Novel High Performance Ultra Low Power Static Random Access Memories (SRAMs) Based on Next Generation Technologies

Title from PDF of title page viewed January 27, 2021Dissertation advisor: Masud H. ChowdhuryVitaIncludes bibliographical references (page 107-120)Thesis (Ph.D.)--School of Computing and Engineering. University of Missouri--Kansas City, 2019Next Big Thing Is Surely Small: Nanotechnology Can Bring Revolution. Nanotechnology leads the world towards many new applications in various fields of computing, communication, defense, entertainment, medical, renewable energy and environment. These nanotechnology applications require an energy-efficient memory system to compute and process. Among all the memories, Static Random Access Memories (SRAMs) are high performance memories and occupies more than 50% of any design area. Therefore, it is critical to design high performance and energy-efficient SRAM design. Ultra low power and high speed applications require a new generation memory capable of operating at low power as well as low execution time. In this thesis, a novel 8T SRAM design is proposed that offers significantly faster access time and lowers energy consumption along with better read stability and write ability. The proposed design can be used in the conventional SRAM as well as in computationally intensive applications like neural networks and machine learning classifiers [1]-[4]. Novel 8T SRAM design offers higher energy efficiency, reliability, robustness and performance compared to the standard 6T and other existing 8T and 9T designs. It offers the advantages of a 10T SRAM without the additional area, delay and power overheads of the 10T SRAM. The proposed 8T SRAM would be able to overcome many other limitations of the conventional 6T and other 7T, 8T and 9T designs. The design employs single bitline for the write operation, therefore the number of write drivers are reduced. The defining feature of the proposed 8T SRAM is its hybrid design, which is the combination of two techniques: (i) the utilization of single-ended bitline and (ii) the utilization of virtual ground. The single-ended bitline technique ensures separate read and write operations, which eventually reduces the delay and power consumption during the read and write operations. It's independent read and write paths allow the use of the minimum sized access transistors and aid in a disturb-free read operation. The virtual ground weakens the positive feedback in the SRAM cell and improves its write ability. The virtual ground technique is also used to reduce leakages. The proposed design does not require precharging the bitlines for the read operation, which reduces the area and power overheads of the memory system by eliminating the precharging circuit. The design isolates the storage node from the read path, which improves the read stability. For reliability study, we have investigated the static noise margin (SNM) of the proposed 8T SRAM, for which, we have used two methods – (i) the traditional SNM method with the butterfly curve, (ii) the N-curve method A comparative analysis is performed between the proposed and the existing SRAM designs in terms of area, total power consumption during the read and write operations, and stability and reliability. All these advantages make the proposed 8T SRAM design an ideal candidate for the conventional and computationally intensive applications like machine learning classifier and deep learning neural network. In addition to this, there is need for next generation technologies to design SRAM memory because the conventional CMOS technology is approaching its physical and performance boundaries and as a consequence, becoming incompatible with ultra-low-power applications. Emerging devices such as Tunnel Field Effect Transistor (TFET)) and Graphene Nanoribbon Field Effect Transistor (GNRFET) devices are highly potential candidates to overcome the limitations of MOSFET because of their ability to achieve subthreshold slopes below 60 mV/decade and very low leakage currents [6]-[9]. This research also explores novel TFET and GNRFET based 6T SRAM. The thesis evaluates the standby leakage power in the Tunnel FET (TFET) based 6T SRAM cell for different pull-up, pull-down, and pass-gate transistors ratios (PU: PD: PG) and compared to 10nm FinFET based 6T SRAM designs. It is observed that the 10nm TFET based SRAMs have 107.57%, 163.64%, and 140.44% less standby leakage power compared to the 10nm FinFET based SRAMs when the PU: PD: PG ratios are 1:1:1, 1:5:2 and 2:5:2, respectively. The thesis also presents an analysis of the stability and reliability of sub-10nm TFET based 6T SRAM circuit with a reduced supply voltage of 500mV. The static noise margin (SNM), which is a critical measure of SRAM stability and reliability, is determined for hold, read and write operations of the 6T TFET SRAM cell. The robustness of the optimized TFET based 6T SRAM circuit is also evaluated at different supply voltages. Simulations were done in HSPICE and Cadence tools. From the analysis, it is clear that the main advantage of the TFET based SRAM would be the significant improvement in terms of leakage or standby power consumption. Compared to the FinFET based SRAM the standby leakage power of the T-SRAMs are 107.57%, 163.64%, and 140.44% less for 1:1:1, 1:5:2 and 2:5:2 configurations, respectively. Since leakage/standby power is the primary source of power consumption in the SRAM, and the overall system energy efficiency depends on SRAM power consumption, TFET based SRAM would lead to massive improvement of the energy efficiency of the system. Therefore, T-SRAMs are more suitable for ultra-low power applications. In addition to this, the thesis evaluates the standby leakage power of types of Graphene Nanoribbon FETs based 6T SRAM bitcell and compared to 10nm FinFET based 6T SRAM bitcell. It is observed that the 10nm MOS type GNRFET based SRAMs have 16.43 times less standby leakage power compared to the 10nm FinFET based SRAMs. The double gate SB-GNRFET based SRAM consumes 1.35E+03 times less energy compared to the 10nm FinFET based SRAM during write. However, during read double gate SB-GNRFET based SRAM consume 15 times more energy than FinFET based SRAM. It is also observed that GNRFET based SRAMs are more stable and reliable than FinFET based SRAM.Introduction -- Background -- Novel High Performance Ultra Low Power SRAM Design -- Tunnel FET Based SRAM Design -- Graphene Nanoribbon FET Based SRAM Design -- Double-gate FDSOI Based SRAM Designs -- Novel CNTFET and MEMRISTOR Based Digital Designs -- Conclusio

