The manufacture and characterisation of microscale magnetic components.

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DESIGN AND ELECTROMAGNETIC MODELING OF INTEGRATED LC FILTER IN A BUCK CONVERTER

This paper presents the design and electromagnetic modeling ‎of a new structure of integrated ‎low-pass LC filter in a buck converter. This micro-filter consists of a planar circular coil ‎placed between two Mn-Zn ferrite substrates. Mn-Zn ferrite has been chosen because of its high permeability and permittivity. In this micro-filter substrates act not only as a magnetic core but also as a capacitor. A modelling of the electromagnetic and electric behavior of the integrated filter, we have simulated with the help of the ‎software PSIM 9.0 on the equivalent electrical circuit of the dimensioned filter. A ‎visualization of the different electromagnetic phenomena that appear during the ‎operation of the filter is determined in 3D space dimension using the finite element ‎method.

The Performance of an Integrated Transformer in a DC/DC Converter

The separation between the low-voltage part and high-voltage part of the converter is formed by a transformer that transfers power while jamming the DC ring. The resonant mode power oscillator is utilized to allow elevated competence power transfer. The on-chip transformer is probable to have elevated value inductance, elevated quality factors and elevated coupling coefficient to decrease the loss in the oscillation. The performance of a transformer is extremely dependent on the structure, topology and other essential structures that create it compatible with the integrated circuits IC process such as patterned ground shield (PGS). Different types of transformers are modeled and simulated in MATLAB; the performances are compared to select the optimum design. The on-chip transformer model is simulated and the Results of MATLAB simulation are exposed, showing an excellent agreement in radio frequency RF

Ferrite-based micro-inductors for power systems on chip : from material elaboration to inductor optimisation

Les composants passifs intégrés sont des éléments clés pour les futures alimentations sur puce, compactes et présentant des performances améliorées: haut rendement et forte densité de puissance. L'objectif de ce travail de thèse est d'étudier les matériaux et la technologie pour réaliser de bobines à base de ferrite, intégrées sur silicium, avec des faibles empreintes (<4 mm ²) et de faible épaisseur (<250 µm). Ces bobines, dédiées à la conversion de puissance (˜ 1 W) doivent présenter une forte inductance spécifique et un facteur de qualité élevé dans la gamme de fréquence visée (5-10 MHz). Des ferrites de NiZn ont été sélectionnées comme matériaux magnétiques pour le noyau des bobines en raison de leur forte résistivité et de leur perméabilité stable dans la gamme de fréquence visée. Deux techniques sont développées pour les noyaux de ferrite: la sérigraphie d'une poudre synthétisée au laboratoire et la découpe automatique de films de ferrite commerciaux, suivi dans chaque cas du frittage et le placement sur les conducteurs pour former une bobine rectangulaire. Des bobines tests ont été réalisées dans un premier temps afin que la caractérisation puisse être effectuée : les propriétés magnétiques du noyau de ferrite notamment les pertes volumiques dans le noyau sont ainsi extraites. L'équation de Steinmetz a permis de corréler les courbes de pertes mesurées avec des expressions analytiques en fonction de la fréquence et de l'induction. La deuxième phase de la thèse est l'optimisation de la conception de la micro-bobine à base de ferrite, en tenant compte des pertes attendues. L'algorithme générique est utilisé pour optimiser les dimensions de la bobine avec pour objectif ; la minimisation des pertes et l'obtention de la valeur d'inductance spécifique souhaitée, sous faible polarisation en courant. La méthode des éléments finis pour le magnétisme FEMM est utilisée pour modéliser le comportement électromagnétique du composant. La deuxième série de prototypes a été réalisée afin de valider la méthode d'optimisation. En perspective, les procédés de photolithographie de résine épaisse et le dépôt électrolytique sont en cours de développement pour réaliser les enroulements de cuivre épais autour des noyaux de ferrite optimisés et ainsi former le composant complet.On-chip inductors are key passive elements for future power supplies on chip (PwrSoC), which are expected to be compact and show enhanced performance: high efficiency and high power density. The objective of this thesis work is to study the material and technology to realize small size (<4 mm²) and low profile (< 250 µm) ferrite-based on-chip inductor. This component is dedicated to low power conversion (˜ 1 W) and should provide high inductance density and high quality factor at medium frequency range (5-10 MHz). Fully sintered NiZn ferrites are selected as soft magnetic materials for the inductor core because of their high resistivity and moderate permeability stable in the frequencies range of interest. Two techniques are developed for the ferrite cores: screen printing of in-house made ferrite powder and cutting of commercial ferrite films, followed in each case by sintering and pick-and place assembling to form the rectangular toroid inductor. Test inductors were realized first so that the characterization could be carried out to study the magnetic properties of the ferrite core and the volumetric core losses. The core losses were fit from the measured curve with Steinmetz equation to obtain analytical expressions of losses versus frequency and induction. The second phase of the thesis is the design optimization for the on-chip ferrite based inductor, taking into account the expected losses. Genetic algorithm is employed to optimize the inductor design with the objective function as minimum losses and satisfying the specification on the inductance values under weak current-bias condition. Finite element method for magnetics FEMM is used as a tool to calculate inductance and losses. The second run of prototypes was done to validate the optimization method. In perspective, processes of thick-photoresist photolithography and electroplating are being developed to realize the completed thick copper windings surrounding ferrite cores

