Applied inference

We propose and apply a new simulation paradigm for microarchitectural design evaluation and optimization. This paradigm enables more comprehensive design studies by combining spatial sampling and statistical inference. Specifically, this paradigm (i) defines a large, comprehensive design space, (ii) samples points from the space for simulation, and (iii) constructs regression models based on sparse simulations. This approach greatly improves the computational efficiency of microarchitectural simulation and enables new capabilities in design space exploration. We illustrate new capabilities in three case studies for a large design space of approximately 260,000 points: (i) Pareto frontier, (ii) pipeline depth, and (iii) multiprocessor heterogeneity analyses. In particular, regression models are exhaustively evaluated to identify Pareto optimal designs that maximize performance for given power budgets. These models enable pipeline depth studies in which all parameters vary simultaneously with depth, thereby more effectively revealing interactions with nondepth parameters. Heterogeneity analysis combines regression-based optimization with clustering heuristics to identify efficient design compromises between similar optimal architectures. These compromises are potential core designs in a heterogeneous multicore architecture. Increasing heterogeneity can improve bips3/w efficiency by as much as 2.4×, a theoretical upper bound on heterogeneity benefits that neglects contention between shared resources as well as design complexity. Collectively these studies demonstrate regression models' ability to expose trends and identify optima in diverse design regions, motivating the application of such models in statistical inference for more effective use of modern simulator infrastructure.Engineering and Applied Science

Cross layer reliability estimation for digital systems

Forthcoming manufacturing technologies hold the promise to increase multifuctional computing systems performance and functionality thanks to a remarkable growth of the device integration density. Despite the benefits introduced by this technology improvements, reliability is becoming a key challenge for the semiconductor industry. With transistor size reaching the atomic dimensions, vulnerability to unavoidable fluctuations in the manufacturing process and environmental stress rise dramatically. Failing to meet a reliability requirement may add excessive re-design cost to recover and may have severe consequences on the success of a product. %Worst-case design with large margins to guarantee reliable operation has been employed for long time. However, it is reaching a limit that makes it economically unsustainable due to its performance, area, and power cost. One of the open challenges for future technologies is building ``dependable'' systems on top of unreliable components, which will degrade and even fail during normal lifetime of the chip. Conventional design techniques are highly inefficient. They expend significant amount of energy to tolerate the device unpredictability by adding safety margins to a circuit's operating voltage, clock frequency or charge stored per bit. Unfortunately, the additional cost introduced to compensate unreliability are rapidly becoming unacceptable in today's environment where power consumption is often the limiting factor for integrated circuit performance, and energy efficiency is a top concern. Attention should be payed to tailor techniques to improve the reliability of a system on the basis of its requirements, ending up with cost-effective solutions favoring the success of the product on the market. Cross-layer reliability is one of the most promising approaches to achieve this goal. Cross-layer reliability techniques take into account the interactions between the layers composing a complex system (i.e., technology, hardware and software layers) to implement efficient cross-layer fault mitigation mechanisms. Fault tolerance mechanism are carefully implemented at different layers starting from the technology up to the software layer to carefully optimize the system by exploiting the inner capability of each layer to mask lower level faults. For this purpose, cross-layer reliability design techniques need to be complemented with cross-layer reliability evaluation tools, able to precisely assess the reliability level of a selected design early in the design cycle. Accurate and early reliability estimates would enable the exploration of the system design space and the optimization of multiple constraints such as performance, power consumption, cost and reliability. This Ph.D. thesis is devoted to the development of new methodologies and tools to evaluate and optimize the reliability of complex digital systems during the early design stages. More specifically, techniques addressing hardware accelerators (i.e., FPGAs and GPUs), microprocessors and full systems are discussed. All developed methodologies are presented in conjunction with their application to real-world use cases belonging to different computational domains

When a Patch is Not Enough - HardFails: Software-Exploitable Hardware Bugs

In this paper, we take a deep dive into microarchitectural security from a hardware designer's perspective by reviewing the existing approaches to detect hardware vulnerabilities during the design phase. We show that a protection gap currently exists in practice that leaves chip designs vulnerable to software-based attacks. In particular, existing verification approaches fail to detect specific classes of vulnerabilities, which we call HardFails: these bugs evade detection by current verification techniques while being exploitable from software. We demonstrate such vulnerabilities in real-world SoCs using RISC-V to showcase and analyze concrete instantiations of HardFails. Patching these hardware bugs may not always be possible and can potentially result in a product recall. We base our findings on two extensive case studies: the recent Hack@DAC 2018 hardware security competition, where 54 independent teams of researchers competed world-wide over a period of 12 weeks to catch inserted security bugs in SoC RTL designs, and an in-depth systematic evaluation of state-of-the-art verification approaches. Our findings indicate that even combinations of techniques will miss high-impact bugs due to the large number of modules with complex interdependencies and fundamental limitations of current detection approaches. We also craft a real-world software attack that exploits one of the RTL bugs from Hack@DAC that evaded detection and discuss novel approaches to mitigate the growing problem of cross-layer bugs at design time