Investigation of Multiple-valued Logic Technologies for Beyond-binary Era

Computing technologies are currently based on the binary logic/number system, which is dependent on the simple on and off switching mechanism of the prevailing transistors. With the exponential increase of data processing and storage needs, there is a strong push to move to a higher radix logic/number system that can eradicate or lessen many limitations of the binary system. Anticipated saturation of Moore’s law and the necessity to increase information density and processing speed in the future micro and nanoelectronic circuits and systems provide a strong background and motivation for the beyond-binary logic system. In this review article, different technologies for Multiple-valued-Logic (MVL) devices and the associated prospects and constraints are discussed. The feasibility of the MVL system in real-world applications rests on resolving two major challenges: (i) development of an efficient mathematical approach to implement the MVL logic using available technologies, and (ii) availability of effective synthesis techniques. This review of different technologies for the MVL system is intended to perform a comprehensive investigation of various MVL technologies and a comparative analysis of the feasible approaches to implement MVL devices, especially ternary logic

Multiple-valued logic: technology and circuit implementation

Title from PDF of title page, viewed March 1, 2023Dissertation advisors: Masud H. Chowdhury and Yugyung LeeVitaIncludes bibliographical references (pages 91-107)Dissertation (Ph.D.)--Department of Computer Science and Electrical Engineering. University of Missouri--Kansas City, 2021Computing technologies are currently based on the binary logic/number system, which is dependent on the simple on and off switching mechanism of the prevailing transistors. With the exponential increase of data processing and storage needs, there is a strong push to move to a higher radix logic/number system that can eradicate or lessen many limitations of the binary system. Anticipated saturation of Moore's law and the necessity to increase information density and processing speed in the future micro and nanoelectronic circuits and systems provide a strong background and motivation for the beyond-binary logic system. During this project, different technologies for Multiple-Valued-Logic (MVL) devices and the associated prospects and constraints are discussed. The feasibility of the MVL system in real-world applications rests on resolving two major challenges: (i) development of an efficient mathematical approach to implement the MVL logic using available technologies and (ii) availability of effective synthesis techniques. The main part of this project can be divided into two categories: (i) proposing different novel and efficient design for various logic and arithmetic circuits such as inverter, NAND, NOR, adder, multiplexer etc. (ii) proposing different fast and efficient design for various sequential and memory circuits. For the operation of the device, two of the very promising emerging technologies are used: Graphene Nanoribbon Field Effect Transistor (GNRFET) and Carbon Nano Tube Field Effect Transistor (CNTFET). A comparative analysis of the proposed designs and several state-of-the-art designs are also given in all the cases in terms of delay, total power, and power-delay-product (PDP). The simulation and analysis are performed using the H-SPICE tool with a GNRFET model available on the Nanohub website and CNTFET model available from Standford University website.Introduction -- Fundamentals and scope of multiple valued logic -- Technological aspect of multiple valued logic circuit -- Ternary logic gates using Graphene Nano Ribbon Field Effect Transistor (GNRFET) -- Ternary arithmetic circuits using Graphene Nano Ribbon Field Effect Transistor (GNRFET) -- Ternary sequential circuits using Graphene Nano Ribbon Field Effect Transistor (GNRFET) -- Ternary memory circuits using Carbon Nano Tube Field Effect Transistor (CNTFET) -- Conclusions & future wor

