Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated separately. In addition, these dies can be fabricated in different technologies. The effect of different sources of variations on 3-D circuits, consequently, differ from 2-D ICs. As technology scales, these variations significantly affect the performance of circuits. Therefore, it is increasingly important to accurately and efficiently model different sources of variations in 3-D ICs. The process, voltage, and temperature variations in 3-D ICs are investigated in this dissertation. Related modeling and design techniques are proposed to design a robust 3-D IC. Process variations in 3-D ICs are first analyzed. The effect of process variations on synchronization and 3-D clock distribution networks, is carefully studied. A novel statistical model is proposed to describe the timing variation in 3-D clock distribution networks caused by process variations. Based on this model, different topologies of 3-D clock distribution networks are compared in terms of skew variation. A set of guidelines is proposed to design 3-D clock distribution networks with low clock uncertainty. Voltage variations are described by power supply noise. Power supply noise in 3-D ICs is investigated considering different characteristics of potential 3-D power grids in this thesis. A new algorithm is developed to fast analyze the steady-state IR-drop in 3-D power grids. The first droop of power supply noise, also called resonant supply noise, is usually the deepest voltage drop in power distribution networks. The effect of resonant supply noise on 3-D clock distribution networks is investigated. The combined effect of process variations and power supply noise is modeled by skitter consisting of both skew and jitter. A novel statistical model of skitter is proposed. Based on this proposed model and simulation results, a set of guidelines has been proposed to mitigate the negative effect of process and voltage variations on 3-D clock distribution networks. Thermal issues in 3-D ICs are considered by carefully modeling thermal through silicon vias (TTSVs) in this dissertation. TTSVs are vertical vias which do not carry signals, dedicated to facilitate the propagation of heat to reduce the temperature of 3-D ICs. Two analytic models are proposed to describe the heat transfer in 3-D circuits related to TTSVs herein, providing proper closed-form expressions for the thermal resistance of the TTSVs. The effect of different physical and geometric parameters of TTSVs on the temperature of 3-D ICs is analyzed. The proposed models can be used to fast and accurately estimate the temperature to avoid the overuse of TTSVs occupying a large portion of area. A set of models and design techniques is proposed in this dissertation to describe and mitigate the deleterious effects of process, voltage, and temperature variations in 3-D ICs. Due to the continuous shrink in the feature size of transistors, the large number of devices within one circuit, and the high operating frequency, the effect of these variations on the performance of 3-D ICs becomes increasingly significant. Accurately and efficiently estimating and controlling these variations are, consequently, critical tasks for the design of 3-D ICs

Control considerations for high frequency, resonant, power processing equipment used in large systems

Addressed is a class of resonant power processing equipment designed to be used in an integrated high frequency (20 KHz domain), utility power system for large, multi-user spacecraft and other aerospace vehicles. It describes a hardware approach, which has been the basis for parametric and physical data used to justify the selection of high frequency ac as the PMAD baseline for the space station. This paper is part of a larger effort undertaken by NASA and General Dynamics to be sure that all potential space station contractors and other aerospace power system designers understand and can comfortably use this technology, which is now widely used in the commercial sector. In this paper, we will examine control requirements, stability, and operational modes; and their hardware impacts from an integrated system point of view. The current space station PMAD system will provide the overall requirements model to develop an understanding of the performance of this type of system with regard to: (1) regulation; (2) power bus stability and voltage control; (3) source impedance; (4) transient response; (5) power factor effects, and (6) limits and overloads

Voltage noise analysis with ring oscillator clocks

Voltage noise is the main source of dynamic variability in integrated circuits and a major concern for the design of Power Delivery Networks (PDNs). Ring Oscillators Clocks (ROCs) have been proposed as an alternative to mitigate the negative effects of voltage noise as technology scales down and power density increases. However, their effectiveness highly depends on the design parameters of the PDN, power consumption patterns of the system and spatial locality of the ROCs within the clock domains. This paper analyzes the impact of the PDN parameters and ROC location on the robustness to voltage noise. The capability of reacting instantaneously to unpredictable voltage droops makes ROCs an attractive solution, which allows to reduce the amount of decoupling capacitance without downgrading performance. Tolerance to voltage noise and related benefits can be increased by using multiple ROCs and reducing the size of the clock domains. The analysis shows that up to 83% of the margins for voltage noise and up to 27% of the leakage power can be reduced by using local ROCs.Peer ReviewedPostprint (author's final draft

