Design and Analysis of an Adjacent Multi-bit Error Correcting Code for Nanoscale SRAMs

Increasing static random access memory (SRAM) bitcell density is a major driving force for semiconductor technology scaling. The industry standard 2x reduction in SRAM bitcell area per technology node has lead to a proliferation in memory intensive applications as greater memory system capacity can be realized per unit area. Coupled with this increasing capacity is an increasing SRAM system-level soft error rate (SER). Soft errors, caused by galactic radiation and radioactive chip packaging material corrupt a bitcell’s data-state and are a potential cause of catastrophic system failures. Further, reductions in device geometries, design rules, and sensitive node capacitances increase the probability of multiple adjacent bitcells being upset per particle strike to over 30% of the total SER below the 45 nm process node. Traditionally, these upsets have been addressed using a simple error correction code (ECC) combined with word interleaving. With continued scaling however, errors beyond this setup begin to emerge. Although more powerful ECCs exist, they come at an increased overhead in terms of area and latency. Additionally, interleaving adds complexity to the system and may not always be feasible for the given architecture. In this thesis, a new class of ECC targeted toward adjacent multi-bit upsets (MBU) is proposed and analyzed. These codes present a tradeoff between the currently popular single error correcting-double error detecting (SEC-DED) ECCs used in SRAMs (that are unable to correct MBUs), and the more robust multi-bit ECC schemes used for MBU reliability. The proposed codes are evaluated and compared against other ECCs using a custom test suite and multi-bit error channel model developed in Matlab as well as Verilog hardware description language (HDL) implementations synthesized using Synopsys Design Compiler and a commercial 65 nm bulk CMOS standard cell library. Simulation results show that for the same check-bit overhead as a conventional 64 data-bit SEC-DED code, the proposed scheme provides a corrected-SER approximately equal to the Bose-Chaudhuri- Hocquenghem (BCH) double error correcting (DEC) code, and a 4.38x improvement over the SEC-DED code in the same error channel. While, for 3 additional check-bits (still 3 less than the BCH DEC code), a triple adjacent error correcting version of the proposed code provides a 2.35x improvement in corrected-SER over the BCH DEC code for 90.9% less ECC circuit area and 17.4% less error correction delay. For further verification, a 0.4-1.0 V 75 kb single-cycle SRAM macro protected with a programmable, up-to-3-adjacent-bit-correcting version of the proposed ECC has been fab- ricated in a commercial 28 nm bulk CMOS process. The SRAM macro has undergone neu- tron irradiation testing at the TRIUMF Neutron Irradiation Facility in Vancouver, Canada. Measurements results show a 189x improvement in SER over an unprotected memory with no ECC enabled and a 5x improvement over a traditional single-error-correction (SEC) code at 0.5 V using 1-way interleaving for the same number of check-bits. This is compa- rable with the 4.38x improvement observed in simulation. Measurement results confirm an average active energy of 0.015 fJ/bit at 0.4 V, and average 80 mV reduction in VDDMIN across eight packaged chips by enabling the ECC. Both the SRAM macro and ECC circuit were designed for dynamic voltage and frequency scaling for both nominal and low voltage applications using a full-custom circuit design flow

Cross-layer Soft Error Analysis and Mitigation at Nanoscale Technologies

This thesis addresses the challenge of soft error modeling and mitigation in nansoscale technology nodes and pushes the state-of-the-art forward by proposing novel modeling, analyze and mitigation techniques. The proposed soft error sensitivity analysis platform accurately models both error generation and propagation starting from a technology dependent device level simulations all the way to workload dependent application level analysis

Improving Error Correction Codes for Multiple-Cell Upsets in Space Applications

© 2018 IEEE. Personal use of this material is permitted. Permissíon from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertisíng or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.[EN] Currently, faults suffered by SRAM memory systems have increased due to the aggressive CMOS integration density. Thus, the probability of occurrence of single-cell upsets (SCUs) or multiple-cell upsets (MCUs) augments. One of the main causes of MCUs in space applications is cosmic radiation. A common solution is the use of error correction codes (ECCs). Nevertheless, when using ECCs in space applications, they must achieve a good balance between error coverage and redundancy, and their encoding/decoding circuits must be efficient in terms of area, power, and delay. Different codes have been proposed to tolerate MCUs. For instance, Matrix codes use Hamming codes and parity checks in a bi-dimensional layout to correct and detect some patterns of MCUs. Recently presented, column¿line¿code (CLC) has been designed to tolerate MCUs in space applications. CLC is a modified Matrix code, based on extended Hamming codes and parity checks. Nevertheless, a common property of these codes is the high redundancy introduced. In this paper, we present a series of new lowredundant ECCs able to correct MCUs with reduced area, power, and delay overheads. Also, these new codes maintain, or even improve, memory error coverage with respect to Matrix and CLC codes.This work was supported by the Spanish Government under the research Project TIN2016-81075-R.Gracia-Morán, J.; Saiz-Adalid, L.; Gil Tomás, DA.; Gil, P. (2018). Improving Error Correction Codes for Multiple-Cell Upsets in Space Applications. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 26(10):2132-2142. https://doi.org/10.1109/TVLSI.2018.2837220S21322142261

