Mixed-Domain Fast Simulation of RF and Microwave MEMS-based Complex Networks within Standard IC Development Frameworks

MS technology (MicroElectroMechanical-System) has been successfully employed since a few decades in the sensors/actuators field. Several products available on the market nowadays include MEMS-based accelerometers and gyroscopes, pressure sensors and micro-mirrors matrices. Beside such well-established exploitation of MEMS technology, its use within RF (Radio Frequency) blocks and systems/sub-systems has been attracting, in recent years, the interest of the Scientific Community for the significant RF performances boosting that MEMS devices can enable. Several significant demonstrators of entirely MEMS-based lumped components, like variable capacitors (Hyung et al., 2008), inductors (Zine-El-Abidine et al., 2003) and micro-switches (Goldsmith et al., 1998), are reported in literature, exhibiting remarkable performance in terms of large tuning-range, very high Q-Factor and low-loss, if compared with the currently used components implemented in standard semiconductor technology (Etxeberria & Gracia, 2007, Rebeiz & Muldavin, 1999). Starting from the just mentioned basic lumped components, it is possible to synthesize entire functional sub-blocks for RF applications in MEMS technology. Also in this case, highly significant demonstrators are reported and discussed in literature concerning, for example, tuneable phase shifters (Topalli et al., 2008), switching matrices (Daneshmand & Mansour, 2007), reconfigurable impedance matching networks (Larcher et al., 2009) and power attenuators (Iannacci et al., 2009, a). In all the just listed cases, the good characteristics of RF-MEMS devices lead, on one side, to very highperformance networks and, on the other hand, to enabling a large reconfigurability of the entire RF/Microwave systems employing MEMS sub-blocks. In particular, the latter feature addresses two important points, namely, the reduction of hardware redundancy, being for instance the same Power Amplifier within a mobile phone suitable both in transmission (Tx) and reception (Rx) (De Los Santos, 2002), and the usability of the same RF apparatus in compliance with different communication standards (like GSM, UMTS, WLAN and so on) (Varadan, 2003). Beside the exploitation of MEMS technology within RF transceivers, other potentially successful uses of Microsystems are in the Microwave field, concerning, e.g., very compact switching units, especially appealing to satellite applications for the very reduced weight (Chung et al., 2007), and phase shifters in order to electronically steer short and mid-range radar systems for the homeland security and monitoring applications (Maciel et al., 2007). Given all the examples reported above, it is straightforward that the employment of a proper strategy in aiming at the RF-MEMS devices/networks optimum design is a key-issue in order to gain the best benefits, in terms of performance, that such technology enables to address. This is not an easy task as the behaviour of RF-MEMS transversally crosses different physical domains, namely, electrical, mechanical and electromagnetic, leading to a large number of trade-offs between mechanical and electrical/electromagnetic parameters, that typically cannot be managed within a unique commercial simulation tool. In this chapter, a complete approach for the fast simulation of single RF-MEMS devices as well as of complex networks is presented and discussed in details. The proposed method is based on a MEMS compact model library, previously developed by the author, within a commercial simulation environment for ICs (integrated circuits). Such software tool describes the electromechanical mixed-domain behaviour typical of MEMS devices. Moreover, through the chapter, the electromagnetic characteristics of RF-MEMS will be also addressed by means of extracted lumped element networks, enabling the whole electromechanical and electromagnetic design optimization of the RF-MEMS device or network of interest. In particular, significant examples about how to acc..

