Millimeter-Wave MMICs and Applications

As device technology improves, interest in the millimeter-wave band grows. Wireless communication systems migrate to higher frequencies, millimeter-wave radars and passive sensors find new solid-state implementations that promise improved performance, and entirely new applications in the millimeter-wave band become feasible. The circuit or system designer is faced with a new and unique set of challenges and constraints to deal with in order to use this portion of the spectrum successfully. In particular, the advantages of monolithic integration become increasingly important. This thesis presents many new developments in Monolithic Millimeter-Wave Integrated Circuits (MMICs), both the chips themselves and systems that use them. It begins with an overview of the various applications of millimeter waves, including a discussion of specific projects that the author is involved in and why many of them demand a MMIC implementation. In the subsequent chapters, new MMIC chips are described in detail, as is the role they play in real-world projects. Multi-chip modules are also presented with specific attention given to the practical details of MMIC packaging and multi-chip integration. The thesis concludes with a summary of the works presented thus far and their overall impact on the field of millimeter-wave engineering.</p

SiGe-based broadband and high suppression frequency doubler ICs for wireless communications

制度:新 ; 報告番号:甲3419号 ; 学位の種類:博士(工学) ; 授与年月日:2011/9/15 ; 早大学位記番号:新574

Cryogenic Ultra-Low Noise InP High Electron Mobility Transistors

Indium phosphide high electron mobility transistors (InP HEMTs), are today the best transistors for cryogenic low noise amplifiers at microwave frequencies. Record noise temperatures below 2 K using InP HEMT equipped cryogenic low noise amplifiers (LNAs) were demonstrated already a decade ago. Since then, reported progress in further reducing noise has been slow. This thesis presents new technology optimization, modeling, measurements and circuit implementation for the cryogenic InP HEMT. The findings have been used to demonstrate a new record minimum noise temperature of 1 K at 6 GHz. The thesis considers aspects all the way from material, process and device design, to hybrid and monolithic microwave integrated circuit (MMIC) LNAs. The epitaxial structure has been developed for lower access resistance and improved transport characteristics. By investigating device passivation, metallization, gate recess etch, and circuit integration, low-noise InP HEMT performance was optimized for cryogenic operation. When integrating the InP HEMT in a 4-8 GHz 3-stage hybrid LNA, a noise temperature of 1.2 K was measured at 5.2 GHz and 10 K operating temperature. The extracted minimum noise temperature of the InP HEMT was 1 K at 6 GHz. The low-frequency 1/f noise in the 1 Hz to 1 GHz range and gain fluctuations in the 1Hz to 100 kHz range have been measured for six different types of HEMTs, and compared to two different SiGe heterojunction bipolar transistors (HBTs). The results showed that radiometer chop rates in the kHz range are needed for millimeter wave radiometers with 10 GHz bandwidth. A comparative study of GaAs metamorphic HEMTs (mHEMTs) and InP HEMTs has been performed. When integrated in a 4-8 GHz 3-stage LNA, the InP HEMT LNA exhibited 1.6 K noise temperature whereas the GaAs mHEMT LNA showed 5 K. The observed superior cryogenic noise performance of the InP HEMT compared to the GaAs MHEMT was related to a difference in quality of pinch-off as observed in I-V characteristics at 300 K and 10 K. To demonstrate the low noise performance of the InP HEMT technology, a 0.5-13 GHz and a 24-40 GHz cryogenic monolithic microwave integrated circuit (MMIC) LNA was fabricated. Both designs showed state-of-the-art low noise performance, promising for future radio astronomy receivers such as the square kilometer array

Passive and active circuits in cmos technology for rf, microwave and millimeter wave applications