Characterization of Sequential Collagen-Poly(Ethylene Glycol) Diacrylate Interpenetrating Networks and Initial Assessment of Their Potential for Vascular Tissue Engineering

Collagen hydrogels have been widely investigated as scaffolds for vascular tissue engineering due in part to the capacity of collagen to promote robust cell adhesion and elongation. However, collagen hydrogels display relatively low stiffness and strength, are thrombogenic, and are highly susceptible to cell-mediated contraction. In the current work, we develop and characterize a sequentially-formed interpenetrating network (IPN) that retains the benefits of collagen, but which displays enhanced mechanical stiffness and strength, improved thromboresistance, high physical stability and resistance to contraction. In this strategy, we first form a collagen hydrogel, infuse this hydrogel with poly(ethylene glycol) diacrylate (PEGDA), and subsequently crosslink the PEGDA by exposure to longwave UV light. These collagen-PEGDA IPNs allow for cell encapsulation during the fabrication process with greater than 90% cell viability via inclusion of cells within the collagen hydrogel precursor solution. Furthermore, the degree of cell spreading within the IPNs can be tuned from rounded to fully elongated by varying the time delay between the formation of the cell-laden collagen hydrogel and the formation of the PEGDA network. We also demonstrate that these collagen-PEGDA IPNs are able to support the initial stages of smooth muscle cell lineage progression by elongated human mesenchymal stems cells

High-Speed Performance, Power and Thermal Co-simulation For SoC Design

This dissertation presents a multi-faceted effort at developing standard System Design Language based tools that allow designers to the model power and thermal behavior of SoCs, including heterogeneous SoCs that include non-digital components. The research contributions made in this dissertation include: • SystemC-based power/performance co-simulation for the Intel XScale microprocessor. We performed detailed characterization of the power dissipation patterns of a variety of system components and used these results to build detailed power models, including a highly accurate, validated instruction-level power model of the XScale processor. We also proposed a scalable, efficient and validated methodology for incorporating fast, accurate power modeling capabilities into system description languages such as SystemC. This was validated against physical measurements of hardware power dissipation. • Modeling the behavior of non-digital SoC components within standard System Design Languages. We presented an approach for modeling the functionality, performance, power, and thermal behavior of a complex class of non-digital components — MEMS microhotplate-based gas sensors — within a SystemC design framework. The components modeled include both digital components (such as microprocessors, busses and memory) and MEMS devices comprising a gas sensor SoC. The first SystemC models of a MEMS-based SoC and the first SystemC models of MEMS thermal behavior were described. Techniques for significantly improving simulation speed were proposed, and their impact quantified. • Vertically Integrated Execution-Driven Power, Performance and Thermal Co-Simulation For SoCs. We adapted the above techniques and used numerical methods to model the system of differential equations that governs on-chip thermal diffusion. This allows a single high-speed simulation to span performance, power and thermal modeling of a design. It also allows feedback behaviors, such as the impact of temperature on power dissipation or performance, to be modeled seamlessly. We validated the thermal equation-solving engine on test layouts against detailed low-level tools, and illustrated the power of such a strategy by demonstrating a series of studies that designers can perform using such tools. We also assessed how simulation and accuracy are impacted by spatial and temporal resolution used for thermal modeling

