Programmable CMOS Analog-to-Digital Converter Design and Testability

In this work, a programmable second order oversampling CMOS delta-sigma analog-to-digital converter (ADC) design in 0.5µm n-well CMOS processes is presented for integration in sensor nodes for wireless sensor networks. The digital cascaded integrator comb (CIC) decimation filter is designed to operate at three different oversampling ratios of 16, 32 and 64 to give three different resolutions of 9, 12 and 14 bits, respectively which impact the power consumption of the sensor nodes. Since the major part of power consumed in the CIC decimator is by the integrators, an alternate design is introduced by inserting coder circuits and reusing the same integrators for different resolutions and oversampling ratios to reduce power consumption. The measured peak signal-to-noise ratio (SNR) for the designed second order delta-sigma modulator is 75.6dB at an oversampling ratio of 64, 62.3dB at an oversampling ratio of 32 and 45.3dB at an oversampling ratio of 16. The implementation of a built-in current sensor (BICS) which takes into account the increased background current of defect-free circuits and the effects of process variation on ΔIDDQ testing of CMOS data converters is also presented. The BICS uses frequency as the output for fault detection in CUT. A fault is detected when the output frequency deviates more than ±10% from the reference frequency. The output frequencies of the BICS for various model parameters are simulated to check for the effect of process variation on the frequency deviation. A design for on-chip testability of CMOS ADC by linear ramp histogram technique using synchronous counter as register in code detection unit (CDU) is also presented. A brief overview of the histogram technique, the formulae used to calculate the ADC parameters, the design implemented in 0.5µm n-well CMOS process, the results and effectiveness of the design are described. Registers in this design are replaced by 6T-SRAM cells and a hardware optimized on-chip testability of CMOS ADC by linear ramp histogram technique using 6T-SRAM as register in CDU is presented. The on-chip linear ramp histogram technique can be seamlessly combined with ΔIDDQ technique for improved testability, increased fault coverage and reliable operation

The 1991 3rd NASA Symposium on VLSI Design

Papers from the symposium are presented from the following sessions: (1) featured presentations 1; (2) very large scale integration (VLSI) circuit design; (3) VLSI architecture 1; (4) featured presentations 2; (5) neural networks; (6) VLSI architectures 2; (7) featured presentations 3; (8) verification 1; (9) analog design; (10) verification 2; (11) design innovations 1; (12) asynchronous design; and (13) design innovations 2

Toward the implementation of analog LDPC decoders for long codewords

Error control codes are used in virtually every digital communication system. Traditionally, decoders have been implemented digitally. Analog decoders have been recently shown to have the potential to outperform digital decoders in terms of area and power/speed ratio. Analog designers have attempted to fully understand and exploit this potential for large decoders. However, large codes are generally still implemented with digital circuits. Nevertheless, in this thesis a number of aspects of analog decoder implementation are investigated with the hope of enabling the design of large analog decoders. In this thesis, we study and modify analog circuits used in a decoding algorithm known as the sum-product algorithm for implementation in a CMOS 90 nm technology. We apply a current-mode approach at the input nodes of these circuits and show through simulations that the power/speed ratio will be improved. Interested in studying the dynamics of decoders, we model an LDPC code in MATLAB's Simulink. We then apply the linearization technique on the modeled LDPC code in order to linearize the decoder about an initial state as its solution point. Challenges associated with decoder linearization are discussed. We also design and implement a chip comprised of the sum-product circuits with different configurations and sizes in order to study the effect of mismatch on the accuracy of the outputs. Unfortunately, testing of the chip fails as a result of errors in either the packaging process or fabrication

