Science and Applications Space Platform (SASP) End-to-End Data System Study

The capability of present technology and the Tracking and Data Relay Satellite System (TDRSS) to accommodate Science and Applications Space Platforms (SASP) payload user's requirements, maximum service to the user through optimization of the SASP Onboard Command and Data Management System, and the ability and availability of new technology to accommodate the evolution of SASP payloads were assessed. Key technology items identified to accommodate payloads on a SASP were onboard storage devices, multiplexers, and onboard data processors. The primary driver is the limited access to TDRSS for single access channels due to sharing with all the low Earth orbit spacecraft plus shuttle. Advantages of onboard data processing include long term storage of processed data until TRDSS is accessible, thus reducing the loss of data, eliminating large data processing tasks at the ground stations, and providing a more timely access to the data

Design of a fault tolerant airborne digital computer. Volume 2: Computational requirements and technology

This final report summarizes the work on the design of a fault tolerant digital computer for aircraft. Volume 2 is composed of two parts. Part 1 is concerned with the computational requirements associated with an advanced commercial aircraft. Part 2 reviews the technology that will be available for the implementation of the computer in the 1975-1985 period. With regard to the computation task 26 computations have been categorized according to computational load, memory requirements, criticality, permitted down-time, and the need to save data in order to effect a roll-back. The technology part stresses the impact of large scale integration (LSI) on the realization of logic and memory. Also considered was module interconnection possibilities so as to minimize fault propagation

Satellite on-board processing for earth resources data

Results of a survey of earth resources user applications and their data requirements, earth resources multispectral scanner sensor technology, and preprocessing algorithms for correcting the sensor outputs and for data bulk reduction are presented along with a candidate data format. Computational requirements required to implement the data analysis algorithms are included along with a review of computer architectures and organizations. Computer architectures capable of handling the algorithm computational requirements are suggested and the environmental effects of an on-board processor discussed. By relating performance parameters to the system requirements of each of the user requirements the feasibility of on-board processing is determined for each user. A tradeoff analysis is performed to determine the sensitivity of results to each of the system parameters. Significant results and conclusions are discussed, and recommendations are presented

Hydrogel patterns in microfluidic devices by do-it-yourself UV-photolithography suitable for very large-scale integration

The interest in large-scale integrated (LSI) microfluidic systems that perform highthroughput biological and chemical laboratory investigations on a single chip is steadily growing. Such highly integrated Labs-on-a-Chip (LoC) provide fast analysis, high functionality, outstanding reproducibility at low cost per sample, and small demand of reagents. One LoC platform technology capable of LSI relies on specific intrinsically active polymers, the so-called stimuli-responsive hydrogels. Analogous to microelectronics, the active components of the chips can be realized by photolithographic micro-patterning of functional layers. The miniaturization potential and the integration degree of the microfluidic circuits depend on the capability of the photolithographic process to pattern hydrogel layers with high resolution, and they typically require expensive cleanroom equipment. Here, we propose, compare, and discuss a cost-efficient do-it-yourself (DIY) photolithographic set-up suitable to micro-pattern hydrogel-layers with a resolution as needed for very large-scale integrated (VLSI) microfluidics. The achievable structure dimensions are in the lower micrometer scale, down to a feature size of 20 µm with aspect ratios of 1:5 and maximum integration densities of 20,000 hydrogel patterns per cm. Furthermore, we demonstrate the effects of miniaturization on the efficiency of a hydrogel-based microreactor system by increasing the surface area to volume (SA:V) ratio of integrated bioactive hydrogels. We then determine and discuss a correlation between ultraviolet (UV) exposure time, cross-linking density of polymers, and the degree of immobilization of bioactive components. © 2020 by the authors

Application of advanced technology to space automation

Automated operations in space provide the key to optimized mission design and data acquisition at minimum cost for the future. The results of this study strongly accentuate this statement and should provide further incentive for immediate development of specific automtion technology as defined herein. Essential automation technology requirements were identified for future programs. The study was undertaken to address the future role of automation in the space program, the potential benefits to be derived, and the technology efforts that should be directed toward obtaining these benefits