Two-Layer Error Control Codes Combining Rectangular and Hamming Product Codes for Cache Error

We propose a novel two-layer error control code, combining error detection capability of rectangular codes and error correction capability of Hamming product codes in an efficient way, in order to increase cache error resilience for many core systems, while maintaining low power, area and latency overhead. Based on the fact of low latency and overhead of rectangular codes and high error control capability of Hamming product codes, two-layer error control codes employ simple rectangular codes for each cache line to detect cache errors, while loading the extra Hamming product code checks bits in the case of error detection; thus enabling reliable large-scale cache operations. Analysis and experiments are conducted to evaluate the cache fault-tolerant capability of various existing solutions and the proposed approach. The results show that the proposed approach can significantly increase Mean-Error-To-Failure (METF) and Mean-Time-To-failure (MTTF) up to 2.8×, reduce storage overhead by over 57%, and increase instruction per-cycle (IPC) up to 7%, compared to complex four-way 4EC5ED; and it increases METF and MTTF up to 133×, reduces storage overhead by over 11%, and achieves a similar IPC compared to simple eight-way single-error correcting double-error detecting (SECDED). The cost of the proposed approach is no more than 4% external memory access overhead

Ultrafast Codes for Multiple Adjacent Error Correction and Double Error Detection

(c) 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.[EN] Reliable computer systems employ error control codes (ECCs) to protect information from errors. For example, memories are frequently protected using single error correction-double error detection (SEC-DED) codes. ECCs are traditionally designed to minimize the number of redundant bits, as they are added to each word in the whole memory. Nevertheless, using an ECC introduces encoding and decoding latencies, silicon area usage and power consumption. In other computer units, these parameters should be optimized, and redundancy would be less important. For example, protecting registers against errors remains a major concern for deep sub-micron systems due to technology scaling. In this case, an important requirement for register protection is to keep encoding and decoding latencies as short as possible. Ultrafast error control codes achieve very low delays, independently of the word length, increasing the redundancy. This paper summarizes previous works on Ultrafast codes (SEC and SEC-DED), and proposes new codes combining double error detection and adjacent error correction. We have implemented, synthesized and compared different Ultrafast codes with other state-of-the-art fast codes. The results show the validity of the approach, achieving low latencies and a good balance with silicon area and power consumption.This work was supported in part by the Spanish Government under Project TIN2016-81075-R, and in part by the Primeros Proyectos de Investigacion, Vicerrectorado de Investigacion, Innovacion y Transferencia de la Universitat Politecnica de Valencia (UPV), Valencia, Spain, under Project PAID-06-18 20190032.Saiz-Adalid, L.; Gracia-Morán, J.; Gil Tomás, DA.; Baraza Calvo, JC.; Gil, P. (2019). Ultrafast Codes for Multiple Adjacent Error Correction and Double Error Detection. IEEE Access. 7:151131-151143. https://doi.org/10.1109/ACCESS.2019.2947315S151131151143

