An On-line BIST RAM Architecture with Self Repair Capabilities

The emerging field of self-repair computing is expected to have a major impact on deployable systems for space missions and defense applications, where high reliability, availability, and serviceability are needed. In this context, RAM (random access memories) are among the most critical components. This paper proposes a built-in self-repair (BISR) approach for RAM cores. The proposed design, introducing minimal and technology-dependent overheads, can detect and repair a wide range of memory faults including: stuck-at, coupling, and address faults. The test and repair capabilities are used on-line, and are completely transparent to the external user, who can use the memory without any change in the memory-access protocol. Using a fault-injection environment that can emulate the occurrence of faults inside the module, the effectiveness of the proposed architecture in terms of both fault detection and repairing capability was verified. Memories of various sizes have been considered to evaluate the area-overhead introduced by this proposed architectur

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

Zero-maintenance of electronic systems: Perspectives, challenges, and opportunities

Self-engineering systems that are capable of repairing themselves in-situ without the need for human decision (or intervention) could be used to achieve zero-maintenance. This philosophy is synonymous to the way in which the human body heals and repairs itself up to a point. This article synthesises issues related to an emerging area of self-healing technologies that links software and hardware mitigations strategies. Efforts are concentrated on built-in detection, masking and active mitigation that comprises self-recovery or self-repair capability, and has a focus on system resilience and recovering from fault events. Design techniques are critically reviewed to clarify the role of fault coverage, resource allocation and fault awareness, set in the context of existing and emerging printable/nanoscale manufacturing processes. The qualitative analysis presents new opportunities to form a view on the research required for a successful integration of zero-maintenance. Finally, the potential cost benefits and future trends are enumerated

Wireless distributed intelligence in personal applications

Tietokoneet ovat historian kuluessa kehittyneet keskustietokoneista hajautettujen, langattomasti toimivien järjestelmien suuntaan. Elektroniikalla toteutetut automaattiset toiminnot ympärillämme lisääntyvät kiihtyvällä vauhdilla. Tällaiset sovellukset lisääntyvät tulevaisuudessa, mutta siihen soveltuva tekniikka on vielä kehityksen alla ja vaadittavia ominaisuuksia ei aina löydy. Nykyiset lyhyen kantaman langattoman tekniikan standardit ovat tarkoitettu lähinnä teollisuuden ja multimedian käyttöön, siksi ne ovat vain osittain soveltuvia uudenlaisiin ympäristöälykkäisiin käyttötarkoituksiin. Ympäristöälykkäät sovellukset palvelevat enimmäkseen jokapäiväistä elämäämme, kuten turvallisuutta, kulunvalvontaa ja elämyspalveluita. Ympäristöälykkäitä ratkaisuja tarvitaan myös hajautetussa automaatiossa ja kohteiden automaattisessa seurannassa. Tutkimuksen aikana Seinäjoen ammattikorkeakoulussa on tutkittu lyhyen kantaman langatonta tekniikkaa: suunniteltu ja kehitetty pienivirtaisia radionappeja, niitten ohjelmointiympäristöä sekä langattoman verkon synkronointia, tiedonkeruuta ja reititystä. Lisäksi on simuloitu eri reititystapoja, sisäpaikannusta ja kaivinkoneen kalibrointia soveltaen mm. neurolaskentaa. Tekniikkaa on testattu myös käytännön sovelluksissa. Ympäristöälykkäät sovellusalueet ovat ehkä nopeimmin kasvava lähitulevaisuuden ala tietotekniikassa. Tutkitulla tekniikalla on runsaasti uusia haasteita ihmisten hyvinvointia, terveyttä ja turvallisuutta lisäävissä sovelluksissa, kuten myös teollisuuden uusissa sovelluksissa, esimerkiksi älykkäässä energiansiirtoverkossa.The development of computing is moving from mainframe computers to distributed intelligence with wireless features. The automated functions around us, in the form of small electronic devices, are increasing and the pace is continuously accelerating. The number of these applications will increase in the future, but suitable features needed are lacking and suitable technology development is still ongoing. The existing wireless short-range standards are mostly suitable for use in industry and in multimedia applications, but they are only partly suitable for the new network feature demands of the ambient intelligence applications. The ambient intelligent applications will serve us in our daily lives: security, access control and exercise services. Ambient intelligence is also adopted by industry in distributed amorphous automation, in access monitoring and the control of machines and devices. During this research, at Seinäjoki University of Applied Sciences, we have researched, designed and developed short-range wireless technology: low-power radio buttons with a programming environment for them as well as synchronization, data collecting and routing features for the wireless network. We have simulated different routing methods, indoor positioning and excavator calibration using for example neurocomputing. In addition, we have tested the technology in practical applications. The ambient intelligent applications are perhaps the area growing the most in information technology in the future. There will be many new challenges to face to increase welfare, health, security, as well as industrial applications (for example, at factories and in smart grids) in the future.fi=vertaisarvioitu|en=peerReviewed

Internet of Things Strategic Research Roadmap

Internet of Things (IoT) is an integrated part of Future Internet including existing and evolving Internet and network developments and could be conceptually defined as a dynamic global network infrastructure with self configuring capabilities based on standard and interoperable communication protocols where physical and virtual “things” have identities, physical attributes, and virtual personalities, use intelligent interfaces, and are seamlessly integrated into the information network

NASA space station automation: AI-based technology review

Research and Development projects in automation for the Space Station are discussed. Artificial Intelligence (AI) based automation technologies are planned to enhance crew safety through reduced need for EVA, increase crew productivity through the reduction of routine operations, increase space station autonomy, and augment space station capability through the use of teleoperation and robotics. AI technology will also be developed for the servicing of satellites at the Space Station, system monitoring and diagnosis, space manufacturing, and the assembly of large space structures

A fault-tolerant multiprocessor architecture for aircraft, volume 1

A fault-tolerant multiprocessor architecture is reported. This architecture, together with a comprehensive information system architecture, has important potential for future aircraft applications. A preliminary definition and assessment of a suitable multiprocessor architecture for such applications is developed

Ultra Reliable Computing Systems

For high security and safety applications as well as general purpose applications, it is necessary to have ultra reliable computing systems. This dissertation describes our system of self-testable and self-repairable digital devices, especially, EPLDs (Electrically Programmable Logic Devices). In addition to significantly improving the reliability of digital systems, our self-healing and re-configurable system design with added repair capability can also provide higher yields, lower testing costs, and faster time-to-market for the semiconductor industry. The digital system in our approach is composed of blocks, which realize combinational and sequential circuits using GALs (Generic Array Logic Devices). We describe three techniques for fault-locating and fault-repairing in these devices. The methodology we used for evaluation of these methods and a comparison with devices that have no self-repair capability was simulation of the self-repair algorithms. Our simulations show that the lifetime for a GAL-based EPLD that uses our multiple self-repairing methods is longer than the lifetime of a GAL-based EPLD that uses a single self-repair method or no self-repair method. Specifically, our work demonstrates that the lifetime of a GAL can be increased by adding extra columns in the AND array of a GAL and extra output ORs in a GAL. It also gives information on how many extra columns and extra ORs a GAL needs and which self-repairing method should be used to guarantee a given lifetime. Thus, we can estimate an ideal point, where the maximum reliability can be reached with the minimum cost