Space electronics technology summary

An overview is given of current electronics R and D activities, potential future thrusts, and related NASA payoffs. Major increases in NASA mission return and significant concurrent reductions in mission cost appear possible through a focused, long range electronics technology program. The overview covers: guidance assessments, navigation and control, and sensing and data acquisition processing, storage, and transfer

Investigations carried out under the Director's Discretionary Fund

This annual report comprises a set of summaries, describing task objectives, progress and results or accomplishments, future outlook, and financial status for each director's discretionary fund (DDF) task that was active during fiscal year 1984. Publications and conference presentations related to the work are listed. The individual reports are categorized as interim or final according to whether the task efforts are ongoing or completed. A partial list of new tasks to be initiated with fiscal year 1985 funds and a glossary of abbreviations and acronyms, used by the task authors in their summaries are included. The table of contents lists the DDF reports in sequence by their task number, which is derived from the 13-digit code assigned to account for the fund awarded to the task project

Development of an image converter of radical design

A long term investigation of thin film sensors, monolithic photo-field effect transistors, and epitaxially diffused phototransistors and photodiodes to meet requirements to produce acceptable all solid state, electronically scanned imaging system, led to the production of an advanced engineering model camera which employs a 200,000 element phototransistor array (organized in a matrix of 400 rows by 500 columns) to secure resolution comparable to commercial television. The full investigation is described for the period July 1962 through July 1972, and covers the following broad topics in detail: (1) sensor monoliths; (2) fabrication technology; (3) functional theory; (4) system methodology; and (5) deployment profile. A summary of the work and conclusions are given, along with extensive schematic diagrams of the final solid state imaging system product

Feasibility study for a numerical aerodynamic simulation facility. Volume 1

A Numerical Aerodynamic Simulation Facility (NASF) was designed for the simulation of fluid flow around three-dimensional bodies, both in wind tunnel environments and in free space. The application of numerical simulation to this field of endeavor promised to yield economies in aerodynamic and aircraft body designs. A model for a NASF/FMP (Flow Model Processor) ensemble using a possible approach to meeting NASF goals is presented. The computer hardware and software are presented, along with the entire design and performance analysis and evaluation

Wafer-scale integration of semiconductor memory.

This work is directed towards a study of full-slice or "wafer-scale integrated" - semiconductor memory. Previous approaches to full slice technology are studied and critically compared. It is shown that a fault-tolerant, fixed-interconnection approach offers many advantages; such a technique forms the basis of the experimental work. The disadvantages of the conventional technology are reviewed to illustrate the potential improvements in cost, packing density and reliability obtainable with wafer-scale integration (W.S.l). Iterative chip arrays are modelled by a pseudorandom fault distribution; algorithms to control the linking of adjacent good - chips into linear chains are proposed and investigated by computer simulation. It is demonstrated that long chains may be produced at practicable yield levels. The on-chip control circuitry and the external control electronics required to implement one particular algorithm are described in relation to a TTL simulation of an array of 4 X 4 integrated circuit chips. A layout of the on-chip control logic is shown to require (in 40 dynamic MOS circuitry) an area equivalent to ~250 shift register stages -a reasonable overhead on large memories. Structures are proposed to extend the fixed-interconnection, fault-tolerant concept to parallel/serial organised memory - covering RAM, ROM and Associative Memory applications requiring up to~ 2M bits of storage. Potential problem areas in implementing W.S.I are discussed and it is concluded that current technology is capable of manufacturing such devices. A detailed cost comparison of the conventional and W.S.I approaches to large serial memories illustrates the potential savings available with wafer-scale integration. The problem of gaining industrial acceptance for W.S.I is discussed in relation to known and anticipated views- of new technology. The thesis concludes with suggestions for further work in the general field of wafer-scale integration