Analysis and Design of Resilient VLSI Circuits

The reliable operation of Integrated Circuits (ICs) has become increasingly difficult to achieve in the deep sub-micron (DSM) era. With continuously decreasing device feature sizes, combined with lower supply voltages and higher operating frequencies, the noise immunity of VLSI circuits is decreasing alarmingly. Thus, VLSI circuits are becoming more vulnerable to noise effects such as crosstalk, power supply variations and radiation-induced soft errors. Among these noise sources, soft errors (or error caused by radiation particle strikes) have become an increasingly troublesome issue for memory arrays as well as combinational logic circuits. Also, in the DSM era, process variations are increasing at an alarming rate, making it more difficult to design reliable VLSI circuits. Hence, it is important to efficiently design robust VLSI circuits that are resilient to radiation particle strikes and process variations. The work presented in this dissertation presents several analysis and design techniques with the goal of realizing VLSI circuits which are tolerant to radiation particle strikes and process variations. This dissertation consists of two parts. The first part proposes four analysis and two design approaches to address radiation particle strikes. The analysis techniques for the radiation particle strikes include: an approach to analytically determine the pulse width and the pulse shape of a radiation induced voltage glitch in combinational circuits, a technique to model the dynamic stability of SRAMs, and a 3D device-level analysis of the radiation tolerance of voltage scaled circuits. Experimental results demonstrate that the proposed techniques for analyzing radiation particle strikes in combinational circuits and SRAMs are fast and accurate compared to SPICE. Therefore, these analysis approaches can be easily integrated in a VLSI design flow to analyze the radiation tolerance of such circuits, and harden them early in the design flow. From 3D device-level analysis of the radiation tolerance of voltage scaled circuits, several non-intuitive observations are made and correspondingly, a set of guidelines are proposed, which are important to consider to realize radiation hardened circuits. Two circuit level hardening approaches are also presented to harden combinational circuits against a radiation particle strike. These hardening approaches significantly improve the tolerance of combinational circuits against low and very high energy radiation particle strikes respectively, with modest area and delay overheads. The second part of this dissertation addresses process variations. A technique is developed to perform sensitizable statistical timing analysis of a circuit, and thereby improve the accuracy of timing analysis under process variations. Experimental results demonstrate that this technique is able to significantly reduce the pessimism due to two sources of inaccuracy which plague current statistical static timing analysis (SSTA) tools. Two design approaches are also proposed to improve the process variation tolerance of combinational circuits and voltage level shifters (which are used in circuits with multiple interacting power supply domains), respectively. The variation tolerant design approach for combinational circuits significantly improves the resilience of these circuits to random process variations, with a reduction in the worst case delay and low area penalty. The proposed voltage level shifter is faster, requires lower dynamic power and area, has lower leakage currents, and is more tolerant to process variations, compared to the best known previous approach. In summary, this dissertation presents several analysis and design techniques which significantly augment the existing work in the area of resilient VLSI circuit design

Cross-layer system reliability assessment framework for hardware faults

System reliability estimation during early design phases facilitates informed decisions for the integration of effective protection mechanisms against different classes of hardware faults. When not all system abstraction layers (technology, circuit, microarchitecture, software) are factored in such an estimation model, the delivered reliability reports must be excessively pessimistic and thus lead to unacceptably expensive, over-designed systems. We propose a scalable, cross-layer methodology and supporting suite of tools for accurate but fast estimations of computing systems reliability. The backbone of the methodology is a component-based Bayesian model, which effectively calculates system reliability based on the masking probabilities of individual hardware and software components considering their complex interactions. Our detailed experimental evaluation for different technologies, microarchitectures, and benchmarks demonstrates that the proposed model delivers very accurate reliability estimations (FIT rates) compared to statistically significant but slow fault injection campaigns at the microarchitecture level.Peer ReviewedPostprint (author's final draft

Cross-Layer Optimization for Power-Efficient and Robust Digital Circuits and Systems

With the increasing digital services demand, performance and power-efficiency become vital requirements for digital circuits and systems. However, the enabling CMOS technology scaling has been facing significant challenges of device uncertainties, such as process, voltage, and temperature variations. To ensure system reliability, worst-case corner assumptions are usually made in each design level. However, the over-pessimistic worst-case margin leads to unnecessary power waste and performance loss as high as 2.2x. Since optimizations are traditionally confined to each specific level, those safe margins can hardly be properly exploited. To tackle the challenge, it is therefore advised in this Ph.D. thesis to perform a cross-layer optimization for digital signal processing circuits and systems, to achieve a global balance of power consumption and output quality. To conclude, the traditional over-pessimistic worst-case approach leads to huge power waste. In contrast, the adaptive voltage scaling approach saves power (25% for the CORDIC application) by providing a just-needed supply voltage. The power saving is maximized (46% for CORDIC) when a more aggressive voltage over-scaling scheme is applied. These sparsely occurred circuit errors produced by aggressive voltage over-scaling are mitigated by higher level error resilient designs. For functions like FFT and CORDIC, smart error mitigation schemes were proposed to enhance reliability (soft-errors and timing-errors, respectively). Applications like Massive MIMO systems are robust against lower level errors, thanks to the intrinsically redundant antennas. This property makes it applicable to embrace digital hardware that trades quality for power savings.Comment: 190 page

The influence of organizational culture on the outcome of an IS implementation

A number of information system (IS) studies have adopted organizational culture (OC) theory to investigate IS implementations. The studies highlight that members will reach consensus or agreement in the use of an IS but also experience inevitable tensions and ambiguities in the use of the IS. However, literature related to IS implementation/OC has rarely examined the influence that the saliency of specific cultural practices may have on the success or failure of IS implementations. Using a case study approach, we adopted the “soft positivism” research philosophy to collect data, underpinned by Martin’s (1992) integration and differentiation perspectives of OC to study organizational implementation of an IS. These perspectives served as interpretive lenses through which to explain how members’ salient behaviors towards an IS evolved during the implementation process. Our study augments the IS implementation/OC literature by demonstrating how salient cultural practices influence the outcome of IS implementatio