The permeation of CMOS technology to radio frequencies and beyond has fuelled an urgent need for a diverse array of passive and active circuits that address the challenges of rapidly emerging wireless applications. While traditional analog based design approaches satisfy some applications, the stringent requirements of newly emerging applications cannot necessarily be addressed by existing design ideas and compel designers to pursue alternatives. One such alternative, an amalgamation of microwave and analog design techniques, is pursued in this work. A number of passive and active circuits have been designed using a combination of microwave and analog design techniques. For passives, the most crucial challenge to their CMOS implementation is identified as their large dimensions that are not compatible with CMOS technology. To address this issue, several design techniques – including multi-layered design and slow wave structures – are proposed and demonstrated through experimental results after being suitably tailored for CMOS technology. A number of novel passive structures - including a compact 10 GHz hairpin resonator, a broadband, low loss 25-35 GHz Lange coupler, a 25-35 GHz thin film microstrip (TFMS) ring hybrid, an array of 0.8 nH and 0.4 nH multi-layered high self resonant frequency (SRF) inductors are proposed, designed and experimentally verified. A number of active circuits are also designed and notable experimental results are presented. These include 3-10 GHz and DC-20 GHz distributed low noise amplifiers (LNA), a dual wideband Low noise amplifier and 15 GHz distributed voltage controlled oscillators (DVCO). Distributed amplifiers are identified as particularly effective in the development of wideband receiver front end sub-systems due to their gain flatness, excellent matching and high linearity. The most important challenge to the implementation of distributed amplifiers in CMOS RFICs is identified as the issue of their miniaturization. This problem is solved by using integrated multi-layered inductors instead of transmission lines to achieve over 90% size compression compared to earlier CMOS implementations. Finally, a dual wideband receiver front end sub-system is designed employing the miniaturized distributed amplifier with resonant loads and integrated with a double balanced Gilbert cell mixer to perform dual band operation. The receiver front end measured results show 15 dB conversion gain, and a 1-dB compression point of -4.1 dBm in the centre of band 1 (from 3.1 to 5.0 GHz) and -5.2 dBm in the centre of band 2 (from 5.8 to 8 GHz) with input return loss less than 10 dB throughout the two bands of operation

Efficient and Linear CMOS Power Amplifier and Front-end Design for Broadband Fully-Integrated 28-GHz 5G Phased Arrays

Demand for data traffic on mobile networks is growing exponentially with time and on a global scale. The emerging fifth-generation (5G) wireless standard is being developed with millimeter-wave (mm-Wave) links as a key technological enabler to address this growth by a 2020 time frame. The wireless industry is currently racing to deploy mm-Wave mobile services, especially in the 28-GHz band. Previous widely-held perceptions of fundamental propagation limitations were overcome using phased arrays. Equally important for success of 5G is the development of low-power, broadband user equipment (UE) radios in commercial-grade technologies. This dissertation demonstrates design methodologies and circuit techniques to tackle the critical challenge of key phased array front-end circuits in low-cost complementary metal oxide semiconductor (CMOS) technology. Two power amplifier (PA) proof-of-concept prototypes are implemented in deeply scaled 28- nm and 40-nm CMOS processes, demonstrating state-of-the-art linearity and efficiency for extremely broadband communication signals. Subsequently, the 40 nm PA design is successfully embedded into a low-power fully-integrated transmit-receive front-end module. The 28 nm PA prototype in this dissertation is the first reported linear, bulk CMOS PA targeting low-power 5G mobile UE integrated phased array transceivers. An optimization methodology is presented to maximizing power added efficiency (PAE) in the PA output stage at a desired error vector magnitude (EVM) and range to address challenging 5G uplink requirements. Then, a source degeneration inductor in the optimized output stage is shown to further enable its embedding into a two-stage transformer-coupled PA. The inductor helps by broadening inter-stage impedance matching bandwidth, and helping to reduce distortion. Designed and fabricated in 1P7M 28 nm bulk CMOS and using a 1 V supply, the PA achieves +4.2 dBm/9% measured Pout/PAE at −25 dBc EVM for a 250 MHz-wide, 64-QAM orthogonal frequency division multiplexing (OFDM) signal with 9.6 dB peak-to-average power ratio (PAPR). The PA also achieves 35.5%/10% PAE for continuous wave signals at saturation/9.6dB back-off from saturation. To the best of the author’s knowledge, these are the highest measured PAE values among published K- and K a-band CMOS PAs to date. To drastically extend the communication bandwidth in 28 GHz-band UE devices, and to explore the potential of CMOS technology for more demanding access point (AP) devices, the second PA is demonstrated in a 40 nm process. This design supports a signal radio frequency bandwidth (RFBW) >3× the state-of-the-art without degrading output power (i.e. range), PAE (i.e. battery life), or EVM (i.e. amplifier fidelity). The three-stage PA uses higher-order, dual-resonance transformer matching networks with bandwidths optimized for wideband linearity. Digital gain control of 9 dB range is integrated for phased array operation. The gain control is a needed functionality, but it is largely absent from reported high-performance mm-Wave PAs in the literature. The PA is fabricated in a 1P6M 40 nm CMOS LP technology with 1.1 V supply, and achieves Pout/PAE of +6.7 dBm/11% for an 8×100 MHz carrier aggregation 64-QAM OFDM signal with 9.7 dB PAPR. This PA therefore is the first to demonstrate the viability of CMOS technology to address even the very challenging 5G AP/downlink signal bandwidth requirement. Finally, leveraging the developed PA design methodologies and circuits, a low power transmit-receive phased array front-end module is fully integrated in 40 nm technology. In transmit-mode, the front-end maintains the excellent performance of the 40 nm PA: achieving +5.5 dBm/9% for the same 8×100 MHz carrier aggregation signal above. In receive-mode, a 5.5 dB noise figure (NF) and a minimum third-order input intercept point (IIP₃) of −13 dBm are achieved. The performance of the implemented CMOS frontend is comparable to state-of-the-art publications and commercial products that were very recently developed in silicon germanium (SiGe) technologies for 5G communication

