Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

Warpage issues in large area mould embedding technologies

The need for higher communications speed, heterogeneous integration and further miniaturisation have increased demand in developing new 3D integrated packaging technologies which include wafer-level moulding and chip-to-wafer interconnections . Wafer-level moulding refers to the embedding of multiple chips or heterogeneous systems on the wafer scale. This can be achieved through a relatively new technology consisting of thermal compression moulding of granular or liquid epoxy moulding compounds. Experimental measurements from compression moulding on 8” blank wafers have shown an unexpected tendency to warp into a cylindrical-shape following cooling from the moulding temperature to room temperature. Wafer warpage occurs primarily as a result of a mismatch between the coefficient of thermal expansion of the resin compound and the Si wafer. This paper will delve into possible causes of such asymmetric warpage related to mould, dimensional and material characteristics using finite element (FE) software (ANSYS Mechanical). The FE model of the resin on wafer deposition will be validated against the measurement results and will be used to deduce appropriate guidelines for low warpage wafer encapsulation.peer-reviewe

ASEAN-EU university network programme on EMC and SI education

This paper reports about a project for the creation of an innovative university course devoted to the preparation of future electronic designers to the challenges imposed by the assurance of the electrical performance of high-speed electronic systems. The target groups are future university teaching staff and future electronic systems designers. Activities are developed by means of sharing research results, seminars, experience exchange and the development of demonstrators to be used for teaching. The partnership is composed by Technical University of Turin (Italy), University of Hannover (Germany), University of Nottingham (UK), Nanyang Technological University (Singapore) and King Monguts Institute of Technology Lad-krabang, Bangkok (Thailand). The program is partially funded by the European Commission under the ASEAN-EU University Network Programme (AUNP) and its duration is 24 months

Technical Design Report for PANDA Electromagnetic Calorimeter (EMC)

This document presents the technical layout and the envisaged performance of the Electromagnetic Calorimeter (EMC) for the PANDA target spectrometer. The EMC has been designed to meet the physics goals of the PANDA experiment. The performance figures are based on extensive prototype tests and radiation hardness studies. The document shows that the EMC is ready for construction up to the front-end electronics interface