Unifying mesh- and tree-based programmable interconnect

We examine the traditional, symmetric, Manhattan mesh design for field-programmable gate-array (FPGA) routing along with tree-of-meshes (ToM) and mesh-of-trees (MoT) based designs. All three networks can provide general routing for limited bisection designs (Rent's rule with p<1) and allow locality exploitation. They differ in their detailed topology and use of hierarchy. We show that all three have the same asymptotic wiring requirements. We bound this tightly by providing constructive mappings between routes in one network and routes in another. For example, we show that a (c,p) MoT design can be mapped to a (2c,p) linear population ToM and introduce a corner turn scheme which will make it possible to perform the reverse mapping from any (c,p) linear population ToM to a (2c,p) MoT augmented with a particular set of corner turn switches. One consequence of this latter mapping is a multilayer layout strategy for N-node, linear population ToM designs that requires only /spl Theta/(N) two-dimensional area for any p when given sufficient wiring layers. We further show upper and lower bounds for global mesh routes based on recursive bisection width and show these are within a constant factor of each other and within a constant factor of MoT and ToM layout area. In the process we identify the parameters and characteristics which make the networks different, making it clear there is a unified design continuum in which these networks are simply particular regions

A Complementary Resistive Switch-based Crossbar Array Adder

Redox-based resistive switching devices (ReRAM) are an emerging class of non-volatile storage elements suited for nanoscale memory applications. In terms of logic operations, ReRAM devices were suggested to be used as programmable interconnects, large-scale look-up tables or for sequential logic operations. However, without additional selector devices these approaches are not suited for use in large scale nanocrossbar memory arrays, which is the preferred architecture for ReRAM devices due to the minimum area consumption. To overcome this issue for the sequential logic approach, we recently introduced a novel concept, which is suited for passive crossbar arrays using complementary resistive switches (CRSs). CRS cells offer two high resistive storage states, and thus, parasitic sneak currents are efficiently avoided. However, until now the CRS-based logic-in-memory approach was only shown to be able to perform basic Boolean logic operations using a single CRS cell. In this paper, we introduce two multi-bit adder schemes using the CRS-based logic-in-memory approach. We proof the concepts by means of SPICE simulations using a dynamical memristive device model of a ReRAM cell. Finally, we show the advantages of our novel adder concept in terms of step count and number of devices in comparison to a recently published adder approach, which applies the conventional ReRAM-based sequential logic concept introduced by Borghetti et al.Comment: 12 pages, accepted for IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS), issue on Computing in Emerging Technologie

Miniaturizing microvias for multi-chip modules

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (p. 63-64).Electronics packaging is continually migrating toward denser packaging. This encompasses a push toward multilevel die, denser metallization, and smaller microvias. In this thesis we investigate the miniaturization of laser-drilled microvias in polyimide dielectric for chips-first multi-chip module (MCM) technology. The challenge is to produce increasingly smaller microvias and package more microvias into a given area without sacrificing electrical performance. Principally, this means a microvia must maintain certain minimum electrical resistance and mechanical adhesion to the conducting layers. The thesis encompasses the following research: 1. Investigating the state of the art in laser-drilled polyimide microvias. 2. Designing and fabricating test structures with microvias, in which the state of the art is pushed in microvia size and/or aspect ratio. 3. Measuring the contact resistances of laser-drilled microvias in a Kelvin structure configuration. 4. Developing finite element models of Kelvin structures to estimate the contact resistance of miniature microvias.The experimental results of this thesis prove that microvias with approximately 19 pm diameter and 10 mQ contact resistance can be reliably fabricated for chips-first MCM technology.by Paul Gerard Puskarich.M.Eng

Study of the impact of lithography techniques and the current fabrication processes on the design rules of tridimensional fabrication technologies

Working for the photolithography tool manufacturer leader sometimes gives me the impression of how complex and specific is the sector I am working on. This master thesis topic came with the goal of getting the overall picture of the state-of-the-art: stepping out and trying to get a helicopter view usually helps to understand where a process is in the productive chain, or what other firms and markets are doing to continue improvingUniversidad de sevilla.Máster Universitario en Microelectrónica: Diseño y Aplicaciones de Sistemas Micro/Nanométrico

Development and Packaging of Microsystems Using Foundry Services

Micro-electro-mechanical systems (MEMS) are a new and rapidly growing field of research. Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10(exp -3)/K. The sheet resistance of the MUMPs polysilicon layers was found to be dependent on linewidth due to presence or absence of lateral phosphorus diffusion. The functional integration of MEMS with CMOS was demonstrated through the design of automated positioning and assembly systems, and a new power averaging scheme was devised. Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries. Xenon difluoride (XeF2) was found to be an excellent post-packaging etchant for bulk micromachined MEMS. For surface micromachining, hydrofluoric acid (HF) can be used

A survey of DA techniques for PLD and FPGA based systems

Programmable logic devices (PLDs) are gaining in acceptance, of late, for designing systems of all complexities ranging from glue logic to special purpose parallel machines. Higher densities and integration levels are made possible by the new breed of complex PLDs and FPGAs. The added complexities of these devices make automatic computer aided tools indispensable for achieving good performance and a high usable gate-count. In this article, we attempt to present in an unified manner, the different tools and their underlying algorithms using an example of a vending machine controller as an illustrative example. Topics covered include logic synthesis for PLDs and FPGAs along with an in-depth survey of important technology mapping, partitioning and place and route algorithms for different FPGA architectures.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/31206/1/0000108.pd

Circuit Design and Routing For Field Programmable Analog Arrays

Accurate, low-cost, rapid-prototyping techniques for analog circuits have been a long awaited dream for analog designers. However, due to the inherent nature of analog system, design automation in analog domain is very difficult to realize, and field programmable analog arrays (FPAA) have not achieved the same success as FPGAs in the digital domain. This results from several factors, including the lack of supporting CAD tools, small circuit density, low speed and significant parasitic effect from the fixed routing wires. These factors are all related to each other, making the design of a high performance FPAA a multi-dimension problem. Among others, a critical reason behind these difficulties is the non-ideal programming technology, which contributes a large portion of parasitics into the sensitive analog system, thus degrades the system performance. This work is trying to attack these difficulties with development of a laser field programmable analog array (LFPAA). There are two parts of work involved, routing for FPAA and analog IC building block design. To facilitate the router development and provide a platform for FPAA application development, a generic arrayed based FPAA architecture and a flexible CAB topology were proposed. The routing algorithm was based on a modified and improved pathfinder negotiated routing algorithm, and was implemented in C for a prototype FPAA. The parasitic constraints for performance analog routing were also investigated and solutions were proposed. In the area of analog circuit design, a novel differential difference op amp was invented as the core building block. Two bandgap circuits including a low voltage version were developed to generate a stable reference voltage for the FPAA. Based on the proposed FPAA architecture, several application examples were demonstrated. The results show the flexible functionality of the FPAA. Moreover, various laser Makelink test structures were studied on different CMOS processes and BiCMOS copper process. Laser Makelink proves to be a powerful programming technology for analog IC design. A novel laser Makelink trimming method was invented to reduce the op amp offset. The application of using laser Makelink to reconfigure the analog circuit blocks was presented

Design tool and methodologies for interconnect reliability analysis in integrated circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Includes bibliographical references (p. 195-204).by Syed Mohiul Alam.Ph.D