The Deformable Mirror Demonstration Mission (DeMi) CubeSat: optomechanical design validation and laboratory calibration

Coronagraphs on future space telescopes will require precise wavefront correction to detect Earth-like exoplanets near their host stars. High-actuator count microelectromechanical system (MEMS) deformable mirrors provide wavefront control with low size, weight, and power. The Deformable Mirror Demonstration Mission (DeMi) payload will demonstrate a 140 actuator MEMS deformable mirror (DM) with \SI{5.5}{\micro\meter} maximum stroke. We present the flight optomechanical design, lab tests of the flight wavefront sensor and wavefront reconstructor, and simulations of closed-loop control of wavefront aberrations. We also present the compact flight DM controller, capable of driving up to 192 actuator channels at 0-250V with 14-bit resolution. Two embedded Raspberry Pi 3 compute modules are used for task management and wavefront reconstruction. The spacecraft is a 6U CubeSat (30 cm x 20 cm x 10 cm) and launch is planned for 2019.Comment: 15 pages, 10 figues. Presented at SPIE Astronomical Telescopes + Instrumentation, Austin, Texas, US

Voyager electronic parts radiation program, volume 1

The Voyager spacecraft is subject to radiation from external natural space, from radioisotope thermoelectric generators and heater units, and from the internal environment where penetrating electrons generate surface ionization effects in semiconductor devices. Methods for radiation hardening and tests for radiation sensitivity are described. Results of characterization testing and sample screening of over 200 semiconductor devices in a radiation environment are summarized

NEGATIVE BIAS TEMPERATURE INSTABILITY STUDIES FOR ANALOG SOC CIRCUITS

Negative Bias Temperature Instability (NBTI) is one of the recent reliability issues in sub threshold CMOS circuits. NBTI effect on analog circuits, which require matched device pairs and mismatches, will cause circuit failure. This work is to assess the NBTI effect considering the voltage and the temperature variations. It also provides a working knowledge of NBTI awareness to the circuit design community for reliable design of the SOC analog circuit. There have been numerous studies to date on the NBTI effect to analog circuits. However, other researchers did not study the implication of NBTI stress on analog circuits utilizing bandgap reference circuit. The reliability performance of all matched pair circuits, particularly the bandgap reference, is at the mercy of aging differential. Reliability simulation is mandatory to obtain realistic risk evaluation for circuit design reliability qualification. It is applicable to all circuit aging problems covering both analog and digital. Failure rate varies as a function of voltage and temperature. It is shown that PMOS is the reliabilitysusceptible device and NBTI is the most vital failure mechanism for analog circuit in sub-micrometer CMOS technology. This study provides a complete reliability simulation analysis of the on-die Thermal Sensor and the Digital Analog Converter (DAC) circuits and analyzes the effect of NBTI using reliability simulation tool. In order to check out the robustness of the NBTI-induced SOC circuit design, a bum-in experiment was conducted on the DAC circuits. The NBTI degradation observed in the reliability simulation analysis has given a clue that under a severe stress condition, a massive voltage threshold mismatch of beyond the 2mV limit was recorded. Bum-in experimental result on DAC proves the reliability sensitivity of NBTI to the DAC circuitry

A 4-channel 12-bit high-voltage radiation-hardened digital-to-analog converter for low orbit satellite applications

This paper presents a circuit design and an implementation of a four-channel 12-bit digital-to-analog converter (DAC) with high-voltage operation and radiation-tolerant attribute using a specific CSMC H8312 0.5-μm Bi-CMOS technology to achieve the functionality across a wide-temperature range from -55 °C to 125 °C. In this paper, an R-2R resistor network is adopted in the DAC to provide necessary resistors matching which improves the DAC precision and linearity with both the global common centroid and local common centroid layout. Therefore, no additional, complicated digital calibration or laser-trimming are needed in this design. The experimental and measurement results show that the maximum frequency of the single-chip four-channel 12-bit R-2R ladder high-voltage radiation-tolerant DAC is 100 kHz, and the designed DAC achieves the maximum value of differential non-linearity of 0.18 LSB, and the maximum value of integral non-linearity of -0.53 LSB at 125 °C, which is close to the optimal DAC performance. The performance of the proposed DAC keeps constant over the whole temperature range from -55 °C to 125 °C. Furthermore, an enhanced radiation-hardened design has been demonstrated by utilizing a radiation chamber experimental setup. The fabricated radiation-tolerant DAC chipset occupies a die area of 7 mm x 7 mm in total including pads (core active area of 4 mm x 5 mm excluding pads) and consumes less than 525 mW, output voltage ranges from -10 to +10 V

A Fully-Integrated Adaptive Temperature-Compensating Ethernet Equalizer for Automotive Applications

Department of Electrical EngineeringIn this paper, the Ethernet equalizer that compensates automotive temperature range is presented. More and more, the communications in automotive are important because of many electronics in the vehicle. Ethernet protocol can be candidate of automotive communications. However it should satisfy AEC-Q100. For meeting AEC-Q100, it should have an operational temperature range from -40 degree to 150 degree. This paper proposes the Ethernet equalizer that can recover the data until 100m CAT-5 cable adaptively at -40 degree to 150 degree. For supporting the wide temperature range, feedback system is used. The proposed equalizer has 31.25 MHz bandwidth and a fully-differential structure. The proposed automotive Ethernet equalizer is implemented in a Hynix 0.13 um BCDMOS technology.ope