A Novel Ultra Low-Power 10T CNFET-Based Full Adder Cell Design in 32nm Technology

Nowadays, energy consumption is the main concern in portable electronic systems such as laptops, smart mobile phones, personal digital assistances (PDAs) and so forth. Considering that the 1-bit Full adder cell has been the determinant circuit due to its wide usage in these systems, it affects the entire performance of the electronic system. In this paper, a novel low-power and low-energy 10 transistor (10T) Full Adder cell using NAND/NOR functions based on carbon nanotube field effect transistors (CNFETs) is presented. The proposed cell showed superiority in terms of power-delay product (PDP) compared to the other cells under different simulation condition, such as power supply, temperature, load and operating frequency variations. Moreover, a Monte Carlo (MC) simulation was conducted to study the reliability of the proposed cell against manufacturing process variations (i.e. the variations of diameters of carbon nanotubes). Simulations confirmed the robustness of the proposed cell

Multiple bit error correcting architectures over finite fields

This thesis proposes techniques to mitigate multiple bit errors in GF arithmetic circuits. As GF arithmetic circuits such as multipliers constitute the complex and important functional unit of a crypto-processor, making them fault tolerant will improve the reliability of circuits that are employed in safety applications and the errors may cause catastrophe if not mitigated. Firstly, a thorough literature review has been carried out. The merits of efficient schemes are carefully analyzed to study the space for improvement in error correction, area and power consumption. Proposed error correction schemes include bit parallel ones using optimized BCH codes that are useful in applications where power and area are not prime concerns. The scheme is also extended to dynamically correcting scheme to reduce decoder delay. Other method that suits low power and area applications such as RFIDs and smart cards using cross parity codes is also proposed. The experimental evaluation shows that the proposed techniques can mitigate single and multiple bit errors with wider error coverage compared to existing methods with lesser area and power consumption. The proposed scheme is used to mask the errors appearing at the output of the circuit irrespective of their cause. This thesis also investigates the error mitigation schemes in emerging technologies (QCA, CNTFET) to compare area, power and delay with existing CMOS equivalent. Though the proposed novel multiple error correcting techniques can not ensure 100% error mitigation, inclusion of these techniques to actual design can improve the reliability of the circuits or increase the difficulty in hacking crypto-devices. Proposed schemes can also be extended to non GF digital circuits

Circuit-level modelling and simulation of carbon nanotube devices

The growing academic interest in carbon nanotubes (CNTs) as a promising novel class of electronic materials has led to significant progress in the understanding of CNT physics including ballistic and non-ballistic electron transport characteristics. Together with the increasing amount of theoretical analysis and experimental studies into the properties of CNT transistors, the need for corresponding modelling techniques has also grown rapidly. This research is focused on the electron transport characteristics of CNT transistors, with the aim to develop efficient techniquesto model and simulate CNT devices for logic circuit analysis.The contributions of this research can be summarised as follows. Firstly, to accelerate the evaluation of the equations that model a CNT transistor, while maintaining high modelling accuracy, three efficient numerical techniques based on piece-wise linear, quadratic polynomial and cubic spline approximation have been developed. The numerical approximation simplifies the solution of the CNT transistor’s self-consistent voltage such that the calculation of the drain-source current is accelerated by at least two orders of magnitude. The numerical approach eliminates complicated calculations in the modelling process and facilitates the development of fast and efficient CNT transistor models for circuit simulation.Secondly, non-ballistic CNT transistors have been considered, and extended circuit-level models which can capture both ballistic and non-ballistic electron transport phenomena, including elastic scattering, phonon scattering, strain and tunnelling effects, have been developed. A salient feature of the developed models is their ability to incorporate both ballistic and non-ballistic transport mechanisms without a significant computational cost. The developed models have been extensively validated against reported transport theories of CNT transistors and experimental results.Thirdly, the proposed carbon nanotube transistor models have been implemented on several platforms. The underlying algorithms have been developed and tested in MATLAB, behaviourallevel models in VHDL-AMS, and improved circuit-level models have been implemented in two versions of the SPICE simulator. As the final contribution of this work, parameter variation analysis has been carried out in SPICE3 to study the performance of the proposed circuit-level CNT transistor models in logic circuit analysis. Typical circuits, including inverters and adders, have been analysed to determine the dependence of the circuit’s correct operation on CNT parameter variation

