to remove materials at the micro or nano scales, and can mass-produce micro components with exceptional quality and surface integrity. A theoretical model is developed which agrees with experimental data for 316L stainless steel and copper beryllium alloy. The environmentally friendly technology shows promise as a high-resolution production manufacturing process with excellent throughput and repeatability

Micro systems technology

The emerging field of Micro Systems Technology is described. Micro Systems Technology can be seen as the meeting of disciplines, a product of convergence along different lines. Apart from the traditional and ever developing line of 'classical' precision engineering, there is a line along micro electronics, micro sensors and actuators. This is the line we focus on in this contribution. The third line worth mentioning is the one along the upcoming field of molecular engineering. The main purpose of this paper is to show the wealth of possibilities and consequently the need for 'integral design' management