Reconfigurable RF Front End Components for Multi-Radio Platform Applications

The multi-service requirements of the 3G and 4G communication systems, and their backward compatibility requirements, create challenges for the antenna and RF front-end designs with multi-band and wide-band techniques. These challenges include: multiple filters, which are lossy, bulky, and expensive, are needed in the system; device board size limitation and the associated isolation problems caused by the limited space and crowd circuits; and the insertion loss issues created by the single-pole-multi-through antenna switch. As will be shown, reconfigurable antennas can perform portions of the filter functions, which can help solve the multiple filters problem. Additionally, reconfigurable RF circuits can decrease the circuit size and output ports, which can help solve board size limitation, and isolation and antenna switch insertion loss issues. To validate the idea that reconfigurable antennas and reconfigurable RF circuits are a viable option for multi-service communication system, a reconfigurable patch antenna, a reconfigurable monopole antenna, and a reconfigurable power amplifier (PA) have been developed. All designs adapt state-of-the-art techniques. For the reconfigurable antenna designs, an experiment demonstrating its advantages, such as jamming signal resistance, has been performed. Reconfigurable antennas provide a better out-ofoperating- band noise performance than the multi-band antennas design, decreasing the need for filters in the system. A full investigation of reconfigurable antennas, including the single service reconfigurable antenna, the mixed signal service reconfigurable antenna, and the multi-band reconfigurable antenna, has been completed. The design challenges, which include switches investigation, switches integration, and service grouping techniques, have been discussed. In the reconfigurable PA portion, a reconfigurable PA structure has first been demonstrated, and includes a reconfigurable output matching network (MN) and a reconfigurable die design. To validate the proposed reconfigurable PA structure, a reconfigurable PA for a 3G cell phone system has been designed with a multi-chip module technique. The reconfigurable PA structure can significantly decrease the real-estate, cost, and complexity of the PA design. Further, by decreasing the number of output ports, the number of poles for the antenna switch will be decreased as well, leading to an insertion loss decrease

Towards a Universal Multi-Standard RF Receiver

Future wireless communication market calls for the need of an extreme compact wireless device that can easily access to all the available services at any time and at any location with minimum power consumption and cost. The key is to find a multi-standard wireless receiver that can cover all the service specifications while keeping redundant components to minimum. Reconfigurable concept is right fit the need. In this thesis, a fully integrated universal multi-standard receiver using low-cost CMOS technology has been proposed based on the survey for different wireless receiver specifications and optimum architectures. Tunable receiver building blocks such as filters, LNAs, Mixers, VCOs, gain blocks are the main factor to approach this novel receiver. In order to realize frequency agility, low cost as well as low power consumption, a good switch is a must. In this thesis, MEMS switches are preferred rather than active switches or active tuning elements based on their performance comparisons. In the feasibility study, as an example, first, a reconfigurable LNA and a reconfigurable oscillator using hard wires as switches have been developed, and then a LNA and an oscillator have been designed using a MEMS switch. The effect of hard-wire connection and MEMS to the circuits has been evaluated. No performance degradation has been found when using hard-wire connections, while some has been observed when using MEMS. However, MEMS could be integrated with other circuits on the same die if it could be built on low resistive silicon substrate without performance degradation

Design and simulation of zipping variable capacitors

Variable capacitors are essential for building tunable RF systems. We present here the design and simulation of novel zipping variable capacitors with a high permittivity dielectric layer. Two modelling techniques are presented: finite element simulation and variational analysis. A capacitance ratio greater than 40 can be obtained for a 100µm x 25µm device which has a high permittivity dielectric layer (εr = 200). By shaping either the top electrode beam or the bottom electrode, continuously variable capacitance is achieved at low bias voltages

A Reconfigurable Impedance Matching Network Employing RF-MEMS Switches

We propose the design of a reconfigurable impedance matching network for the lower RF frequency band, based on a developed RF-MEMS technology. The circuit is composed of RF-MEMS ohmic relays, metal-insulator-metal (MIM) capacitors and suspended spiral inductors, all integrated on a high resistivity Silicon substrate. The presented circuit is well-suited for all applications requiring adaptive impedance matching between two in principle unknown cascaded RF-circuits. The fabrication and testing of a monolithic integrated prototype in RF-MEMS technology from ITC-irst is currently underway.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Design of a 4.2-5.4 GHz differential LC VCO using 0.35 mu m SiGeBiCMOS technology for IEEE 802.11a applications

In this paper, a 4.2-5.4 GHz, -Gm LC voltage controlled oscillator (VCO) for IEEE 802.11a standard is presented. The circuit is designed with AMS 0.35 mu m SiGe BiCMOS process that includes high-speed SiGe Heterojunction Bipolar Transistors (HBTs). According to post-layout simulation results, phase noise is -110.7 dBc/Hz at 1 MHz offset from 5.4 GHz carrier frequency and -113.4 dBc/Hz from 4.2 GHz carrier frequency. A linear, 1200 MHz tuning range is obtained from the simulations, utilizing accumulation-mode varactors. Phase noise was also found to be relatively low because of taking advantage of differential tuning concept. Output power of the fundamental frequency changes between 4.8 dBm and 5.5 dBm depending on the tuning voltage. Based on the simulation results, the circuit draws 2 mA without buffers and 14.5 mA from 2.5 V supply including buffer circuits leading to a total power dissipation of 36.25 mW. The circuit layout occupies an area of 0.6 mm(2) on Si substrate, including DC and RF pads