Modeling and Mitigation of Soft Errors in Nanoscale SRAMs

Energetic particle (alpha particle, cosmic neutron, etc.) induced single event data upset or soft error has emerged as a key reliability concern in SRAMs in sub-100 nanometre technologies. Low operating voltage, small node capacitance, high packing density, and lack of error masking mechanisms are primarily responsible for the soft error susceptibility of SRAMs. In addition, since SRAM occupies the majority of die area in system-on-chips (SoCs) and microprocessors, different leakage reduction techniques, such as, supply voltage reduction, gated grounding, etc., are applied to SRAMs in order to limit the overall chip leakage. These leakage reduction techniques exponentially increase the soft error rate in SRAMs. The soft error rate is further accentuated by process variations, which are prominent in scaled-down technologies. In this research, we address these concerns and propose techniques to characterize and mitigate soft errors in nanoscale SRAMs. We develop a comprehensive analytical model of the critical charge, which is a key to assessing the soft error susceptibility of SRAMs. The model is based on the dynamic behaviour of the cell and a simple decoupling technique for the non-linearly coupled storage nodes. The model describes the critical charge in terms of NMOS and PMOS transistor parameters, cell supply voltage, and noise current parameters. Consequently, it enables characterizing the spread of critical charge due to process induced variations in these parameters and to manufacturing defects, such as, resistive contacts or vias. In addition, the model can estimate the improvement in critical charge when MIM capacitors are added to the cell in order to improve the soft error robustness. The model is validated by SPICE simulations (90nm CMOS) and radiation test. The critical charge calculated by the model is in good agreement with SPICE simulations with a maximum discrepancy of less than 5%. The soft error rate estimated by the model for low voltage (sub 0.8 V) operations is within 10% of the soft error rate measured in the radiation test. Therefore, the model can serve as a reliable alternative to time consuming SPICE simulations for optimizing the critical charge and hence the soft error rate at the design stage. In order to limit the soft error rate further, we propose an area-efficient multiword based error correction code (MECC) scheme. The MECC scheme combines four 32 bit data words to form a composite 128 bit ECC word and uses an optimized 4-input transmission-gate XOR logic. Thus MECC significantly reduces the area overhead for check-bit storage and the delay penalty for error correction. In addition, MECC interleaves two composite words in a row for limiting cosmic neutron induced multi-bit errors. The ground potentials of the composite words are controlled to minimize leakage power without compromising the read data stability. However, use of composite words involves a unique write operation where one data word is written while other three data words are read to update the check-bits. A power efficient word line signaling technique is developed to facilitate the write operation. A 64 kb SRAM macro with MECC is designed and fabricated in a commercial 90nm CMOS technology. Measurement results show that the SRAM consumes 534 μW at 100 MHz with a data latency of 3.3 ns for a single bit error correction. This translates into 82% per-bit energy saving and 8x speed improvement over recently reported multiword ECC schemes. Accelerated neutron radiation test carried out at TRIUMF in Vancouver confirms that the proposed MECC scheme can correct up to 85% of soft errors

Design and Analysis of Robust Low Voltage Static Random Access Memories.

Static Random Access Memory (SRAM) is an indispensable part of most modern VLSI designs and dominates silicon area in many applications. In scaled technologies, maintaining high SRAM yield becomes more challenging since they are particularly vulnerable to process variations due to 1) the minimum sized devices used in SRAM bitcells and 2) the large array sizes. At the same time, low power design is a key focus throughout the semiconductor industry. Since low voltage operation is one of the most effective ways to reduce power consumption due to its quadratic relationship to energy savings, lowering the minimum operating voltage (Vmin) of SRAM has gained significant interest. This thesis presents four different approaches to design and analyze robust low voltage SRAM: SRAM analysis method improvement, SRAM bitcell development, SRAM peripheral optimization, and advance device selection. We first describe a novel yield estimation method for bit-interleaved voltage-scaled 8-T SRAMs. Instead of the traditional trade-off between write and read, the trade-off between write and half select disturb is analyzed. In addition, this analysis proposes a method to find an appropriate Write Word-Line (WWL) pulse width to maximize yield. Second, low leakage 10-T SRAM with speed compensation scheme is proposed. During sleep mode of a sensor application, SRAM retaining data cannot be shut down so it is important to minimize leakage in SRAM. This work adopts several leakage reduction techniques while compensating performance. Third, adaptive write architecture for low voltage 8-T SRAMs is proposed. By adaptively modulating WWL width and voltage level, it is possible to achieve low power consumption while maintaining high yield without excessive performance degradation. Finally, low power circuit design based on heterojunction tunneling transistors (HETTs) is discussed. HETTs have a steep subthreshold swing beneficial for low voltage operation. Device modeling and design of logic and SRAM are proposed.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91569/1/daeyeonk_1.pd