Electronic Nanodevices

The start of high-volume production of field-effect transistors with a feature size below 100 nm at the end of the 20th century signaled the transition from microelectronics to nanoelectronics. Since then, downscaling in the semiconductor industry has continued until the recent development of sub-10 nm technologies. The new phenomena and issues as well as the technological challenges of the fabrication and manipulation at the nanoscale have spurred an intense theoretical and experimental research activity. New device structures, operating principles, materials, and measurement techniques have emerged, and new approaches to electronic transport and device modeling have become necessary. Examples are the introduction of vertical MOSFETs in addition to the planar ones to enable the multi-gate approach as well as the development of new tunneling, high-electron mobility, and single-electron devices. The search for new materials such as nanowires, nanotubes, and 2D materials for the transistor channel, dielectrics, and interconnects has been part of the process. New electronic devices, often consisting of nanoscale heterojunctions, have been developed for light emission, transmission, and detection in optoelectronic and photonic systems, as well for new chemical, biological, and environmental sensors. This Special Issue focuses on the design, fabrication, modeling, and demonstration of nanodevices for electronic, optoelectronic, and sensing applications

Polarity Control at Runtime:from Circuit Concept to Device Fabrication

Semiconductor device research for digital circuit design is currently facing increasing challenges to enhance miniaturization and performance. A huge economic push and the interest in novel applications are stimulating the development of new pathways to overcome physical limitations affecting conventional CMOS technology. Here, we propose a novel Schottky barrier device concept based on electrostatic polarity control. Specifically, this device can behave as p- or n-type by simply changing an electric input bias. This device combines More-than-Moore and Beyond CMOS elements to create an efficient technology with a viable path to Very Large Scale Integration (VLSI). This thesis proposes a device/circuit/architecture co-optimization methodology, where aspects of device technology to logic circuit and system design are considered. At device level, a full CMOS compatible fabrication process is presented. In particular, devices are demonstrated using vertically stacked, top-down fabricated silicon nanowires with gate-all-around electrode geometry. Source and drain contacts are implemented using nickel silicide to provide quasi-symmetric conduction of either electrons or holes, depending on the mode of operation. Electrical measurements confirm excellent performance, showing Ion/Ioff > 10^7 and subthreshold slopes approaching the thermal limit, SS ~ 60mV/dec (~ 63mV/dec) for n(p)-type operation in the same physical device. Moreover, the shown devices behave as p-type for a polarization bias (polarity gate voltage, Vpg) of 0V, and n-type for a Vpg = 1V, confirming their compatibility with multi-level static logic circuit design. At logic gate level, two- and four-transistor logic gates are fabricated and tested. In particular, the first fully functional, two-transistor XOR logic gate is demonstrated through electrical characterization, confirming that polarity control can enable more compact logic gate design with respect to conventional CMOS. Furthermore, we show for the first time fabricated four- transistors logic gates that can be reconfigured as NAND or XOR only depending on their external connectivity. In this case, logic gates with full swing output range are experimentally demonstrated. Finally, single device and mixed-mode TCAD simulation results show that lower Vth and more optimized polarization ranges can be expected in scaled devices implementing strain or high-k technologies. At circuit and system level, a full semi-custom logic circuit design tool flow was defined and configured. Using this flow, novel logic libraries based on standard cells or regular gate fabrics were compared with standard CMOS. In this respect, results were shown in comparison to CMOS, including a 40% normalized area-delay product reduction for the analyzed standard cell libraries, and improvements of over 2× in terms of normalized delay for regular Controlled Polarity (CP)-based cells in the context of Structured ASICs. These results, in turn, confirm the interest in further developing and optimizing CP devices, as promising candidates for future digital circuit technology