A power-saving modulation technique for time-of-flight range imaging sensors

Time-of-flight range imaging cameras measure distance and intensity simultaneously for every pixel in an image. With the continued advancement of the technology, a wide variety of new depth sensing applications are emerging; however a number of these potential applications have stringent electrical power constraints that are difficult to meet with the current state-of-the-art systems. Sensor gain modulation contributes a significant proportion of the total image sensor power consumption, and as higher spatial resolution range image sensors operating at higher modulation frequencies (to achieve better measurement precision) are developed, this proportion is likely to increase. The authors have developed a new sensor modulation technique using resonant circuit concepts that is more power efficient than the standard mode of operation. With a proof of principle system, a 93–96% reduction in modulation drive power was demonstrated across a range of modulation frequencies from 1–11 MHz. Finally, an evaluation of the range imaging performance revealed an improvement in measurement linearity in the resonant configuration due primarily to the more sinusoidal shape of the resonant electrical waveforms, while the average precision values were comparable between the standard and resonant operating modes

Voltage fluctuations in IC power supply distribution

The supply voltage decrease and power consumption increase of modern ICs made the requirements for low voltage fluctuation caused by packaging and on-chip parasitic impedances more difficult to achieve. Most of the research works on the area assume that all the nodes of the chip are fed at the same voltage, in such a way that the main cause of disturbance or fluctuation is the parasitic impedance of packaging. In the paper an approach to analyze the effect of high and fast current demands on the on-chip power supply network. First an approach to model the entire network by considering a homogeneous conductive foil is presented. The modification of the timing parameters of flipflops caused by spatial voltage drops through the IC surface are also investigated.Peer Reviewe

Advanced Timing and Synchronization Methodologies for Digital VLSI Integrated Circuits

This dissertation addresses timing and synchronization methodologies that are critical to the design, analysis and optimization of high-performance, integrated digital VLSI systems. As process sizes shrink and design complexities increase, achieving timing closure for digital VLSI circuits becomes a significant bottleneck in the integrated circuit design flow. Circuit designers are motivated to investigate and employ alternative methods to satisfy the timing and physical design performance targets. Such novel methods for the timing and synchronization of complex circuitry are developed in this dissertation and analyzed for performance and applicability.Mainstream integrated circuit design flow is normally tuned for zero clock skew, edge-triggered circuit design. Non-zero clock skew or multi-phase clock synchronization is seldom used because the lack of design automation tools increases the length and cost of the design cycle. For similar reasons, level-sensitive registers have not become an industry standard despite their superior size, speed and power consumption characteristics compared to conventional edge-triggered flip-flops.In this dissertation, novel design and analysis techniques that fully automate the design and analysis of non-zero clock skew circuits are presented. Clock skew scheduling of both edge-triggered and level-sensitive circuits are investigated in order to exploit maximum circuit performances. The effects of multi-phase clocking on non-zero clock skew, level-sensitive circuits are investigated leading to advanced synchronization methodologies. Improvements in the scalability of the computational timing analysis process with clock skew scheduling are explored through partitioning and parallelization.The integration of the proposed design and analysis methods to the physical design flow of integrated circuits synchronized with a next-generation clocking technology-resonant rotary clocking technology-is also presented. Based on the design and analysis methods presented in this dissertation, a computer-aided design tool for the design of rotary clock synchronized integrated circuits is developed

The road to fully integrated DC-DC conversion via the switched-capacitor approach

This paper provides a perspective on progress toward realization of efficient, fully integrated dc-dc conversion and regulation functionality in CMOS platforms. In providing a comparative assessment between the inductor-based and switched-capacitor approaches, the presentation reviews the salient features in effectiveness in utilization of switch technology and in use and implementation of passives. The analytical conclusions point toward the strong advantages of the switched-capacitor (SC) approach with respect to both switch utilization and much higher energy densities of capacitors versus inductors. The analysis is substantiated with a review of recently developed and published integrated dc-dc converters of both the inductor-based and SC types. © 2012 IEEE

Silicon grating structures for optical fiber interfacing and III-V/silicon opto-electronic components

In this paper, we review our work on efficient, broadband and polarization independent interfaces between a silicon-on-insulator photonic IC and a single-mode optical fiber based on grating structures. The high alignment tolerance and the fact that the optical fiber interface is out-of-plane provide opportunities for easy packaging and wafer-scale testing of the photonic IC. Next to fiber-chip interfaces we will discuss the use of silicon grating structures in III-V on silicon opto-electronic components such as integrated photodetectors and microlasers