Characterisation and integration of materials and processes for planar spiral microinductors with permalloy cores

The increasing density of electronics within portable electronic devices provides the motivation to develop more compact power electronics, such as DC-DC converters. Typically, integrated circuits and each passive component, such as inductors, are discreetly packaged and mounted on printed circuit board (PCB), to implement the converter. Hence for further size reduction there has been growing interest for integration schemes such as Power supply in package (PwrSiP). However, the ultimate goal is the monolithic integration of the power supply solution, in an integration scheme known as Power Supply on Chip (PwrSoC). The economic effectiveness of the converter will be determined by the device footprint and number of processing steps required to fabricate the inductor. Hence, the motivation behind this thesis is the need for microinductors with large inductance density (inductance per device footprint) while maintaining low losses, which can be integrated with silicon IC. Furthermore, the need for thick layers will result in issues with yield and reliability of the fabricated device. Hence there is a need to identify, characterise and integrate materials with low residual stress into the microinductor fabrication process. A typical choice of inter-coil dielectric is the photo-definable epoxy SU-8. However, SU-8 suffers from intrinsic issues with high residual stress and adhesion. One possible replacement for SU-8 as a structural and dielectric layer is Parylene-C. The first objective of this thesis proposes a test-bed inductor process, which incorporates Parylene as a structural and dielectric layer and has a short turnaround time of one week. This fabrication process involves the filling of high aspect ratio gaps between copper structures with Parylene and subsequent chemical mechanical planarisation, and a test chip has been designed to characterise these processes. Additionally, Scotch-tape testing has been used to confirm suitable Parylene adhesion to patterned and unpatterned films used in this process. Subsequently, complete microinductors, with magnetic cores, have been fabricated, characterised and benchmarked against other inductor technologies and architectures reported in the literature. Parylene is expected to produce films with low residual stress due to its room temperature deposition process. However, the test-bed inductor process requires thermal treatments up to 140°C. Hence it was necessary to characterise the stress in Parylene films as a result of processing temperature and compare this to stress levels in SU-8 5 and 3005 films. This study has determined the spatial variation of residual stress in Parylene-C and SU-8 films, by combining automated measurements of strain indicator test structures and local nanoindentation measurements of Young’s modulus. These measurements have been used to wafer map strain, Young’s modulus, and subsequently residual stress in these films, as a result of processing parameter variation. It is well known that placing ferromagnetic material in close proximity to current carrying coils can further enhance the measured inductance value. However, the conductive magnetic core is also a source of loss for the microinductor. Hence, magnetic permeability, electrical resistivity and mechanical stress in the magnetic core influence the inductance value, eddy current losses and reliability of the fabricated microinductor, respectively. The ability to characterise these properties on wafer is essential for process control and verification measurements. This thesis details a test chip capable of routine measurements on NiFe films to characterise the spatial variation of these properties. Furthermore, wafer mapping measurements are reported to identify the correlation between high frequency permeability, electrical resistivity, mechanical strain and the chemical composition of two-component Permalloy film (NixFe(100-x)) electroplated on the surface of 100mm silicon wafers. Finally, MEMS-based inductor fabrication processes typically require a number of electrodeposition steps, which require conductive seed layers for the deposition of the coils and magnetic core material. A typical choice of seed layer is copper. However, due to copper’s paramagnetic behaviour (μ = 1) and low electrical resistivity (ρ=6.69μΩ.cm) this layer contributes to eddy current losses, while acting as a thin ‘screening layer’. It is very likely that using a magnetic seed layer, within the magnetic core, will noticeably reduce eddy current related losses. However, detailed systematic experimental studies on any such improvement have not been documented in the literature. This study involves compositional, structural, electrical and magnetic characterisation of Ni80Fe20 films electro-deposited on non-magnetic and magnetic seed layers (i.e. copper and nickel respectively). Mechanical strain test structures and X-ray analysis have been used to characterise the stress levels and structural properties of Ni80Fe20 films electro-deposited on both copper and nickel seed layers. In addition, planar spiral micro-inductors, both with and without patterned magnetic cores, have been fabricated to determine the effect of patterning on their performance. This is in addition to quantifying the improvement in the electrical performance resulting from the enhanced magnetic and resistive contribution provided by magnetic seed layers