Impact of atomistic device variability on analogue circuit design

Scaling of complementary metal-oxide-semiconductor (CMOS) technology has benefited the semiconductor industry for almost half a century. For CMOS devices with a physical gate-length in the sub-100 nm range, extreme device variability is introduced and has become a major stumbling block for next generation analogue circuit design. Both opportunities and challenges have therefore confronted analogue circuit designers. Small geometry device can enable high-speed analogue circuit designs, such as data conversion interfaces that can work in the radio frequency range. These designs can be co-integrated with digital systems to achieve low cost, high-performance, single-chip solutions that could only be achieved using multi-chip solutions in the past. However, analogue circuit designs are extremely vulnerable to device mismatch, since a large number of symmetric transistor pairs and circuit cells are required. The increase in device variability from sub-100 nm processes has therefore significantly reduced the production yield of the conventional designs. Mismatch models have been developed to analytically evaluate the magnitude of random variations. Based on measurements from custom designed test structures, the statistics of process variation can be estimated using design related parameters. However, existing models can no longer accurately estimate the magnitude of mismatch for sub-100 nm “atomistic” devices, since short-channel effects have become important. In this thesis, a new mismatch model for small geometry devices will be proposed to address this problem. Based on knowledge of the matching performance obtained from the mismatch model, design solutions are desired at different design levels for a variety of circuit topologies. In this thesis, transistor level compensation solutions have been investigated and closed-loop compensation circuits have been proposed. At circuit level, a latch-based comparator has been used to develop a compensation solution because this type of comparator is extremely sensitive to the device mismatch. These comparators are also used as the fundamental building block for the analogue-to-digital converters (ADC). The proposed comparator compensation scheme is used to improve the performance of a high-speed flash ADC

Design and Assembly of High-Temperature Signal Conditioning System on LTCC with Silicon Carbide CMOS Circuits

The objective of the work described in this dissertation paper is to develop a prototype electronic module on a low-temperature co-fired ceramic (LTCC) material. The electronic module would perform signal conditioning of sensor signals (thermocouples) operating under extreme conditions for applications like gas turbines to collect data on the health of the turbine blades during operation so that the turbines do not require shutdown for inspection to determine if maintenance is required. The collected data can indicate when such shutdowns, which cost $1M per day, should be scheduled and maintenance actually performed. The circuits for the signal conditioning system within the prototype module must survive the extreme temperature, pressure, and centrifugal force, or G-force, present in these settings. Multiple fabrication runs on different integrated silicon carbide (SiC) process technologies have been carried out to meet the system requirements. The key circuits described in this dissertation are - two-stage op amp topologies and voltage reference, which are designed and fabricated in a new SiC CMOS process. The SiC two-stage op amp with PFET differential input pair showed 48.9 dB of DC gain at 500oC. The voltage reference is the first in SiC CMOS technology to employ an op amp-based topology. The op amp circuit in the voltage reference is a two-stage with NFET differential input pair that uses the indirect compensation technique for the first time in the SiC CMOS process to provide 42.5 dB gain at 350oC. The designed prototype module implemented with these circuits was verified to provide signal conditioning and signal transmission at 300oC. The signal transmission circuit on the module was also verified to operate with a resonant inductive wireless power transfer method at a frequency of 11.8 MHz for the first time. A second prototype module was also developed with the previously fabricated 1.2 µm SiC CMOS process. The second module was successfully tested (with wired power supply) to operate at 440oC inside a probe-station and also verified for the first time to sustain signal transmission (34.65 MHz) capability inside a spin-rig at a rotational speed of 10,920 rpm. All designed modules have dimensions of (length) 68.5 mm by (width) 34.3 mm to conform to the physical size requirements of the gas turbine blade

The PreAmplifier ShAper for the ALICE TPC-Detector

In this paper the PreAmplifier ShAper (PASA) for the Time Projection Chamber (TPC) of the ALICE experiment at LHC is presented. The ALICE TPC PASA is an ASIC that integrates 16 identical channels, each consisting of Charge Sensitive Amplifiers (CSA) followed by a Pole-Zero network, self-adaptive bias network, two second-order bridged-T filters, two non-inverting level shifters and a start-up circuit. The circuit is optimized for a detector capacitance of 18-25 pF. For an input capacitance of 25 pF, the PASA features a conversion gain of 12.74 mV/fC, a peaking time of 160 ns, a FWHM of 190 ns, a power consumption of 11.65 mW/ch and an equivalent noise charge of 244e + 17e/pF. The circuit recovers smoothly to the baseline in about 600 ns. An integral non-linearity of 0.19% with an output swing of about 2.1 V is also achieved. The total area of the chip is 18 mm$^2$ and is implemented in AMS's C35B3C1 0.35 micron CMOS technology. Detailed characterization test were performed on about 48000 PASA circuits before mounting them on the ALICE TPC front-end cards. After more than two years of operation of the ALICE TPC with p-p and Pb-Pb collisions, the PASA has demonstrated to fulfill all requirements