MMIC-based Low Phase Noise Millimetre-wave Signal Source Design

Wireless technology for future communication systems has been continuously evolving to meet society’s increasing demand on network capacity. The millimetre-wave frequency band has a large amount of bandwidth available, which is a key factor in enabling the capability of carrying higher data rates. However, a challenge with wideband systems is that the capacity of these systems is limited by the noise floor of the local oscillator (LO). The LO in today’s communication systems is traditionally generated at low frequency and subsequently multiplied using frequency multipliers, leading to a significant degradation of the LO noise floor at millimetre-wave frequencies. For this reason, the thesis considers low phase noise millimetre-wave signal source design optimised for future wideband millimetre-wave communications.In an oscillator, low frequency noise (LFN) is up-converted into phase noise around the microwave signal. Thus, aiming for low phase noise oscillator design, LFN characterisations and comparisons of several common III-V transistor technologies, e.g. GaAs-InGaP HBTs, GaAs pHEMTs, and GaN HEMTs, are carried out. It is shown that GaN HEMTs have good potential for oscillator applications where far-carrier phase noise performance is critical, e.g. wideband millimetre-wave communications. Since GaN HEMT is identified as an attractive technology for low noise floor oscillator applications, an in-depth study of some factors which affects LFN characteristics of III-N GaN HEMTs such as surface passivation methods and variations in transistor geometry are also investigated. It is found that the best surface passivation and deposition method can improve the LFN level of GaN HEMT devices significantly, resulting in a lower oscillator phase noise. Several MMIC GaN HEMT based oscillators including X-band Colpitts voltage-controlled-oscillators (VCOs) and Ka-band reflection type oscillators are demonstrated. It is verified that GaN HEMT based oscillators can reach a low noise floor. For instance, X-band GaN HEMT VCOs and a Ka-band GaN HEMT reflection type oscillator with 1 MHz phase noise performance of -135 dBc/Hz and -129 dBc/Hz, respectively, are demonstrated. These results are not only state-of-the-art for GaN HEMT oscillators, but also in-line with the best performance reported for GaAs-InGaP HBT based oscillators. Further, the MMIC oscillator designs are combined with accurate phase noise calculations based on a cyclostationary method and experimental LFN data. It has been seen that the measured and calculated phase noise agree well.The final part of this thesis covers low phase noise millimetre-wave signal source design and a comparison of different architectures and technological approaches. Specifically, a fundamental frequency 220 GHz oscillator is designed in advanced 130 nm InP DHBT process and a D-band signal source is based on the Ka-band GaN HEMT oscillator presented above and followed by a SiGe BiCMOS MMIC including a sixtupler and an amplifier. The Ka-band GaN HEMT oscillator is used to reach the critical low noise floor. The 220 GHz signal source presents an output power around 5 dBm, phase noise of -110 dBc/Hz at 10 MHz offset and a dc-to-RF efficiency in excess of 10% which is the highest number reported in open literature for a fundamental frequency signal source beyond 200 GHz. The D-band signal source, on the other hand, presents an output power of 5 dBm and phase noise of -128 dBc/Hz at 10 MHz offset from a 135 GHz carrier signal. Commenting on the performance of these two different millimetre-wave signal sources, the GaN HEMT/SiGe HBT source presents the best normalized phase noise at 10 MHz, while the integrated InP HBT oscillator demonstrates significantly better conversion efficiency and still a decent phase noise

Innovative Design and Realization of Microwave and Millimeter-Wave Integrated circuits

Ph.DDOCTOR OF PHILOSOPH