An accurate, trimless, high PSRR, low-voltage, CMOS bandgap reference IC

Bandgap reference circuits are used in a host of analog, digital, and mixed-signal systems to establish an accurate voltage standard for the entire IC. The accuracy of the bandgap reference voltage under steady-state (dc) and transient (ac) conditions is critical to obtain high system performance. In this work, the impact of process, power-supply, load, and temperature variations and package stresses on the dc and ac accuracy of bandgap reference circuits has been analyzed. Based on this analysis, the a bandgap reference that 1. has high dc accuracy despite process and temperature variations and package stresses, without resorting to expensive trimming or noisy switching schemes, 2. has high dc and ac accuracy despite power-supply variations, without using large off-chip capacitors that increase bill-of-material costs, 3. has high dc and ac accuracy despite load variations, without resorting to error-inducing buffers, 4. is capable of producing a sub-bandgap reference voltage with a low power-supply, to enable it to operate in modern, battery-operated portable applications, 5. utilizes a standard CMOS process, to lower manufacturing costs, and 6. is integrated, to consume less board space has been proposed. The functionality of critical components of the system has been verified through prototypes after which the performance of the complete system has been evaluated by integrating all the individual components on an IC. The proposed CMOS bandgap reference can withstand 5mA of load variations while generating a reference voltage of 890mV that is accurate with respect to temperature to the first order. It exhibits a trimless, dc 3-sigma accuracy performance of 0.84% over a temperature range of -40°C to 125°C and has a worst case ac power-supply ripple rejection (PSRR) performance of 30dB up to 50MHz using 60pF of on-chip capacitance. All the proposed techniques lead to the development of a CMOS bandgap reference that meets the low-cost, high-accuracy demands of state-of-the-art System-on-Chip environments.Ph.D.Committee Chair: Rincon-Mora, Gabriel; Committee Member: Ayazi, Farrokh; Committee Member: Bhatti, Pamela; Committee Member: Leach, W. Marshall; Committee Member: Morley, Thoma

The Telecommunications and Data Acquisition Report

Deep Space Network advanced systems, very large scale integration architecture for decoders, radar interface and control units, microwave time delays, microwave antenna holography, and a radio frequency interference survey are among the topics discussed

Design of ALU and Cache Memory for an 8 bit ALU

The design of an ALU and a Cache memory for use in a high performance processor was examined in this thesis. Advanced architectures employing increased parallelism were analyzed to minimize the number of execution cycles needed for 8 bit integer arithmetic operations. In addition to the arithmetic unit, an optimized SRAM memory cell was designed to be used as cache memory and as fast Look Up Table. The ALU consists of stand alone units for bit parallel computation of basic integer arithmetic operations. Addition and subtraction were performed using Kogge Stone parallel prefix hardware operating at 330MHz. A high performance multiplier was built using Radix 4 Modified Booth Encoder (MBE) and a Wallace Tree summation array. The multiplier requires single clock cycle for 8 bit integer multiplication and operates at a maximum frequency of 100MHz. Multiplicative division hardware was built for executing both integer division and square root. The division hardware computes 8-bit division and square root in 4 clock cycles. Multiplier forms the basic building block of all these functional units, making high level of resource sharing feasible with this architecture. The optimal operating frequency for the arithmetic unit is 70MHz. A 6T CMOS SRAM cell measuring 90 µm2 was designed using minimum size transistors. The layout allows for horizontal overlap resulting in effective area of 76 µm2 for an 8x8 array. By substituting equivalent bit line capacitance of P4 L1 Cache, the memory was simulated to have a read time of 3.27ns. An optimized set of test vectors were identified to enable high fault coverage without the need for any additional test circuitry. Sixteen test cases were identified that would toggle all the nodes and provide all possible inputs to the sub units of the multiplier. A correlation based semi automatic method was investigated to facilitate test case identification for large multipliers. This method of testability eliminates performance and area overhead associated with conventional testability hardware. Bottom up design methodology was employed for the design. The performance and area metrics are presented along with estimated power consumption. A set of Monte Carlo analysis was carried out to ensure the dependability of the design under process variations as well as fluctuations in operating conditions. The arithmetic unit was found to require a total die area of 2mm2 (approx.) in 0.35 micron process

NASA SERC 1990 Symposium on VLSI Design

This document contains papers presented at the first annual NASA Symposium on VLSI Design. NASA's involvement in this event demonstrates a need for research and development in high performance computing. High performance computing addresses problems faced by the scientific and industrial communities. High performance computing is needed in: (1) real-time manipulation of large data sets; (2) advanced systems control of spacecraft; (3) digital data transmission, error correction, and image compression; and (4) expert system control of spacecraft. Clearly, a valuable technology in meeting these needs is Very Large Scale Integration (VLSI). This conference addresses the following issues in VLSI design: (1) system architectures; (2) electronics; (3) algorithms; and (4) CAD tools