A Novel Variable Geometry based Planar Inductor Design for Wireless Charging Application

In this thesis, the performance, modelling and application of a planar electromagnetic coil are discussed. Due to the small size profiles and their non‐contact nature, planar coils are widely used due to their simple and basic design. The uncertain parameters have been identified and simulated using ANSYS that has been run utilising a newly developed MATLAB code. This code has made it possible to run thousands of trials without the need to manually input the various parameters for each run. This has facilitated the process of obtaining all the probable solutions within the defined range of properties. The optimum and robust design properties were then determined. The thesis discusses the experimentation and the finite element modelling (FEM) performed for developing the design of planar coils and used in wireless chargers. In addition, the thesis investigates the performance of various topologies of planar coils when they are used in wireless chargers. The ANSYS Maxwell FEM package has been used to analyse the models while varying the topologies of the coils. For this purpose, different models in FEM were constructed and then tested with topologies such as circular, square and hexagon coil configurations. The described methodology is considered as an effective way for obtaining maximum Power transfer efficiency (PTE) with a certain distance on planar coils with better performance. The explored designs studies are, namely: (1) Optimization of Planar Coil Using Multi-core, (2) planar coil with an Orthogonal Flux Guide, (3) Using the Variable Geometry in a Planar coil for an Optimised Performance by using the robust design method, (4) Design and Integration of Planar coil on wireless charger. In the first design study, the aim is to present the behaviour of a newly developed planar coil, built from a Mu-metal, via simulation. The structure consists of an excitation coil, sensing coils and three ferromagnetic cores 2 located on the top, middle and bottom sections of the coil in order to concentrate the field using the iterative optimisation technique. Magnetic materials have characteristics which allows them to influence the magnetic field in its environment. The second design study presents the optimal geometry and material selection for the planar with an Orthogonal Flux Guide. The study demonstrates the optimising of the materials and geometry of the coil that provides savings in terms of material usage as well as the employed electric current to produce an equivalent magnetic field. The third design study presents the variable geometry in a planar inductor to obtain the optimised performance. The study has provided the optimum and robust design parameters in terms of different topologies such as circular, square and hexagon coil configurations and then tested, Once the best topology is chosen based on performance. The originality of the work is evident through the randomisation of the parameters using the developed MATLAB code and the optimisation of the joint performance under defined conditions. Finally, the fourth design study presents the development of the planar coil applications. Three shapes of coils are designed and experimented to calculate the inductance and the maximum power transfer efficiency (PTW) over various spacing distances and frequency

Design and Fabrication of Bond Wire Micro-Magnetics

This thesis presents a new approach for the design and fabrication of bond wire magnetics for power converter applications by using standard IC gold bonding wires and micro-machined magnetic cores. It shows a systematic design and characterization study for bond wire transformers with toroidal and race-track cores for both PCB and silicon substrates. Measurement results show that the use of ferrite cores increases the secondary self-inductance up to 315 µH with a Q-factor up to 24.5 at 100 kHz. Measurement results on LTCC core report an enhancement of the secondary self-inductance up to 23 µH with a Q-factor up to 10.5 at 1.4 MHz. A resonant DC-DC converter is designed in 0.32 µm BCD6s technology at STMicroelectronics with a depletion nmosfet and a bond wire micro-transformer for EH applications. Measures report that the circuit begins to oscillate from a TEG voltage of 280 mV while starts to convert from an input down to 330 mV to a rectified output of 0.8 V at an input of 400 mV. Bond wire magnetics is a cost-effective approach that enables a flexible design of inductors and transformers with high inductance and high turns ratio. Additionally, it supports the development of magnetics on top of the IC active circuitry for package and wafer level integrations, thus enabling the design of high density power components. This makes possible the evolution of PwrSiP and PwrSoC with reliable highly efficient magnetics