상변화 메모리 시스템의 간섭 오류 완화 및 RMW 성능 향상 기법

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2021.8. 이혁재.Phase-change memory (PCM) announces the beginning of the new era of memory systems, owing to attractive characteristics. Many memory product manufacturers (e.g., Intel, SK Hynix, and Samsung) are developing related products. PCM can be applied to various circumstances; it is not simply limited to an extra-scale database. For example, PCM has a low standby power due to its non-volatility; hence, computation-intensive applications or mobile applications (i.e., long memory idle time) are suitable to run on PCM-based computing systems. Despite these fascinating features of PCM, PCM is still far from the general commercial market due to low reliability and long latency problems. In particular, low reliability is a painful problem for PCM in past decades. As the semiconductor process technology rapidly scales down over the years, DRAM reaches 10 nm class process technology. In addition, it is reported that the write disturbance error (WDE) would be a serious issue for PCM if it scales down below 54 nm class process technology. Therefore, addressing the problem of WDEs becomes essential to make PCM competitive to DRAM. To overcome this problem, this dissertation proposes a novel approach that can restore meta-stable cells on demand by levering two-level SRAM-based tables, thereby significantly reducing the number WDEs. Furthermore, a novel randomized approach is proposed to implement a replacement policy that originally requires hundreds of read ports on SRAM. The second problem of PCM is a long-latency compared to that of DRAM. In particular, PCM tries to enhance its throughput by adopting a larger transaction unit; however, the different unit size from the general-purpose processor cache line further degrades the system performance due to the introduction of a read-modify-write (RMW) module. Since there has never been any research related to RMW in a PCM-based memory system, this dissertation proposes a novel architecture to enhance the overall system performance and reliability of a PCM-based memory system having an RMW module. The proposed architecture enhances data re-usability without introducing extra storage resources. Furthermore, a novel operation that merges commands regardless of command types is proposed to enhance performance notably. Another problem is the absence of a full simulation platform for PCM. While the announced features of the PCM-related product (i.e., Intel Optane) are scarce due to confidential issues, all priceless information can be integrated to develop an architecture simulator that resembles the available product. To this end, this dissertation tries to scrape up all available features of modules in a PCM controller and implement a dedicated simulator for future research purposes.상변화 메모리는(PCM) 매력적인 특성을 통해 메모리 시스템의 새로운 시대의 시작을 알렸다. 많은 메모리 관련 제품 제조업체(예 : 인텔, SK 하이닉스, 삼성)가 관련 제품 개발에 박차를 가하고 있다. PCM은 단순히 대규모 데이터베이스에만 국한되지 않고 다양한 상황에 적용될 수 있다. 예를 들어, PCM은 비휘발성으로 인해 대기 전력이 낮다. 따라서 계산 집약적인 애플리케이션 또는 모바일 애플리케이션은(즉, 긴 메모리 유휴 시간) PCM 기반 컴퓨팅 시스템에서 실행하기에 적합하다. PCM의 이러한 매력적인 특성에도 불구하고 PCM은 낮은 신뢰성과 긴 대기 시간으로 인해 여전히 일반 산업 시장에서는 DRAM과 다소 격차가 있다. 특히 낮은 신뢰성은 지난 수십 년 동안 PCM 기술의 발전을 저해하는 문제다. 반도체 공정 기술이 수년에 걸쳐 빠르게 축소됨에 따라 DRAM은 10nm 급 공정 기술에 도달하였다. 