Resource and thermal management in 3D-stacked multi-/many-core systems

Continuous semiconductor technology scaling and the rapid increase in computational needs have stimulated the emergence of multi-/many-core processors. While up to hundreds of cores can be placed on a single chip, the performance capacity of the cores cannot be fully exploited due to high latencies of interconnects and memory, high power consumption, and low manufacturing yield in traditional (2D) chips. 3D stacking is an emerging technology that aims to overcome these limitations of 2D designs by stacking processor dies over each other and using through-silicon-vias (TSVs) for on-chip communication, and thus, provides a large amount of on-chip resources and shortens communication latency. These benefits, however, are limited by challenges in high power densities and temperatures. 3D stacking also enables integrating heterogeneous technologies into a single chip. One example of heterogeneous integration is building many-core systems with silicon-photonic network-on-chip (PNoC), which reduces on-chip communication latency significantly and provides higher bandwidth compared to electrical links. However, silicon-photonic links are vulnerable to on-chip thermal and process variations. These variations can be countered by actively tuning the temperatures of optical devices through micro-heaters, but at the cost of substantial power overhead. This thesis claims that unearthing the energy efficiency potential of 3D-stacked systems requires intelligent and application-aware resource management. Specifically, the thesis improves energy efficiency of 3D-stacked systems via three major components of computing systems: cache, memory, and on-chip communication. We analyze characteristics of workloads in computation, memory usage, and communication, and present techniques that leverage these characteristics for energy-efficient computing. This thesis introduces 3D cache resource pooling, a cache design that allows for flexible heterogeneity in cache configuration across a 3D-stacked system and improves cache utilization and system energy efficiency. We also demonstrate the impact of resource pooling on a real prototype 3D system with scratchpad memory. At the main memory level, we claim that utilizing heterogeneous memory modules and memory object level management significantly helps with energy efficiency. This thesis proposes a memory management scheme at a finer granularity: memory object level, and a page allocation policy to leverage the heterogeneity of available memory modules and cater to the diverse memory requirements of workloads. On the on-chip communication side, we introduce an approach to limit the power overhead of PNoC in (3D) many-core systems through cross-layer thermal management. Our proposed thermally-aware workload allocation policies coupled with an adaptive thermal tuning policy minimize the required thermal tuning power for PNoC, and in this way, help broader integration of PNoC. The thesis also introduces techniques in placement and floorplanning of optical devices to reduce optical loss and, thus, laser source power consumption.2018-03-09T00:00:00

inSense: A Variation and Fault Tolerant Architecture for Nanoscale Devices

Transistor technology scaling has been the driving force in improving the size, speed, and power consumption of digital systems. As devices approach atomic size, however, their reliability and performance are increasingly compromised due to reduced noise margins, difficulties in fabrication, and emergent nano-scale phenomena. Scaled CMOS devices, in particular, suffer from process variations such as random dopant fluctuation (RDF) and line edge roughness (LER), transistor degradation mechanisms such as negative-bias temperature instability (NBTI) and hot-carrier injection (HCI), and increased sensitivity to single event upsets (SEUs). Consequently, future devices may exhibit reduced performance, diminished lifetimes, and poor reliability. This research proposes a variation and fault tolerant architecture, the inSense architecture, as a circuit-level solution to the problems induced by the aforementioned phenomena. The inSense architecture entails augmenting circuits with introspective and sensory capabilities which are able to dynamically detect and compensate for process variations, transistor degradation, and soft errors. This approach creates ``smart\u27\u27 circuits able to function despite the use of unreliable devices and is applicable to current CMOS technology as well as next-generation devices using new materials and structures. Furthermore, this work presents an automated prototype implementation of the inSense architecture targeted to CMOS devices and is evaluated via implementation in ISCAS \u2785 benchmark circuits. The automated prototype implementation is functionally verified and characterized: it is found that error detection capability (with error windows from $\approx$30-400ps) can be added for less than 2\% area overhead for circuits of non-trivial complexity. Single event transient (SET) detection capability (configurable with target set-points) is found to be functional, although it generally tracks the standard DMR implementation with respect to overheads

TOWARDS RELIABLE NANOPHOTONIC INTERCONNECTION NETWORK DESIGNS

As technology scales into deep submicron domains, electrical wires start to face critical challenges in latency and power since they do not scale well as compared to transistors. Many recent researches have shifted focus to optical on-chip interconnection because of its promises of high bandwidth density, low propagation delay, distance-independent power consumption (compared to metal), and natural support for multicast and broadcast. Unfortunately, while optical interconnect provides many attractive and promising features, there are also fundamental challenges in fabrication of those devices to providing robust and reliable on-chip communication. Microrings resonators, the basic components of nanophotonic interconnect, may not resonate at the designated wavelength under fabrication errors (a.k.a. process variations PV) or thermal fluctuation (TF), leading to communication errors and bandwidth loss. In addition, the power overhead required to correct the drift can overturn the benefits promised by this new technology. Hence, the objective of the thesis is to maximize network bandwidth through proper arrangement among microrings and wavelengths with minimum tuning power requirement. I propose the following techniques to achieve my goals. First, I will present a series of solutions, called ``MinTrim'', to address the wavelength drifting problem of microrings and subsequent bandwidth loss problem of an optical network, due to the PV. Next, to mitigate bandwidth loss and performance degradation caused by PV and TF, I will propose an architecture-level approach, ``BandArb'', which allocates the bandwidth at runtime according to network demands and temperature with low computation overhead. Finally, I will conclude the thesis and discuss the future works in this field