An Ultra-Low-Power Oscillator with Temperature and Process Compensation for UHF RFID Transponder

This paper presents a 1.28MHz ultra-low-power oscillator with temperature and process compensation. It is very suitable for clock generation circuits used in ultra-high-frequency (UHF) radio-frequency identification (RFID) transponders. Detailed analysis of the oscillator design, including process and temperature compensation techniques are discussed. The circuit is designed using TSMC 0.18μm standard CMOS process and simulated with Spectre. Simulation results show that, without post-fabrication calibration or off-chip components, less than ±3% frequency variation is obtained from –40 to 85°C in three different process corners. Monte Carlo simulations have also been performed, and demonstrate a 3σ deviation of about 6%. The power for the proposed circuitry is only 1.18µW at 27°C

Low Voltage Floating Gate MOS Transistor Based Four-Quadrant Multiplier

This paper presents a four-quadrant multiplier based on square-law characteristic of floating gate MOSFET (FGMOS) in saturation region. The proposed circuit uses square-difference identity and the differential voltage squarer proposed by Gupta et al. to implement the multiplication function. The proposed multiplier employs eight FGMOS transistors and two resistors only. The FGMOS implementation of the multiplier allows low voltage operation, reduced power consumption and minimum transistor count. The second order effects caused due to mobility degradation, component mismatch and temperature variations are discussed. Performance of the proposed circuit is verified at ±0.75 V in TSMC 0.18 µm CMOS, BSIM3 and Level 49 technology by using Cadence Spectre simulator

Near-Zero-Power Temperature Sensing via Tunneling Currents Through Complementary Metal-Oxide-Semiconductor Transistors.

Temperature sensors are routinely found in devices used to monitor the environment, the human body, industrial equipment, and beyond. In many such applications, the energy available from batteries or the power available from energy harvesters is extremely limited due to limited available volume, and thus the power consumption of sensing should be minimized in order to maximize operational lifetime. Here we present a new method to transduce and digitize temperature at very low power levels. Specifically, two pA current references are generated via small tunneling-current metal-oxide-semiconductor field effect transistors (MOSFETs) that are independent and proportional to temperature, respectively, which are then used to charge digitally-controllable banks of metal-insulator-metal (MIM) capacitors that, via a discrete-time feedback loop that equalizes charging time, digitize temperature directly. The proposed temperature sensor was integrated into a silicon microchip and occupied 0.15 mm2 of area. Four tested microchips were measured to consume only 113 pW with a resolution of 0.21 °C and an inaccuracy of ±1.65 °C, which represents a 628× reduction in power compared to prior-art without a significant reduction in performance

Exploiting the dynamic properties of FET-based chemical sensors

After a long period of mainly static application of ISFETS, other more sophisticated applications are being developed, based on the exploitation of the dynamic properties of ISFETS. Examples are the use of flow-through cells with sample injection and the integration of a pH actuator electrode for very fast titration in a microvolume. The development of an immunoFET makes use of induced transient phenomen

A Sub-kT/q Voltage Reference Operating at 150 mV

We propose a subthreshold CMOS voltage reference operating with a minimum supply voltage of only 150 mV, which is three times lower than the minimum value presently reported in the literature. The generated reference voltage is only 17.69 mV. This result has been achieved by introducing a temperature compensation technique that does not require the drain-source voltage of each MOSFET to be larger than 4kT/q. The implemented solution consists in two transistors voltage reference with two MOSFETs of the same threshold-type and exploits the dependence of the threshold voltage on transistor size. Measurements performed over a large sample population of 60 chips from two separate batches show a standard deviation of only 0.29 mV. The mean variation of the reference voltage for VDD ranging from 0.15 to 1.8 V is 359.5 μV/V, whereas the mean variation of VREF in the temperature range from 0°C to 120°C is 26.74 μV/°C. The mean power consumption at 25 °C for VDD = 0.15 V is 26.1 pW. The occupied area is 1200 μm2

Design And Simulation Of Cmos-Based Bandgap Reference Voltage With Compensation Circuit Using 0.18 Μm Process Technology

Voltage reference circuit is important in electronic world nowadays. A CMOS based bandgap reference (BGR) circuit is preferred due to its size is smaller and consume less power. However, the drawback is the reference voltage variation of CMOS based BGR circuit is big in wide range of temperature, thus the temperature coefficient of it is high. Hence, an improved version of piecewise curvature-corrected Bandgap voltage reference circuit which has low voltage variation in wide range of temperature is introduced in this project to overcome the problem mentioned above. The BGR circuit is designed using CMOS compatible process in 0.18μm CMOS process technology and simulated by using Cadence tool. The proposed piecewise curvature-corrected BGR operate properly with output voltage of 558.6 mV to 558.3 mV by varying the voltage supply 1.4 V to 3.3 V at 27°C and the line regulation is 0.016% . Besides that, the best temperature coefficient obtained is 9.2 ppm/°C in the temperature range of -25°C to 150°C at 1.8 V. The PSSR of the proposed circuit is -69.91 dB at frequency less 10 kHz. The layout design of the proposed circuit is done by using Silterra 0.18 μm standard CMOS process and total die area is 0.0175 mm2 and temperature coefficient obtained in post layout simulation is 11.66ppm/°C. In short, it is found that the proposed design of BGR circuit is able to achieve high temperature range and relatively low voltage variation

Impact of Gamma Radiation on Dynamic RDSON Characteristics in AlGaN/GaN Power HEMTs

GaN high-electron-mobility transistors (HEMTs) are promising next-generation devices in the power electronics field which can coexist with silicon semiconductors, mainly in some radiation-intensive environments, such as power space converters, where high frequencies and voltages are also needed. Its wide band gap (WBG), large breakdown electric field, and thermal stability improve actual silicon performances. However, at the moment, GaN HEMT technology suffers from some reliability issues, one of the more relevant of which is the dynamic on-state resistance (RON_dyn) regarding power switching converter applications. In this study, we focused on the drain-to-source on-resistance (RDSON) characteristics under 60Co gamma radiation of two different commercial power GaN HEMT structures. Different bias conditions were applied to both structures during irradiation and some static measurements, such as threshold voltage and leakage currents, were performed. Additionally, dynamic resistance was measured to obtain practical information about device trapping under radiation during switching mode, and how trapping in the device is affected by gamma radiation. The experimental results showed a high dependence on the HEMT structure and the bias condition applied during irradiation. Specifically, a free current collapse structure showed great stability until 3.7 Mrad(Si), unlike the other structure tested, which showed high degradation of the parameters measured. The changes were demonstrated to be due to trapping effects generated or enhanced by gamma radiation. These new results obtained about RON_dyn will help elucidate trap behaviors in switching transistors