이어서, 쓰기 방해 오류 (WDE)가 54nm 등급 프로세스 기술 아래로 축소되면 PCM에 심각한 문제가 될 것으로 보고되었다. 따라서, WDE 문제를 해결하는 것은 PCM이 DRAM과 동등한 경쟁력을 갖추도록 하는 데 있어 필수적이다. 이 문제를 극복하기 위해 이 논문에서는 2-레벨 SRAM 기반 테이블을 활용하여 WDE 수를 크게 줄여 필요에 따라 준 안정 셀을 복원할 수 있는 새로운 접근 방식을 제안한다. 또한, 원래 SRAM에서 수백 개의 읽기 포트가 필요한 대체 정책을 구현하기 위해 새로운 랜덤 기반의 기법을 제안한다. PCM의 두 번째 문제는 DRAM에 비해 지연 시간이 길다는 것이다. 특히 PCM은 더 큰 트랜잭션 단위를 채택하여 단위시간 당 데이터 처리량 향상을 도모한다. 그러나 범용 프로세서 캐시 라인과 다른 유닛 크기는 읽기-수정-쓰기 (RMW) 모듈의 도입으로 인해 시스템 성능을 저하하게 된다. PCM 기반 메모리 시스템에서 RMW 관련 연구가 없었기 때문에 본 논문은 RMW 모듈을 탑재 한 PCM 기반 메모리 시스템의 전반적인 시스템 성능과 신뢰성을 향상하게 시킬 수 있는 새로운 아키텍처를 제안한다. 제안된 아키텍처는 추가 스토리지 리소스를 도입하지 않고도 데이터 재사용성을 향상시킨다. 또한, 성능 향상을 위해 명령 유형과 관계없이 명령을 병합하는 새로운 작업을 제안한다. 또 다른 문제는 PCM을 위한 완전한 시뮬레이션 플랫폼이 부재하다는 것이다. PCM 관련 제품(예 : Intel Optane)에 대해 발표된 정보는 대외비 문제로 인해 부족하다. 하지만 알려져 있는 정보를 적절히 취합하면 시중 제품과 유사한 아키텍처 시뮬레이터를 개발할 수 있다. 이를 위해 본 논문은 PCM 메모리 컨트롤러에 필요한 모든 모듈 정보를 활용하여 향후 이와 관련된 연구에서 충분히 사용 가능한 전용 시뮬레이터를 구현하였다.1 INTRODUCTION 1 1.1 Limitation of Traditional Main Memory Systems 1 1.2 Phase-Change Memory as Main Memory 3 1.2.1 Opportunities of PCM-based System 3 1.2.2 Challenges of PCM-based System 4 1.3 Dissertation Overview 7 2 BACKGROUND AND PREVIOUS WORK 8 2.1 Phase-Change Memory 8 2.2 Mitigation Schemes for Write Disturbance Errors 10 2.2.1 Write Disturbance Errors 10 2.2.2 Verification and Correction 12 2.2.3 Lazy Correction 13 2.2.4 Data Encoding-based Schemes 14 2.2.5 Sparse-Insertion Write Cache 16 2.3 Performance Enhancement for Read-Modify-Write 17 2.3.1 Traditional Read-Modify-Write 17 2.3.2 Write Coalescing for RMW 19 2.4 Architecture Simulators for PCM 21 2.4.1 NVMain 21 2.4.2 Ramulator 22 2.4.3 DRAMsim3 22 3 IN-MODULE DISTURBANCE BARRIER 24 3.1 Motivation 25 3.2 IMDB: In Module-Disturbance Barrier 29 3.2.1 Architectural Overview 29 3.2.2 Implementation of Data Structures 30 3.2.3 Modification of Media Controller 36 3.3 Replacement Policy 38 3.3.1 Replacement Policy for IMDB 38 3.3.2 Approximate Lowest Number Estimator 40 3.4 Putting All Together: Case Studies 43 3.5 Evaluation 45 3.5.1 Configuration 45 3.5.2 Architectural Exploration 47 3.5.3 Effectiveness of the Replacement Policy 48 3.5.4 Sensitivity to Main Table Configuration 49 3.5.5 Sensitivity to Barrier Buffer Size 51 3.5.6 Sensitivity to AppLE Group Size 52 3.5.7 Comparison with Other Studies 54 3.6 Discussion 59 3.7 Summary 63 4 INTEGRATION OF AN RMW MODULE IN A PCM-BASED SYSTEM 64 4.1 Motivation 65 4.2 Utilization of DRAM Cache for RMW 67 4.2.1 Architectural Design 67 4.2.2 Algorithm 70 4.3 Typeless Command Merging 73 4.3.1 Architectural Design 73 4.3.2 Algorithm 74 4.4 An Alternative Implementation: SRC-RMW 78 4.4.1 Implementation of SRC-RMW 78 4.4.2 Design Constraint 80 4.5 Case Study 82 4.6 Evaluation 85 4.6.1 Configuration 85 4.6.2 Speedup 88 4.6.3 Read Reliability 91 4.6.4 Energy Consumption: Selecting a Proper Page Size 93 4.6.5 Comparison with Other Studies 95 4.7 Discussion 97 4.8 Summary 99 5 AN ALL-INCLUSIVE SIMULATOR FOR A PCM CONTROLLER 100 5.1 Motivation 101 5.2 PCMCsim: PCM Controller Simulator 103 5.2.1 Architectural Overview 103 5.2.2 Underlying Classes of PCMCsim 104 5.2.3 Implementation of Contention Behavior 108 5.2.4 Modules of PCMCsim 109 5.3 Evaluation 116 5.3.1 Correctness of the Simulator 116 5.3.2 Comparison with Other Simulators 117 5.4 Summary 119 6 Conclusion 120 Abstract (In Korean) 141 Acknowledgment 143박